摘要:
The invention concerns an abrasive tool including an electroformed layer (8) having superabrasive grains (6) electroplated on an outer surface of the electroformed layer, and a plurality of dimples (12) arranged thereon, as well as a method of producing said tool by using a mold with projections made of gel adhesive. The concentration of the abrasive grains is regulated by changing the number of the dimples (i.e ., changing a dimple-area-rate). The gel adhesive preferably has a viscosity of 500,000 cP or smaller. The dimple-area-rate is preferably from 7 to 70%.
摘要:
A grinding wheel comprising abrasive grains, a bonding material for bonding the abrasive grains, and grain clusters of accumulated filler grains having a size smaller than the abrasive grains. The grinding wheel may be a vitrified grinding wheel, and in this case, chromium oxide having good affinity with the vitrified bonding material may be used as the filler grains.
摘要:
A grinding wheel comprising abrasive grains, a bonding material for bonding the abrasive grains, and grain clusters of accumulated filler grains having a size smaller than the abrasive grains. The grinding wheel may be a vitrified grinding wheel, and in this case, chromium oxide having good affinity with the vitrified bonding material may be used as the filler grains.
摘要:
The invention concerns an abrasive tool including an electroformed layer (8) having superabrasive grains (6) electroplated on an outer surface of the electroformed layer, and a plurality of dimples (12) arranged thereon, as well as a method of producing said tool by using a mold with projections made of gel adhesive. The concentration of the abrasive grains is regulated by changing the number of the dimples (i.e ., changing a dimple-area-rate). The gel adhesive preferably has a viscosity of 500,000 cP or smaller. The dimple-area-rate is preferably from 7 to 70%.
摘要:
A grinding wheel (G) for grinding a workpiece (W) has a first grinding surface (30) and a second grinding surface (31) successive thereto. The first and second grinding surfaces are parallel to and inclined with respect to the rotational axis (O s ) of the workpiece (W), respectively. A diameter of the workpiece (W) to be ground in a next grinding operation is measured in advance. An angle (ϑ) to be formed between the second grinding surface (31) and the rotational axis (O s ) of the workpiece (W) is selected based upon the measured diameter (d) of the workpiece (W). The selected angle (ϑ) is established between the second grinding surface (31) and the rotational axis (O s ) of the workpiece (W), in which situation. The grinding wheel (G) is moved relative to the workpiece (W) in a direction of the rotational axis (O s ) of the workpiece (W), whereby the cylindrical surface of the workpiece (W) is firstly ground by the second grinding surface (31) and subsequently ground by the first grinding surface (30) of the grinding wheel (G).