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    Cooling structure for multichip module
    3.
    发明公开
    Cooling structure for multichip module 有权
    Kühlstruktureines多芯片模块

    公开(公告)号：EP1111677A2

    公开(公告)日：2001-06-27

    申请号：EP00127971.0

    申请日：2000-12-20

    申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA

    发明人： Imai, Makoto ,  Ogawa, Naoki ,  Yagi, Yugi ,  Kojima, Takashi ,  Yamada, Yasushi

    IPC分类号： H01L25/07

    CPC分类号： H01L23/3672 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2924/1305 ,  H01L2924/13055 ,  Y10S257/93 ,  H01L2924/00

    摘要： A first electronic device (24), a second electronic device (26) which generates less heat than the first electric device (24), and an electrode are connected by a heat leveling plate (30) formed of an electrically conductive material having high thermal conductivity. A heat radiation plate (40) is provided below an insulated substrate (22) to which the first and second electronic devices (24, 26) are mounted. The second electronic device (26) is cooled by a heat radiation path which extends through the insulated substrate (22) and the heat radiation plate (40) and a heat radiation path which extends through the second electronic device (26) and the electrode to the heat radiation plate. The first and the second electronic devices (24, 26) have substantially the same temperature due to heat radiation through the heat leveling plate (30). As a result, cooling effect of the electronic devices (24, 26) can be enhanced.

    摘要翻译： 第一电子设备（24），产生比第一电气设备（24）少的热量的第二电子设备（26）和电极通过由具有高热导率的导电材料形成的热调平板（30）连接 电导率。 散热板（40）设置在安装有第一和第二电子设备（24,26）的绝缘基板（22）的下方。 第二电子设备（26）被延伸穿过绝缘基板（22）和散热板（40）的散热路径和延伸穿过第二电子设备（26）和电极的散热路径 散热板。 第一和第二电子设备（24,26）由于通过热调平板（30）的热辐射而具有基本相同的温度。 结果，可以提高电子设备（24,26）的冷却效果。