公开(公告)号：EP1459610A1

公开(公告)日：2004-09-22

申请号：EP02793728.3

申请日：2002-12-19

申请人： Telefonaktiebolaget LM Ericsson (publ)

发明人： FERM, Per ,  ÖHRN, Jan ,  WAHLEDOW, Fredrik ,  FALLGREN, Jan ,  OVESEN, Karsten ,  GUSTAFSSON, Lars ,  PERSSON, Markus ,  LUNDSTRÖM, Per

IPC分类号： H05K3/34 ,  H05K3/36 ,  H05K13/04 ,  H01R4/02

CPC分类号： H05K3/3405 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01R4/027 ,  H01R12/57 ,  H01R43/0263 ,  H05K3/305 ,  H05K3/3421 ,  H05K2201/1034

摘要： An electronic assembly and a method of manufacturing such an assembly in which a carrier (13) for electronic components (14) and leads (18) for external connection are connected with each other by interconnections (19) including solder joints (22). In order to sustain heating periods, at least one of said interconnections comprises an adhesive joint (23) in addition to the solder joint applied between the carrier and one lead.