公开(公告)号：EP2883430A1

公开(公告)日：2015-06-17

申请号：EP12882879.5

申请日：2012-08-10

申请人： Telefonaktiebolaget LM Ericsson (PUBL)

发明人： PEREZ-URIA, Igor ,  FERM, Per ,  GUSTAFSON, Benny

IPC分类号： H05K3/40

CPC分类号： H05K1/144 ,  H05K1/115 ,  H05K1/141 ,  H05K3/10 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3494 ,  H05K3/4015 ,  H05K3/4046 ,  H05K3/4053 ,  H05K3/42 ,  H05K2201/0248 ,  H05K2201/0305 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10878 ,  H05K2201/10916 ,  H05K2203/0338 ,  H05K2203/0455 ,  H05K2203/1105 ,  Y10T29/49124

摘要： The present invention relates to a printed circuit board arrangement (400) and a method for forming an electrical connection at a printed circuit board. The printed circuit board arrangement comprises a printed circuit board (410) having a first side (411), a second side (412) and an electrical connection (413) electrically connecting a first conductive layer and a second conductive layer (417) of the printed circuit board. The electrical connection (413) comprises a passage (416) extending from an opening in one of the sides of the printed circuit board through the printed circuit board between the first and second layers. Electrically conducting material (414) is formed on the walls (415) of the passage. The electrically conducting material forms a first path electrically connecting the first conductive layer (417) with the second conductive layer (417). At least one first ball 420 is enclosed by the passage. The at least one firstball is electrically conducting and has a diameter which is equal to or smaller than the length and diameter of the passage, wherein the at least one first ball (420) form part of a second electrical path between the first and second conductive layers of the printed circuit board, said second electrical path having a lower resistance than the first path.

公开(公告)号：EP3235113B1

公开(公告)日：2019-12-11

申请号：EP14830422.3

申请日：2014-12-18

申请人： Telefonaktiebolaget LM Ericsson (publ)

发明人： ANDERSSON, Mattias ,  ETSARE, Martin ,  FERM, Per ,  HOFFSTRÖM, Roger ,  PEREZ-URIA, Igor

IPC分类号： H02M1/12 ,  H02M1/44 ,  H05K1/18 ,  H05K1/14

公开(公告)号：EP2716142A1

公开(公告)日：2014-04-09

申请号：EP11729191.4

申请日：2011-06-01

申请人： Telefonaktiebolaget LM Ericsson (PUBL)

发明人： PEREZ-URIA, Igor ,  FERM, Per

IPC分类号： H05K1/02 ,  H05K3/40

CPC分类号： H05K1/0206 ,  H01F5/00 ,  H01L2224/16225 ,  H05K1/0207 ,  H05K3/4046 ,  H05K2201/086 ,  H05K2201/10295 ,  H05K2201/10303

摘要： The present invention relates to a thermo/electrical conductor arrangement for multilayer PCBs (120). Using vias for the transport of heat from the interior of the PCB (120) and for conducting high currents between the conducting layers (121-125) have limitations. Via platings are very thin and vias filled with solder is an unreliable method as there is always a risk that the vias are not properly filled during the soldering process. The present invention overcomes this by inserting a pin (112) of a current conductive material (such as copper) into the via (160) so that the pin (112) is brought into galvanic contact with the conducting layers (121-125) in the PCB (120) and where at least one end of the pin (112) is freely protruding from the PCB (120) thereby allowing the pin (112) to conduct heat from the interior of the PCB (120) to the protruding end of the pin (112) for external cooling.

公开(公告)号：EP1459610A1

公开(公告)日：2004-09-22

申请号：EP02793728.3

申请日：2002-12-19

申请人： Telefonaktiebolaget LM Ericsson (publ)

发明人： FERM, Per ,  ÖHRN, Jan ,  WAHLEDOW, Fredrik ,  FALLGREN, Jan ,  OVESEN, Karsten ,  GUSTAFSSON, Lars ,  PERSSON, Markus ,  LUNDSTRÖM, Per

IPC分类号： H05K3/34 ,  H05K3/36 ,  H05K13/04 ,  H01R4/02

CPC分类号： H05K3/3405 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01R4/027 ,  H01R12/57 ,  H01R43/0263 ,  H05K3/305 ,  H05K3/3421 ,  H05K2201/1034

摘要： An electronic assembly and a method of manufacturing such an assembly in which a carrier (13) for electronic components (14) and leads (18) for external connection are connected with each other by interconnections (19) including solder joints (22). In order to sustain heating periods, at least one of said interconnections comprises an adhesive joint (23) in addition to the solder joint applied between the carrier and one lead.

公开(公告)号：EP3235113A1

公开(公告)日：2017-10-25

申请号：EP14830422.3

申请日：2014-12-18

申请人： Telefonaktiebolaget LM Ericsson (publ)

发明人： ANDERSSON, Mattias ,  ETSARE, Martin ,  FERM, Per ,  HOFFSTRÖM, Roger ,  PEREZ-URIA, Igor

IPC分类号： H02M1/12 ,  H02M1/44

摘要： The invention is directed towards a power source interface module for electronic circuits supplied by power from a power source as well as a power supply arrangement for electronic circuits comprising such a power source interface module. The module comprises a first circuit board carrying components, the first circuit board comprising a number of stacked circuit board layers as well as at least two openings, at least a part of a filter comprising at least one pair of magnetically coupled inductive coils, a core with two core legs, each core leg stretching through a corresponding opening in the circuit board, wherein each coil is wound around a corresponding core leg, the turns of the coils stretch through the circuit board layers, and each layer between an upper outer layer and a lower outer layer comprises at least a part of one turn.

摘要翻译： 本发明针对用于由电源供电的电子电路供电的电源接口模块以及包括这种电源接口模块的用于电子电路的电源供应装置。 该模块包括承载部件的第一电路板（22），第一电路板（22）包括多个堆叠的电路板层以及至少两个开口（32,34,36,37），至少部分的 包括至少一对磁耦合感应线圈的滤波器，具有两个磁芯腿的磁芯，每个磁芯腿延伸穿过电路板（22）中的对应开口（32,34），其中每个线圈围绕相应的磁芯 腿，线圈的匝圈穿过电路板层，并且上外层和下外层之间的每个层包括一圈的至少一部分（24,26,28,30）。