FILM TREATMENT METHOD AND FILM PRODUCTION METHOD

    公开(公告)号:EP3647457A1

    公开(公告)日:2020-05-06

    申请号:EP18824625.0

    申请日:2018-06-04

    Abstract: Disclosed is a treatment method performed by a film processing apparatus 1 including: a first discharge electrode unit 3 and a second discharge electrode unit 4 respectively including magnets 3b and 4b that form a magnetic field; and an AC power source 5 capable of alternately switching polarities of the first discharge electrode unit 3 and the second discharge electrode unit 4. In the treatment method, a predetermined surface treatment of a film F is performed by generating a plasma P while alternately switching polarities of the first discharge electrode unit 3 and the second discharge electrode unit 4 by using high-frequency power supplied from the AC power source 5.

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