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公开(公告)号：EP3835076A1
公开(公告)日：2021-06-16
申请号：EP19847145.0
申请日：2019-08-08
Applicant: Toppan Printing Co., Ltd.
Inventor： MIZUGUCHI, Yoshiyuki , MATSUI, Koji , MIMITA, Naomichi , TAKAHASHI, Satoko , MASUNAGA, Yuko , KATAOKA, Shin , KOKUBO, Yu
IPC: B42D25/41 , B42D25/309 , B42D25/328 , B42D25/351 , G06F21/34
Abstract: A personal identification medium is provided that includes a decorative layer provided with an antenna, and a laser marking layer in which a personal information marking portion is marked on the decorative layer, where the antenna includes a non-decorative portion and a decorative portion connected to the non-decorative portion, and the personal information marking portion formed on the laser marking layer overlaps at least a portion of the decorative portion formed on the decorative layer.
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公开(公告)号：EP2357705A1
公开(公告)日：2011-08-17
申请号：EP09825936.9
申请日：2009-11-13
Applicant: Toppan Printing Co., Ltd. , Hitachi, Ltd.
Inventor： OZAWA, Tatsurou , NAKAJIMA, Hidemi , FURUICHI, Kozue , KANDO, Hidehiko , KATAOKA, Shin
CPC classification number: G06K19/07749 , B42D25/29 , B42D25/328 , B42D2033/46 , B42D2035/20 , G06K19/0775 , G06K19/07773 , G06K19/07786 , G06K19/145 , G06K19/16 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H01L2924/07811 , H01Q1/2225 , H01Q1/38 , H01L2924/00 , H01L2224/0401
Abstract: A contactless integrated circuit (IC) label has an IC chip and is capable of exchanging data with an external reading device without contact. The contactless IC label includes: a transparent label base material; an optical variable device formed on a lower surface of the label base material; a conductive layer bonded to and formed on a lower surface of the optical variable device, and configured to function as an antenna of the IC chip; a connecting layer electrically connected to the IC chip; an insulating layer formed between the conductive layer and the connecting layer, and configured to electrically couple the conductive layer and the connecting layer; and an impedance adjusting unit formed on at least the connecting layer of the conductive layer and the connecting layer, and configured to adjust impedances of the conductive layer and the IC chip.
Abstract translation: 非接触集成电路（IC）标签具有IC芯片，并且能够与外部读取装置交换数据而不接触。 非接触式IC标签包括：透明标签基材; 形成在标签基材的下表面上的光学可变装置; 导电层，其结合并形成在所述光学可变器件的下表面上，并且被配置为用作所述IC芯片的天线; 电连接到IC芯片的连接层; 绝缘层，形成在所述导电层和所述连接层之间，并且被配置为电连接所述导电层和所述连接层; 以及阻抗调节单元，形成在所述导电层和所述连接层的至少所述连接层上，并且被配置为调整所述导电层和所述IC芯片的阻抗。
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公开(公告)号：EP2357705B1
公开(公告)日：2016-06-01
申请号：EP09825936.9
申请日：2009-11-13
Applicant: Toppan Printing Co., Ltd.
Inventor： OZAWA, Tatsurou , NAKAJIMA, Hidemi , FURUICHI, Kozue , KANDO, Hidehiko , KATAOKA, Shin
IPC: H01Q1/50 , G06K19/07 , G06K19/077 , G09F3/00 , G09F3/02 , G06K19/16 , G06K19/14 , B42D15/00 , H01Q1/22 , H01Q1/38 , B42D25/29
CPC classification number: G06K19/07749 , B42D25/29 , B42D25/328 , B42D2033/46 , B42D2035/20 , G06K19/0775 , G06K19/07773 , G06K19/07786 , G06K19/145 , G06K19/16 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H01L2924/07811 , H01Q1/2225 , H01Q1/38 , H01L2924/00 , H01L2224/0401
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