公开(公告)号：EP2006083B1

公开(公告)日：2017-04-05

申请号：EP06843408.3

申请日：2006-12-27

申请人： Towa Corporation ,  Japan Fine Ceramics Center

发明人： KUNO, Takaki ,  NOGUCHI, Yoshinori ,  MAEDA, Keiji ,  KITAOKA, Satoshi ,  KAWASHIMA, Naoki

IPC分类号： B29C33/56 ,  C04B37/00 ,  B29C33/38

CPC分类号： B29C33/38 ,  B29C33/56 ,  C04B37/001 ,  C04B2237/34 ,  C04B2237/348

公开(公告)号：EP2006083A9

公开(公告)日：2009-07-01

申请号：EP06843408.3

申请日：2006-12-27

申请人： Towa Corporation ,  Japan Fine Ceramics Center

发明人： KUNO, Takaki ,  NOGUCHI, Yoshinori ,  MAEDA, Keiji ,  KITAOKA, Satoshi ,  KAWASHIMA, Naoki

IPC分类号： B32B9/00 ,  B29C33/38 ,  B32B18/00

CPC分类号： B29C33/38 ,  B29C33/56 ,  C04B37/001 ,  C04B2237/34 ,  C04B2237/348

摘要： An upper die (1) has a cavity member (6) constituting an inner bottom surface (5) of a cavity (4), and a surrounding member (7). The cavity member (6) is formed of a low adhesion material in accordance with the present invention, and includes a body portion (8) and a surface layer (10) formed on an undersurface (9) of the body portion (8) exposed to a fluid resin. The body portion (8) is formed of a first material of 3YSZ and a second material of ZrN that are mixed at a predetermined ratio. The surface layer (10) is formed of Y 2 O 3 having a low adhesion property with respect to a set resin, and has a thermal expansion coefficient smaller than that of the body portion (8). By bonding the body portion (8) and the surface layer (10) at a high temperature and then cooling them down, compressive residual stress is caused in the surface layer (10) due to a difference in the thermal expansion coefficients thereof, and the compressive residual stress is present in the surface layer (10).

公开(公告)号：EP2006083A2

公开(公告)日：2008-12-24

申请号：EP06843408.3

申请日：2006-12-27

申请人： Towa Corporation ,  Japan Fine Ceramics Center

发明人： KUNO, Takaki ,  NOGUCHI, Yoshinori ,  MAEDA, Keiji ,  KITAOKA, Satoshi ,  KAWASHIMA, Naoki

IPC分类号： B32B9/00 ,  B29C33/38 ,  B32B18/00

CPC分类号： B29C33/38 ,  B29C33/56 ,  C04B37/001 ,  C04B2237/34 ,  C04B2237/348

摘要： An upper die (1) has a cavity member (6) constituting an inner bottom surface (5) of a cavity (4), and a surrounding member (7). The cavity member (6) is formed of a low adhesion material in accordance with the present invention, and includes a body portion (8) and a surface layer (10) formed on an undersurface (9) of the body portion (8) exposed to a fluid resin. The body portion (8) is formed of a first material of 3YSZ and a second material of ZrN that are mixed at a predetermined ratio. The surface layer (10) is formed of Y 2 O 3 having a low adhesion property with respect to a set resin, and has a thermal expansion coefficient smaller than that of the body portion (8). By bonding the body portion (8) and the surface layer (10) at a high temperature and then cooling them down, compressive residual stress is caused in the surface layer (10) due to a difference in the thermal expansion coefficients thereof, and the compressive residual stress is present in the surface layer (10).

公开(公告)号：EP1978005A1

公开(公告)日：2008-10-08

申请号：EP06843407.5

申请日：2006-12-27

申请人： Towa Corporation ,  Japan Fine Ceramics Center

发明人： KUNO, Takaki ,  NOGUCHI, Yoshinori ,  MAEDA, Keiji ,  KITAOKA, Satoshi ,  KAWASHIMA, Naoki ,  YOSHIYA, Masato ,  SUDA, Seiichi

IPC分类号： C04B35/50 ,  B29C33/38

CPC分类号： B29C33/56 ,  B29C33/60 ,  C04B35/50 ,  C04B35/505 ,  C04B35/645 ,  C04B2235/3213 ,  C04B2235/3225 ,  C04B2235/3227

摘要： A resin molding die (1) has a molding surface (6) formed of a low adhesion material (3) formed of a solid solution of La- Y 2 O 3 produced from Y 2 O 3 and an other oxide of La 2 O 3 . La 2 O 3 contains La, which has an ionic radius larger than Y 3+ , and is larger in basicity than Y 2 O 3 . The low adhesion material (3) contains La 2 O 3 at a predetermined ratio relative to a total of Y 2 O 3 and La 2 O 3 . The low adhesion material (3) thus has a large ionic radius contributing to a smaller number of sites per unit area than Y 2 O 3 , a larger basicity contributing to a smaller force binding the low adhesion material with a basic substance than Y 2 O 3 , and a ratio contributing to shape retention. The low adhesion material (3) thus less adhesive and more shape-retentive than Y 2 O 3 configures the molding surface (6). A low adhesion material that is less adhesive to a basic substance than Y 2 O 3 is and excellently shape-retentive, and an excellently releasable and shape-retentive resin molding die can thus be obtained.

摘要翻译： 树脂成型模具（1）具有由由Y 2 O 3制成的La-Y 2 O 3的固溶体和La 2 O 3的其它氧化物形成的低粘合材料（3）形成的成型面（6） 。 La 2 O 3含有离子半径大于Y 3+的La，碱度大于Y 2 O 3。 低粘合性材料（3）相对于Y 2 O 3和La 2 O 3的总和以相对于预定比例含有La 2 O 3。 因此，低粘附性材料（3）具有大的离子半径，有助于每单位面积的位置数量少于Y 2 O 3，较大的碱度有助于将低粘附性材料与碱性物质结合的力小于Y 2 O 3，以及有助于形状保持的比例。 低粘合性材料（3）因此比Y 2 O 3更少的粘合剂和更多的形状 - 保持性构成了模制表面（6）。 与Y 2 O 3相比，对碱性物质的粘合性较差的粘合性低的材料具有良好的保形性，能够得到良好的脱模性和形状保持性的树脂成形模。