公开(公告)号：EP1433521A1

公开(公告)日：2004-06-30

申请号：EP01972491.3

申请日：2001-09-26

申请人： Toyo Kohan Co., Ltd. ,  Tokyo Gas Company Limited

发明人： SAIJO, Kinji, c/o TOYO KOHAN CO., LTD. ,  OHSAWA, Shinji, c/o TOYO KOHAN CO., LTD. ,  OKAMOTO, Hiroaki, c/o TOYO KOHAN CO., LTD. ,  YOSHIDA, Kazuo, c/o TOYO KOHAN CO., LTD. ,  SEKI, Tsutomu, c/o TOKYO GAS COMPANY LIMITED

IPC分类号： B01D71/02 ,  B01D53/22

CPC分类号： C01B3/505 ,  B01D53/22 ,  B01D53/228 ,  B01D63/081 ,  B01D67/0072 ,  B01D69/10 ,  B01D71/022 ,  B01D2313/025 ,  B01D2325/04 ,  B01D2325/08 ,  C01B2203/0405 ,  Y10S55/05

摘要： A method for manufacturing a gas separating unit which comprises laminating a metal plate on a material capable separating a hydrogen gas (palladium alloy fo il) by cladding, etching selectively a central portion of a cut clad plate (K) using an etching solution, to thereby expose an underlying palladium alloy foil layer, and providing a metal supporting plate on the other side of the palladium alloy f oil layer. The method allows the manufacture of a gas separating unit having an enhanced effective area of a material capable of separating a hydrogen gas and is excellent in the handlability of a material capable of separating a hydrogen gas during manufacturing.

摘要翻译： 一种气体分离单元的制造方法，其特征在于，将金属板层叠在能够通过包层分离氢气（钯合金）的材料上，使用蚀刻液选择性地切割切割复合板（K）的中央部分， 从而暴露下面的钯合金箔层，并在钯合金f油层的另一侧上提供金属支撑板。 该方法允许制造具有能够分离氢气的材料的增强的有效面积并且在制造期间能够分离氢气的材料的可处理性优异的气体分离单元。

公开(公告)号：EP1484793A1

公开(公告)日：2004-12-08

申请号：EP03744037.7

申请日：2003-03-10

申请人： Toyo Kohan Co., Ltd.

发明人： SAIJO, Kinji, c/o TOYO KOHAN CO., LTD. ,  YOSHIDA, Kazuo, c/o TOYO KOHAN CO., LTD. ,  OHSAWA, Shinji, c/o TOYO KOHAN CO., LTD.

IPC分类号： H01L21/60 ,  H01L23/12 ,  H01L25/065 ,  H05K3/34 ,  H05K3/46

CPC分类号： H05K3/328 ,  H01L21/563 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81054 ,  H01L2224/81192 ,  H01L2224/81208 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81815 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30107 ,  H05K2201/0367 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05655

摘要： An electronic circuit device capable of providing a stable electrical connection between an electronic component chip and a connecting multi-layer substrate, and being downsized at high density; and a production method therefor. An electronic component chip (1) and a connecting multi-layer substrate (2) or electronic component chips are heated in an inactive atmosphere such as argon or a reducing atmosphere such as hydrogen and pressure-welded to each other with or without an intermediary of an interposer (6), or their joint surfaces are activated and then pressure-welded at room temperature or by heating, thereby producing an electronic circuit device (40) by directly and metallurgically joining them by using any one of the above methods.

摘要翻译： 一种电子电路装置，其能够在电子部件芯片和连接多层基板之间提供稳定的电连接，并且以高密度进行小型化; 及其制造方法。 将电子元件芯片（1）和连接多层基板（2）或电子元件芯片在诸如氩气或诸如氢气的还原气氛的惰性气氛中加热，并在 插入器（6）或其接合表面被激活，然后在室温或加热下进行压焊，从而通过使用上述方法中的任一种直接和冶金连接它们来生产电子电路装置（40）。