公开(公告)号：EP2965356A1

公开(公告)日：2016-01-13

申请号：EP14702122.4

申请日：2014-01-08

申请人： Northrop Grumman Systems Corporation

发明人： ZHANG, Chunbo ,  NGO, Peter ,  AKERLING, Gershon ,  LEONG, Kevin M. ,  CHANG-CHIEN, Patty ,  HENNIG, Kelly, J. ,  DEAL, William, R.

IPC分类号： H01L23/66 ,  H01L23/055 ,  H01L23/14 ,  H01P3/12 ,  H01Q1/22 ,  H01Q23/00

CPC分类号： H01L27/14685 ,  H01L21/76254 ,  H01L23/055 ,  H01L23/147 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14687 ,  H01L31/186 ,  H01L31/1876 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81022 ,  H01L2224/81024 ,  H01L2224/81054 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81204 ,  H01L2224/81805 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/12032 ,  H01L2924/13064 ,  H01L2924/14215 ,  H01L2924/1423 ,  H01L2924/15313 ,  H01L2924/157 ,  H01L2924/37001 ,  H01P11/002 ,  H01Q13/02 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/81 ,  H01L2924/01079

摘要： A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.

摘要翻译： 公开了一种用于将单个III-V MMIC集成到微加工波导封装中的方法和装置。 MMIC在集成之前被筛选，仅允许已知的芯片被集成，从而提高产量。 该方法和装置用于实现用于亚毫米波（SMMW）相机的微型集成焦平面阵列（mFPA）技术，尽管许多其他应用是可能的。 不同技术的MMIC可以集成到相同的微加工包装中，从而实现与多晶圆WLP集成相同的技术集成水平。

公开(公告)号：EP1919822A1

公开(公告)日：2008-05-14

申请号：EP06808248.6

申请日：2006-08-21

申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE

发明人： MARION, François

IPC分类号： B81C5/00

CPC分类号： B81C1/00269 ,  B81C3/002 ,  B81C2203/019 ,  B81C2203/032 ,  H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/81054 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/16235 ,  Y10T29/49002 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： The invention relates to a method of sealing or welding two elements to one another in a chamber under vacuum or controlled atmosphere. The inventive method comprises the following steps consisting in: producing a wettability area (10, 11) on the opposing faces of the elements to be welded, one of said areas (11) comprising a layer of gold and having a surface area (S2) greater than the surface area (S1) of the other wettability area; depositing a quantity of suitable sealing material on one (10) of the areas, said material comprising indium; bringing the wettability area (11) of the other element into contact with the material thus deposited; and raising the temperature of the chamber containing the elements to be welded or sealed to at least 250 °C in a non-oxidising atmosphere, in order to seal the two elements effectively to one another by means of remelting.

公开(公告)号：EP2587900A1

公开(公告)日：2013-05-01

申请号：EP11800738.4

申请日：2011-06-24

申请人： Ayumi Industry Co., Ltd.

发明人： ABE, Hideyuki ,  MAWATARI, Kazuaki

IPC分类号： H05K3/34 ,  B23K1/00 ,  B23K1/008 ,  B23K31/02 ,  H01L21/60 ,  B23K101/40 ,  B23K101/42

CPC分类号： B23K3/0607 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/20 ,  B23K1/206 ,  B23K3/04 ,  B23K3/082 ,  B23K31/02 ,  B23K35/38 ,  B23K2101/40 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75101 ,  H01L2224/7515 ,  H01L2224/75272 ,  H01L2224/81002 ,  H01L2224/81011 ,  H01L2224/81014 ,  H01L2224/81019 ,  H01L2224/81054 ,  H01L2224/8109 ,  H01L2224/81193 ,  H01L2224/81211 ,  H01L2224/81805 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83104 ,  H01L2924/01322 ,  H05K3/305 ,  H05K3/3436 ,  H05K13/0465 ,  H05K2203/083 ,  H05K2203/085 ,  H05K2203/087 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/00

摘要： A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided.
A temporary bonding agent 55 is applied onto multiple substrates 50a, 50b, and a heater 33 heats the substrates while the substrates are temporarily bonded with the temporary bonding agent 55 interposed therebetween, and before the solder 54 is melted or while the solder 54 is melted, the temporary bonding agent 55 is evaporated, and the substrates 50a, 50b are bonded with solder with the melted solder 54 interposed therebetween.

摘要翻译： 提供了能够减轻基板之间的位置偏移的焊接方法，即使可以省略去除焊剂的步骤。 临时粘合剂55被施加到多个基板50a，50b上，并且加热器33加热基板，同时基板临时粘合在其间插入临时粘合剂55，并且在焊料54熔化之前或焊料54熔化之前 ，临时粘合剂55蒸发，并且基板50a，50b与焊料接合，熔融的焊料54插入其间。

公开(公告)号：EP1696253A2

公开(公告)日：2006-08-30

申请号：EP06075246.6

申请日：2006-02-01

申请人： Northorp Grumman Corporation

发明人： Bosco, Nicholas S.

IPC分类号： G02B7/00 ,  H01L21/60

CPC分类号： H05K3/3436 ,  B23K3/0623 ,  B23K2201/42 ,  G02B6/4232 ,  G02B27/62 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05655 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/81054 ,  H01L2224/81143 ,  H01L2224/81211 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/01044 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for accurately positioning and aligning multiple components, such as optical components, on a common substrate. A separate pattern of solder bumps is formed on the substrate for each of the components to be mounted. Congruent patterns of solder pads are formed on the respective components. The components are placed and positioned on the substrate as accurately as possible using manual or other means, and then the assembly,is heated sufficiently to reflow the solder bumps beneath each component. During reflow, the solder pads on the domponents move into accurate alignment with the solder bumps on the substrate. On cooling, the components are attached and remain in the automatically aligned configuration.

摘要翻译： 一种用于在公共基板上精确地定位和对准诸如光学部件的多个部件的方法。 对于要安装的每个部件，在基板上形成单独的焊料凸块图案。 在各个部件上形成焊盘的一致图形。 使用手动或其他方式将组件尽可能准确地放置和定位在基板上，然后将组件充分加热以回流每个部件下方的焊料凸块。 在回流期间，多个组件上的焊盘移动到与基板上的焊料凸块精确对准。 在冷却时，组件被连接并保持在自动对准的配置中。

公开(公告)号：EP2136609A1

公开(公告)日：2009-12-23

申请号：EP09290433.3

申请日：2009-06-11

申请人： S.E.T.

发明人： Cavazza, Gilbert

IPC分类号： H05K3/34 ,  H01L21/60

CPC分类号： H05K3/3494 ,  B23K9/20 ,  B23K2201/40 ,  H01L2224/81054 ,  H01L2224/81801 ,  H05K2203/082 ,  H05K2203/087 ,  H05K2203/1581 ,  Y10T29/53174

摘要： - Dispositif pour l'assemblage de composants à plots de soudure métalliques.
- Selon l'invention, le dispositif (I) comprend des plateaux mobiles (2, 3), en regard l'un de l'autre, portant respectivement des composants métalliques (4,5) et ménageant entre eux une chambre plate (18) entourant lesdits composants, lorsque ces derniers sont au contact l'un de l'autre. La chambre plate (18) est apte être saturée par un fluide gazeux désoxydant (G1).

摘要翻译： 的装置（I）具有板（2,3）分别承载部件（5 4）。 所述板（2）具有对所述部件（4）附近的布置外区（9），在孔（10），并随附脱氧气态流体（G1）。 外区具有另一个孔（12）从所述部件（4）间隔开，并且被供给具有中性气态流体（G2），和具有孔（10，12）之间的第三孔（14）。 所述板（3）具有围绕所述部件（5）的另一个外部区域（17）。 所述板管理周围的部件，当部件在海誓山盟接触的平坦腔室（18）。

公开(公告)号：EP1471570A1

公开(公告)日：2004-10-27

申请号：EP04009746.1

申请日：2004-04-23

申请人： Suga, Tadatomo ,  Shinko Electric Industries Co., Ltd. ,  Oki Electric Industry Co., Ltd. ,  Sharp Kabushiki Kaisha ,  Sony Corporation ,  Kabushiki Kaisha Toshiba ,  NEC CORPORATION ,  Hitachi, Ltd. ,  FUJITSU LIMITED ,  MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  MITSUBISHI DENKI KABUSHIKI KAISHA ,  Rohm Co., Ltd.

发明人： Suga, Tadatomo ,  Itoh, Toshihiro ,  Nakazawa, Hideto ,  Akagawa, Masatoshi

IPC分类号： H01L21/60 ,  H01L21/603 ,  H01L23/485 ,  H01L21/56 ,  H01L21/48 ,  H01L23/538 ,  H01L21/00

CPC分类号： H01L24/81 ,  H01L23/49816 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/81054 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K3/3436 ,  H05K2203/085 ,  H05K2203/086 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49197 ,  H01L2224/05624 ,  H01L2924/00014

摘要： A method of mounting an electronic part on a board, in which an electronic part and a mounting board on which the electronic part is to be mounted are placed in a vacuum or inert atmosphere, and the electronic part is mounted on the board by bringing the bonding members of the electronic part and the board into contact with each other at normal temperature to thereby mount the electronic part on the board, the method comprising forming the bonding members of at least one of the electronic part and the board out of a solder material, and bringing the bonding members of the electronic part and the board into contact with each other without preprocessing the bonding surfaces of the bonding members.

摘要翻译： 具有焊锡凸块（13）的封装（11）和具有由焊料材料制成的焊盘（17）的布线板（15）放置在真空或惰性气氛中，使凸块与相应的焊盘接触，而无需预处理 在正常温度下接合凸块和接合焊盘的表面以进行接合。

公开(公告)号：EP2587900A4

公开(公告)日：2015-10-28

申请号：EP11800738

申请日：2011-06-24

申请人： AYUMI INDUSTRY CO LTD

发明人： ABE HIDEYUKI ,  MAWATARI KAZUAKI

IPC分类号： H05K3/34 ,  B23K1/00 ,  B23K1/008 ,  B23K31/02 ,  B23K101/40 ,  B23K101/42 ,  H01L21/60

CPC分类号： B23K3/0607 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/20 ,  B23K1/206 ,  B23K3/04 ,  B23K3/082 ,  B23K31/02 ,  B23K35/38 ,  B23K2201/40 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75101 ,  H01L2224/7515 ,  H01L2224/75272 ,  H01L2224/81002 ,  H01L2224/81011 ,  H01L2224/81014 ,  H01L2224/81019 ,  H01L2224/81054 ,  H01L2224/8109 ,  H01L2224/81193 ,  H01L2224/81211 ,  H01L2224/81805 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83104 ,  H01L2924/01322 ,  H05K3/305 ,  H05K3/3436 ,  H05K13/0465 ,  H05K2203/083 ,  H05K2203/085 ,  H05K2203/087 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/00

摘要： A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided. A temporary bonding agent 55 is applied onto multiple substrates 50a, 50b, and a heater 33 heats the substrates while the substrates are temporarily bonded with the temporary bonding agent 55 interposed therebetween, and before the solder 54 is melted or while the solder 54 is melted, the temporary bonding agent 55 is evaporated, and the substrates 50a, 50b are bonded with solder with the melted solder 54 interposed therebetween.

公开(公告)号：EP2136609B1

公开(公告)日：2012-03-21

申请号：EP09290433.3

申请日：2009-06-11

申请人： S.E.T.

发明人： Cavazza, Gilbert

IPC分类号： H05K3/34 ,  H01L21/60

CPC分类号： H05K3/3494 ,  B23K9/20 ,  B23K2201/40 ,  H01L2224/81054 ,  H01L2224/81801 ,  H05K2203/082 ,  H05K2203/087 ,  H05K2203/1581 ,  Y10T29/53174

公开(公告)号：EP1696253A3

公开(公告)日：2006-11-08

申请号：EP06075246.6

申请日：2006-02-01

申请人： Northrop Grumman Corporation

发明人： Bosco, Nicholas S.

IPC分类号： G02B7/00 ,  H01L21/60

CPC分类号： H05K3/3436 ,  B23K3/0623 ,  B23K2201/42 ,  G02B6/4232 ,  G02B27/62 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05655 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/81054 ,  H01L2224/81143 ,  H01L2224/81211 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/01044 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for accurately positioning and aligning multiple components, such as optical components, on a common substrate. A separate pattern of solder bumps is formed on the substrate for each of the components to be mounted. Congruent patterns of solder pads are formed on the respective components. The components are placed and positioned on the substrate as accurately as possible using manual or other means, and then the assembly,is heated sufficiently to reflow the solder bumps beneath each component. During reflow, the solder pads on the domponents move into accurate alignment with the solder bumps on the substrate. On cooling, the components are attached and remain in the automatically aligned configuration.

公开(公告)号：EP1484793A1

公开(公告)日：2004-12-08

申请号：EP03744037.7

申请日：2003-03-10

申请人： Toyo Kohan Co., Ltd.

发明人： SAIJO, Kinji, c/o TOYO KOHAN CO., LTD. ,  YOSHIDA, Kazuo, c/o TOYO KOHAN CO., LTD. ,  OHSAWA, Shinji, c/o TOYO KOHAN CO., LTD.

IPC分类号： H01L21/60 ,  H01L23/12 ,  H01L25/065 ,  H05K3/34 ,  H05K3/46

CPC分类号： H05K3/328 ,  H01L21/563 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81054 ,  H01L2224/81192 ,  H01L2224/81208 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81815 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30107 ,  H05K2201/0367 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05655

摘要： An electronic circuit device capable of providing a stable electrical connection between an electronic component chip and a connecting multi-layer substrate, and being downsized at high density; and a production method therefor. An electronic component chip (1) and a connecting multi-layer substrate (2) or electronic component chips are heated in an inactive atmosphere such as argon or a reducing atmosphere such as hydrogen and pressure-welded to each other with or without an intermediary of an interposer (6), or their joint surfaces are activated and then pressure-welded at room temperature or by heating, thereby producing an electronic circuit device (40) by directly and metallurgically joining them by using any one of the above methods.

摘要翻译： 一种电子电路装置，其能够在电子部件芯片和连接多层基板之间提供稳定的电连接，并且以高密度进行小型化; 及其制造方法。 将电子元件芯片（1）和连接多层基板（2）或电子元件芯片在诸如氩气或诸如氢气的还原气氛的惰性气氛中加热，并在 插入器（6）或其接合表面被激活，然后在室温或加热下进行压焊，从而通过使用上述方法中的任一种直接和冶金连接它们来生产电子电路装置（40）。