ELECTRICAL CONNECTOR HAVING REVERSED DIFFERENTIAL PAIRS
    1.
    发明公开
    ELECTRICAL CONNECTOR HAVING REVERSED DIFFERENTIAL PAIRS 有权
    ELEKTRISCHER VERBINDER MIT UMGEKEHRTEN DIFFERENTIELLEN KONTAKTPAAREN

    公开(公告)号:EP2324541A1

    公开(公告)日:2011-05-25

    申请号:EP09789039.6

    申请日:2009-07-30

    IPC分类号: H01R24/00

    摘要: An electrical connector comprises a housing having a mating face and a mounting face, and a differential pair (86, 90) of terminals extending between the mating face and the mounting face. The differential pair comprises a positive terminal and a negative terminal having positive and negative mating contacts (20), respectively, at the mating face, and positive and negative mounting contacts (42), respectively, at the mounting face. The positive and negative mating contacts are arranged at the mating face in a first orientation (90b), and the positive and negative mounting contacts are arranged at the mounting face in a second orientation (86b) which is inverted relative to the first orientation.

    摘要翻译: 为电连接器提供接触模块。 接触模块包括具有配合边缘部分和安装边缘部分的主体。 引线框架由身体保持。 引线框架包括在配合边缘部分和安装边缘部分之间延伸的差分对端子。 差分对分别包括正极端子和负极端子,分别具有正和负配合触点,以及正极和负极安装触头。 正和负配合触头在第一方向上从配合边缘部分延伸。 正和负安装触头在第二方位从安装边缘部分延伸。 在配合边缘部分处的第一取向相对于安装边缘部分处的第二定向反转。

    DEFFERENTIAL CONNECTOR FOOTPRINT FOR A MULTI-LAYER CIRCUIT BOARD
    7.
    发明公开
    DEFFERENTIAL CONNECTOR FOOTPRINT FOR A MULTI-LAYER CIRCUIT BOARD 审中-公开
    差分连接器地表为多多层电路板

    公开(公告)号:EP1407642A2

    公开(公告)日:2004-04-14

    申请号:EP02766804.5

    申请日:2002-04-26

    IPC分类号: H05K1/11 H05K1/02 H01R24/00

    摘要: A multi-layer circuit board (200) is provided that simultaneously optimizes impedance and interference within the multi-layer circuit board and a controlled impedance connector to which it is attached. The multi-layer circuit board includes a plurality of signal pins (104) attached to at least one signal circuit layer (202), and a plurality of ground pins (102) attached to at least one ground circuit layer (202). The signal pins are arranged as differential pairs (106) in a pattern, or matrix, in which the differential pairs are staggered in rows (A,B,C,D,E,F) of the pattern. In accordance with an embodiment of the present invention, each differential pair of the multi-layer circuit board is more tightly coupled to a ground contact than to any other signal contact. The multi-layer circuit board also includes a plurality of signal trace segments (110) arranged in pairs. Both signal trace segments of a pair are equal in length and connect to signal contacts via linear routing channels (10).