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    FEMALE CONNECTOR, MALE CONNECTOR AND CONNECTOR ASSEMBLY
    2.
    发明公开
    FEMALE CONNECTOR, MALE CONNECTOR AND CONNECTOR ASSEMBLY 审中-实审

    公开(公告)号：EP4429044A1

    公开(公告)日：2024-09-11

    申请号：EP22897194.1

    申请日：2022-07-26

    申请人： Huawei Technologies Co., Ltd.

    发明人： CHEN, Jun ,  YE, Tao ,  QIU, Shuang

    IPC分类号： H01R13/6477 ,  H01R13/6473 ,  H01R13/11

    CPC分类号： H01R13/502 ,  H01R13/6477 ,  H01R13/04 ,  H01R24/00 ,  H01R13/629 ,  H01R13/11 ,  H01R13/6581 ,  H01R13/62 ,  H01R13/6461 ,  H01R13/10 ,  H01R13/6473 ,  H01R13/42 ,  H01R13/111 ,  H01R13/518 ,  H01R13/6585 ,  H01R13/6587

    摘要： Embodiments of this application provide a female connector, a male connector, and a connector assembly. The female connector includes a housing assembly and a female signal terminal. A first end of the housing assembly is provided with a jack that is used to plug into the male connector. The female signal terminal has an accommodation cavity, and one end that is of the female signal terminal and that faces the jack has a port that communicates with the accommodation cavity. When the male connector is connected to the female connector through the jack, a male signal terminal is inserted into the accommodation cavity of the female signal terminal through the port, and the male signal terminal is in an electrical contact connection with the female signal terminal at the port, to implement matching contact between the male signal terminal and the female signal terminal. A medium in the accommodation cavity is air, that is, a medium at a contact position between the male signal terminal and the female signal terminal and a medium in an overlapping area between the female signal terminal and the male signal terminal are both air, no plastic member is introduced, and a dielectric constant value of air is relatively low. This effectively increases bandwidth of the connector assembly and increases a signal transmission rate.

    SUBSTRATE WITH A LOW DIELECTRIC CONSTANT MATERIAL AND METHOD OF MOLDING
    4.
    发明公开
    SUBSTRATE WITH A LOW DIELECTRIC CONSTANT MATERIAL AND METHOD OF MOLDING 审中-公开
    具有低介电常数材料和方法，用于形成基板

    公开(公告)号：EP3140887A1

    公开(公告)日：2017-03-15

    申请号：EP15723394.1

    申请日：2015-05-05

    申请人： TE Connectivity Corporation

    发明人： SULLIVAN MALERVY, Mary Elizabeth ,  GOLDEN, Josh Harris ,  ANGELOV, Aleksandar Kolev

    IPC分类号： H01R43/24 ,  H01R13/6477 ,  H01R13/6587

    CPC分类号： H01R13/6461 ,  B29C44/3446 ,  B29C44/42 ,  B29C45/0001 ,  B29C45/14795 ,  B29K2101/12 ,  B29K2105/0076 ,  B29K2105/04 ,  B29K2995/0006 ,  B29L2009/00 ,  B29L2031/3481 ,  C08J9/0066 ,  C08J9/228 ,  C08J2300/22 ,  C08J2300/24 ,  H01R13/6477 ,  H01R13/6585 ,  H01R13/6587 ,  H01R43/24

    摘要： Connectors (600) and/or substrates which are made utilizing a low dielectric constant injection moldable polymer or other melt proces sable polymer, such as, but not limited to, thermoplastic material, thermoplastic composite material, thermoset material, thermoset composite material or a combination thereof. The low dielectric constant injection moldable polymer or other melt processable polymer supports noise and/or crosstalk reductions for high speed signal transmission. The low dielectric constant material provides dielectric shielding between adjacent high speed signal lines (602). The reduced dielectric constant and reduced loss-tangent is created by forming voids or pores (10) within the bulk plastic material, thus increasing the air, gas or void content, and thus decreasing the density and overall dielectric constant of such material. The porosity thus introduced into the shielding between adjacent transmission lines reduces crosstalk and other losses, and thus maintains signal integrity in connector/substrate designs.

    摘要翻译： 其由使用低介电常数可注射模制聚合物或其他熔融加工的聚合物，颜色的连接器和/或底物：例如，但不限于，热塑性材料，热塑性复合材料，热固性材料，热固性复合材料或它们的组合。 该低介电常数可注射模制聚合物或其他熔融加工的聚合物支持的噪声和/或用于高速信号传输的串扰的减少。 低介电常数材料在相邻高速信号线之间的介电屏蔽。 降低的介电常数和降低的创建损耗角正切通过形成空隙或散装塑料材料中的孔隙，从而增加了空气，气体或空隙含量，并因此降低检查的材料的密度和总介电常数。 如此引入到相邻传输线之间的屏蔽的孔隙率降低串扰和其它损耗，并因此保持在连接器/基片设计的信号完整性。

    HIGH SPEED CONNECTOR
    5.
    发明公开
    HIGH SPEED CONNECTOR 有权
    高速连接器

    公开(公告)号：EP3078084A1

    公开(公告)日：2016-10-12

    申请号：EP14815176.4

    申请日：2014-12-02

    申请人： Tyco Electronics Corporation

    发明人： MORLEY, Stephen Thomas

    IPC分类号： H01R13/6473 ,  H01R24/44 ,  H01R13/6477

    CPC分类号： H01R13/514 ,  H01R13/6477 ,  H01R24/44

    摘要： A connector assembly includes a shell, an insulator held by the shell and a center contact held by the insulator. The center contact has a terminating segment. The connector assembly also includes a compound dielectric surrounding the terminating segment. The compound dielectric is positioned between the terminating segment and the shell. The compound dielectric includes a first dielectric layer that at least partially surrounds the center contact. The compound dielectric also includes a second dielectric layer at least partially surrounding the first dielectric layer. The second dielectric layer has a different dielectric constant than the dielectric constant of the first layer.