ELECTRICAL CONNECTOR WITH CROSSTALK CANCELING FEATURES
    5.
    发明公开
    ELECTRICAL CONNECTOR WITH CROSSTALK CANCELING FEATURES 有权
    带串扰消除功能的电连接器

    公开(公告)号:EP2140525A2

    公开(公告)日:2010-01-06

    申请号:EP08726844.7

    申请日:2008-03-14

    IPC分类号: H01R13/646

    摘要: An electrical connector (122) comprises a housing (370) having a mating face (372) and a mounting face (374). The housing holds signal contacts (350, 352) and ground contacts (390) arranged in rows (502). Each of the signal contacts and the ground contacts includes a mating end (410, 450, 400) extending from the mating face of the housing and a mounting end (414, 454, 404) extending from the mounting face of the housing. The signal contacts are arranged in alternating pairs of straight signal contacts (352) and offset signal contacts (350). For each said row, the mounting ends (454, 404) of the straight signal contacts and the ground contacts are arranged along a centerline (510) of said row, and the mounting ends (414) of the offset signal contacts in each said pair of offset signal contacts are offset on respective opposite sides of the centerline.

    摘要翻译: 电连接器(122)包括具有配合面(372)和安装面(374)的壳体(370)。 外壳保持布置成行(502)的信号触头(350,352)和接地触头(390)。 每个信号触头和接地触头包括从壳体的配合面延伸的配合端(410,450,400)和从壳体的安装面延伸的安装端(414,454,404)。 信号触头被布置成交替的成对的直线信号触头(352)和偏移信号触头(350)。 对于每个所述行,直信号触头和接地触头的安装端(454,404)沿着所述行的中心线(510)布置,并且偏移信号的安装端(414)在每个所述对 偏移信号触点在中心线的相应相对侧偏移。

    SKEW CONTROLLED LEADFRAME FOR A CONTACT MODULE ASSEMBLY
    6.
    发明授权
    SKEW CONTROLLED LEADFRAME FOR A CONTACT MODULE ASSEMBLY 有权
    用于接触模块组件的偏斜受控的引导框架

    公开(公告)号:EP2162957B1

    公开(公告)日:2010-11-17

    申请号:EP08768619.2

    申请日:2008-06-19

    IPC分类号: H01R13/658

    CPC分类号: H01R13/6587

    摘要: A leadframe for a contact module assembly comprises a terminal set (TS1, TS2, TS3, TS4, TS5) having first, second and third terminals (T1, T2, T3) configured to operate in one of a signal-signal-ground pattern and a ground-signal-signal pattern. Each of the terminals has a length that extends between a mating end (20) and a mounting end (56). A difference in the lengths between the first terminal (T1) and the second terminal (T2) is the same as a difference in the lengths between the second terminal (T2) and the third terminal (T3) such that the terminal set has the same amount of skew between the terminals defining signal contacts in both the signal-signal-ground pattern and the ground-signal-signal pattern.

    摘要翻译: 一种用于触头模块组件的引线框架包括具有第一,第二和第三端子(T1,T2,T3)的端子组(TS1,TS2,TS3,TS4,TS5),所述第一端子,第二端子和第三端子被配置为以信号 - 地面信号信号模式。 每个端子具有在配合端(20)和安装端(56)之间延伸的长度。 第一端子(T1)和第二端子(T2)之间的长度差异与第二端子(T2)和第三端子(T3)之间的长度差异相同,使得端子组具有相同的长度 在信号信号接地图案和接地信号信号图案两者中定义信号接触的端子之间的偏斜量。

    SKEW CONTROLLED LEADFRAMES FOR A CONTACT MODULE ASSEMBLY
    9.
    发明公开
    SKEW CONTROLLED LEADFRAMES FOR A CONTACT MODULE ASSEMBLY 有权
    失真喷头控制新框架连接组件

    公开(公告)号:EP2162957A1

    公开(公告)日:2010-03-17

    申请号:EP08768619.2

    申请日:2008-06-19

    IPC分类号: H01R13/658

    CPC分类号: H01R13/6587

    摘要: A leadframe for a contact module assembly comprises a terminal set (TS1, TS2, TS3, TS4, TS5) having first, second and third terminals (T1, T2, T3) configured to operate in one of a signal-signal-ground pattern and a ground-signal-signal pattern. Each of the terminals has a length that extends between a mating end (20) and a mounting end (56). A difference in the lengths between the first terminal (T1) and the second terminal (T2) is the same as a difference in the lengths between the second terminal (T2) and the third terminal (T3) such that the terminal set has the same amount of skew between the terminals defining signal contacts in both the signal-signal-ground pattern and the ground-signal-signal pattern.

    DEFFERENTIAL CONNECTOR FOOTPRINT FOR A MULTI-LAYER CIRCUIT BOARD
    10.
    发明公开
    DEFFERENTIAL CONNECTOR FOOTPRINT FOR A MULTI-LAYER CIRCUIT BOARD 审中-公开
    差分连接器地表为多多层电路板

    公开(公告)号:EP1407642A2

    公开(公告)日:2004-04-14

    申请号:EP02766804.5

    申请日:2002-04-26

    IPC分类号: H05K1/11 H05K1/02 H01R24/00

    摘要: A multi-layer circuit board (200) is provided that simultaneously optimizes impedance and interference within the multi-layer circuit board and a controlled impedance connector to which it is attached. The multi-layer circuit board includes a plurality of signal pins (104) attached to at least one signal circuit layer (202), and a plurality of ground pins (102) attached to at least one ground circuit layer (202). The signal pins are arranged as differential pairs (106) in a pattern, or matrix, in which the differential pairs are staggered in rows (A,B,C,D,E,F) of the pattern. In accordance with an embodiment of the present invention, each differential pair of the multi-layer circuit board is more tightly coupled to a ground contact than to any other signal contact. The multi-layer circuit board also includes a plurality of signal trace segments (110) arranged in pairs. Both signal trace segments of a pair are equal in length and connect to signal contacts via linear routing channels (10).