公开(公告)号：EP0238651B1

公开(公告)日：1989-11-29

申请号：EP86906528.4

申请日：1986-09-29

申请人： UNISYS CORPORATION

发明人： NELSON, John, Arnold ,  ROBINSON, Dale, Lynn

IPC分类号： H01L23/10

CPC分类号： H01L23/10 ,  H01L23/04 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A magnetically sealed integrated circuit package includes a substrate having a cavity for holding multiple integrated circuit die, a lid for covering the cavity to protect the die, a ferromagnetic seal ring which is fixed to the substrate around the die, and a magnet which is fixed to the lid and coincides in shape to the seal ring for magnetically attracting the seal ring to hold the lid in place when the lid covers the cavity.

公开(公告)号：EP0238651A1

公开(公告)日：1987-09-30

申请号：EP86906528.0

申请日：1986-09-29

申请人： UNISYS CORPORATION

发明人： NELSON, John, Arnold ,  ROBINSON, Dale, Lynn

IPC分类号： H01L23 ,  H01L25

CPC分类号： H01L23/10 ,  H01L23/04 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A magnetically sealed integrated circuit package includes a substrate having a cavity for holding multiple integrated circuit die, a lid for covering the cavity to protect the die, a ferromagnetic seal ring which is fixed to the substrate around the die, and a magnet which is fixed to the lid and coincides in shape to the seal ring for magnetically attracting the seal ring to hold the lid in place when the lid covers the cavity.