公开(公告)号：EP1849180A4

公开(公告)日：2009-04-29

申请号：EP06849677

申请日：2006-01-24

Applicant: UNIV ILLINOIS

Inventor： EDEN J GARY ,  CHEN KUO-FENG ,  OSTROM NELS P ,  PARK SUNG-JIN

IPC: H01J61/04 ,  H01J1/02 ,  H01J9/02 ,  H01J17/06 ,  H01J37/32

CPC classification number: H01J61/09 ,  H01J1/025 ,  H01J9/02 ,  H01J17/066 ,  H01J37/32018 ,  H01J37/32596 ,  H01J65/046

Abstract: A method for fabricating microcavity discharge devices and arrays of devices. The devices are fabricated by layering a dielectric (1020, 220) on a first conducting layer or substrate (210, 1010). A second conducting layer or structure is overlaid on the dielectric layer. In some devices, a microcavity (1040, 212) is created that penetrates the second conducting layer or structure and the dielectric layer. In other devices, the microcavity penetrates to the first conducting layer. The second conducting layer or structure together with the inside face of the microcavity is overlaid with a second dielectric layer. The microcavities are then filled with a discharge gas. When a time- varying potential of the appropriate magnitude is applied between the conductors, a microplasma discharge is generated in the microcavity. These devices can exhibit extended lifetimes since the conductors are encapsulated, shielding the conductors from degradation due to exposure to the plasma. Some of the devices are flexible and the dielectric can be chosen to act as a mirror.