MODULAR MICROPLASMA MICROCHANNEL REACTOR DEVICES, MINIATURE REACTOR MODULES AND OZONE GENERATION DEVICES
    2.
    发明公开
    MODULAR MICROPLASMA MICROCHANNEL REACTOR DEVICES, MINIATURE REACTOR MODULES AND OZONE GENERATION DEVICES 审中-公开
    模块化MIKROPLASMA-MIKROKANAL-REAKTORVORRICHTUNGEN,MINIATURISIERTE REAKTORMODULE UND OZONERZEUGUNGSVORRICHTUNGEN

    公开(公告)号:EP3050180A4

    公开(公告)日:2017-04-12

    申请号:EP14876614

    申请日:2014-09-24

    申请人: UNIV ILLINOIS

    IPC分类号: H01S3/091

    摘要: A preferred modular microplasma microchannel reactor device includes a microchannel array arranged with respect to electrodes for generation of plasma and isolated by dielectric from the electrodes. A cover covers a central portion of the microchannel array, while leaving end portions of the microchannel array exposed. A gas inlet and product outlet are arranged to permit flow into, through and out of the microchannel array. Reactor modules of the invention include pluralities of the modular reactor devices. The reactors devices can be arranged by a housing or a frame to be in fluid communication. A system of the invention arranges pluralities of modules. Preferred module housings, frames and reactors include structural features to create alignments and connections. Preferred modules include fans to circulate feedstock and reaction product. Other reactor devices provide plasma actuation for flow.

    摘要翻译: 优选的模块化微等离子体微通道反应器装置包括相对于电极布置的微通道阵列,用于产生等离子体并通过电极从电极隔离。 盖子覆盖微通道阵列的中心部分,同时使微通道阵列的端部露出。 气体入口和产品出口布置成允许流入,通过和流出微通道阵列。 本发明的反应器模块包括多个模块化反应器装置。 反应器装置可以由壳体或框架布置成流体连通。 本发明的系统布置了多个模块。 优选的模块外壳,框架和反应器包括用于产生对准和连接的结构特征。 优选的模块包括用于循环原料和反应产物的风扇。 其他反应器装置为流动提供等离子体驱动。

    AC-EXCITED MICROCAVITY DISCHARGE DEVICE AND METHOD
    3.
    发明公开
    AC-EXCITED MICROCAVITY DISCHARGE DEVICE AND METHOD 审中-公开
    随着对排放的微腔AC电压激励装置及方法

    公开(公告)号:EP1849180A4

    公开(公告)日:2009-04-29

    申请号:EP06849677

    申请日:2006-01-24

    申请人: UNIV ILLINOIS

    摘要: A method for fabricating microcavity discharge devices and arrays of devices. The devices are fabricated by layering a dielectric (1020, 220) on a first conducting layer or substrate (210, 1010). A second conducting layer or structure is overlaid on the dielectric layer. In some devices, a microcavity (1040, 212) is created that penetrates the second conducting layer or structure and the dielectric layer. In other devices, the microcavity penetrates to the first conducting layer. The second conducting layer or structure together with the inside face of the microcavity is overlaid with a second dielectric layer. The microcavities are then filled with a discharge gas. When a time- varying potential of the appropriate magnitude is applied between the conductors, a microplasma discharge is generated in the microcavity. These devices can exhibit extended lifetimes since the conductors are encapsulated, shielding the conductors from degradation due to exposure to the plasma. Some of the devices are flexible and the dielectric can be chosen to act as a mirror.

    MICRODISCHARGE DEVICES WITH ENCAPSULATED ELECTRODES AND METHOD OF MAKING
    6.
    发明公开
    MICRODISCHARGE DEVICES WITH ENCAPSULATED ELECTRODES AND METHOD OF MAKING 有权
    MIKROENTLADEGERÄTE与包括电极及其制造方法

    公开(公告)号:EP1797579A4

    公开(公告)日:2009-04-15

    申请号:EP05858440

    申请日:2005-10-04

    申请人: UNIV ILLINOIS

    IPC分类号: H01J9/00 H01J17/04 H01J61/04

    CPC分类号: H01J17/04 H01J9/02

    摘要: An embodiment of the invention is a microdischarge device including a first electrode (230) encapsulated in a dielectric, which may be a nanoporous dielectric film. A second electrode (240) is provided which may also be encapsulated with a dielectric. The electrodes are configured to ignite a discharge in a microcavity when a time-varying (an AC, RF, bipolar or a pulsed DC, etc.) potential is applied between the electrodes. In specific embodiments of the invention, the second electrode may be a screen covering the microcavity opening and the microcavity may be closed at one end. In some embodiments of the invention, the second electrode may be in direct contact with the first electrode. In other embodiments, a gap separates the electrodes. In a preferred method of manufacturing microdischarge devices with encapsulated electrodes, a metal substrate is used to form a nanoporous dielectric encapsulated electrode and dissolve a portion of the dielectric layer. The dielectric layer is then anodized a second time, resulting in a nanoporous dielectric encapsulated electrode with improved regularity of the nanoscale dielectric structures. In some embodiments of the invention, the columnar voids in the dielectric may be backfilled with one or more materials to further tailor the properties of the dielectric.