摘要:
An unsaturated monocarboxylic ester compound having at least one structure represented by the following general formula (1). In the formula, R1 represents hydrogen or C¿1-6? alkyl; and R?2, R3, and R4¿ each represents hydrogen, C¿1-6? alkyl, aryl, aralkyl, cyano, fluorine, or furyl. The curable composition comprises (A) an unsaturated monocarboxylic ester compound having one or more structures represented by the above general formula (1) and (B) a polymerization initiator as essential components and optionally further contains (C) a diluent.
摘要:
A photocurable and thermosetting resin composition comprising (A) an actinic radiation curable resin bearing one or more structures represented by the general formula (1), (B) a photopolymerization initiator, (C) a diluent, and (D) a thermosetting component: (1) wherein R1 is hydrogen or C¿1-6? alkyl; R?2, R3, and R4¿ are each hydrogen, C¿1-6? alkyl, aryl, aralkyl, cyano, fluoro, or furyl; and X is a polybasic acid anhydride residue.
摘要:
A photocurable/thermosetting resin composition which comprises (A) a photosensitive prepolymer having both at least one carboxyl group and at least two ethylenically unsaturated double bonds per molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups per molecule, and (E) a curing accelerator. It is alkali-developable, and can be formulated so as to be of the one-pack type. This composition and a photosensitive dry film formed therefrom are useful as various resist materials and insulating materials, in particular, a solder resist for printed circuit boards, an interlayer dielectric for build-up multilayered printed circuit boards, etc.