公开(公告)号：EP1838897A2

公开(公告)日：2007-10-03

申请号：EP06700446.5

申请日：2006-01-11

申请人： Umicore Galvanotechnik GmbH

发明人： GROSS, Andreas ,  TIEFENBACHER, Andreas

IPC分类号： C23C18/16 ,  C23C18/54 ,  C23C18/18 ,  C23C18/42 ,  H01L21/288 ,  H05K3/24

CPC分类号： H05K3/244 ,  C23C18/1651 ,  C23C18/32 ,  C23C18/42 ,  C23C18/50 ,  C23C18/54 ,  H01L21/288 ,  H05K2203/072 ,  H05K2203/073

摘要： The copper tracks of circuit supports require, for equipping with electronic components, a coating with a good corrosion resistance as well as with the ability of being repeatedly soldered or being bonded. These properties are fulfilled by a system of layers that contains an intermediate layer made of autocatalytically deposited nickel, on which a palladium layer is deposited by charge transfer. In order to ensure a reliable adhesion, a lack of pores and a good homogeneity, the bath for depositing the palladium layer contains a copper compound. In order to passivate the palladium layer, the system of layers can be provided with a final layer made of gold that is deposited by charge transfer and/or autocatalytically.

公开(公告)号：EP1838897B1

公开(公告)日：2014-04-30

申请号：EP06700446.5

申请日：2006-01-11

申请人： Umicore Galvanotechnik GmbH

发明人： GROSS, Andreas ,  TIEFENBACHER, Andreas

IPC分类号： C23C18/16 ,  C23C18/54 ,  C23C18/42 ,  H01L21/288 ,  H05K3/24 ,  C23C18/32 ,  C23C18/50

CPC分类号： H05K3/244 ,  C23C18/1651 ,  C23C18/32 ,  C23C18/42 ,  C23C18/50 ,  C23C18/54 ,  H01L21/288 ,  H05K2203/072 ,  H05K2203/073