公开(公告)号：EP3514255A1

公开(公告)日：2019-07-24

申请号：EP19152560.9

申请日：2019-01-18

Applicant: Viavi Solutions Inc.

Inventor： PREUSS, Adam Andrew ,  BRADLEY JR, Richard A. ,  OCKENFUSS, Georg J. ,  TILSCH, Markus K. ,  CLARK, Andrew ,  GRIGONIS, Marius ,  SHKABKO, Andy ,  DAVIS, Nicolas Alexander ,  COTTRELL, Anthony Jay Kemp

IPC: C23C4/08 ,  C23C4/06 ,  C23C4/134 ,  C23C4/131 ,  C23C14/02 ,  C23C14/06 ,  C23C14/34 ,  C23C28/02 ,  C23C14/56 ,  C23C16/44 ,  H01J37/32 ,  C23C16/24 ,  C23C16/02

Abstract: A device including a hard shield material; a layer including aluminum or copper; and a silicon layer having a first thickness is disclosed. The device can also include a silicon layer having a second thickness. A method of making the device is also disclosed.