公开(公告)号：EP3514255A1

公开(公告)日：2019-07-24

申请号：EP19152560.9

申请日：2019-01-18

Applicant: Viavi Solutions Inc.

Inventor： PREUSS, Adam Andrew ,  BRADLEY JR, Richard A. ,  OCKENFUSS, Georg J. ,  TILSCH, Markus K. ,  CLARK, Andrew ,  GRIGONIS, Marius ,  SHKABKO, Andy ,  DAVIS, Nicolas Alexander ,  COTTRELL, Anthony Jay Kemp

IPC: C23C4/08 ,  C23C4/06 ,  C23C4/134 ,  C23C4/131 ,  C23C14/02 ,  C23C14/06 ,  C23C14/34 ,  C23C28/02 ,  C23C14/56 ,  C23C16/44 ,  H01J37/32 ,  C23C16/24 ,  C23C16/02

Abstract: A device including a hard shield material; a layer including aluminum or copper; and a silicon layer having a first thickness is disclosed. The device can also include a silicon layer having a second thickness. A method of making the device is also disclosed.

公开(公告)号：EP3613870A1

公开(公告)日：2020-02-26

申请号：EP19191109.8

申请日：2019-08-09

Applicant: Viavi Solutions Inc.

Inventor： CLARK, Andrew ,  OCKENFUSS, Georg J.

IPC: C23C14/00 ,  C23C14/34 ,  G02B5/28 ,  G02B5/20 ,  C23C14/06 ,  C23C14/14 ,  C23C14/35

Abstract: A sputtering system may include a substrate. The sputtering system may include at least one target. The at least one target may include at least one coating material to coat at least one layer onto the substrate. The at least one coating material may be sputtered onto the substrate in a presence of an inert gas. The inert gas may include argon gas and helium gas.