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1.发明公开
公开(公告)号：EP1204303A3
公开(公告)日：2002-12-11
申请号：EP01125894.4
申请日：2001-10-30
发明人： Achari, Achyuta , Baker, Jay D. , Paruchuri, Mohan R. , Nation, Brenda Joyce , Goenka , Lakhi Nandlal , Stoica, Vladimir
CPC分类号： H05K3/022 , B32B15/017 , B32B15/018 , H05K2201/0361 , Y10T29/49126
摘要： A method for forming sets (10,12,14) of tri-metal material involving the use of cladding mills (16,18,20,22). When multiple sets (10,12,14) of tri-metal material are formed, the outside surfaces of each set (10,12,14) is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer (32) on the outside surface of the tri-metal material. Alternatively bonding materials (36) may be used on the intermediate surfaces; such bonding materials (36) can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.
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公开(公告)号：EP1204303A2
公开(公告)日：2002-05-08
申请号：EP01125894.4
申请日：2001-10-30
发明人： Achari, Achyuta , Baker, Jay D. , Paruchuri, Mohan R. , Nation, Brenda Joyce , Goenka , Lakhi Nandlal , Stoica, Vladimir
IPC分类号： H05K3/02
CPC分类号： H05K3/022 , B32B15/017 , B32B15/018 , H05K2201/0361 , Y10T29/49126
摘要： A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer on the outside surface of the tri-metal material. Alternatively bonding materials may be used on the intermediate surfaces; such bonding materials can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.
摘要翻译： 涉及使用包壳磨的成套三金属材料的方法。 当形成多组三金属材料时，每组的外表面通过氧化制备以防止每组粘附在上面或下面的组。 氧化的替代方案是在三金属材料的外表面上提供可去除的层。 可选地，结合材料可以用在中间表面上; 这种粘合材料可以选自锡，镍，钛，铬，银和锌。
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公开(公告)号：EP1204304A3
公开(公告)日：2002-12-11
申请号：EP01125895.1
申请日：2001-10-30
IPC分类号： H05K1/09 , H05K3/02 , B23K35/00 , B23K20/233
CPC分类号： B32B15/018 , B32B15/017 , C23C2/26 , C23C2/28 , C23C26/00 , H05K3/022 , H05K2201/0361
摘要： A tri-metallic material (10) for use in the manufacture of printed circuit boards is described and the process for its manufacture is described. The tri-metallic material (10) is a sandwich wherein a copper layer (18,20) is essential the "bread" of the sandwich and an aluminum layer (12) is the filling between both slices of bread. A metallic bonding and/or barrier layer (30,32) is spread on the aluminum (12) and is selected for its highly non-corrosive properties as well as its bonding, and diffusion inhibiting capabilities.
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公开(公告)号：EP1204304B1
公开(公告)日：2004-12-29
申请号：EP01125895.1
申请日：2001-10-30
IPC分类号： H05K1/09 , H05K3/02 , B23K35/00 , B23K20/233
CPC分类号： B32B15/018 , B32B15/017 , C23C2/26 , C23C2/28 , C23C26/00 , H05K3/022 , H05K2201/0361
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5.发明授权
公开(公告)号：EP1204303B1
公开(公告)日：2003-09-17
申请号：EP01125894.4
申请日：2001-10-30
发明人： Achari, Achyuta , Baker, Jay D. , Paruchuri, Mohan R. , Nation, Brenda Joyce , Goenka , Lakhi Nandlal , Stoica, Vladimir
CPC分类号： H05K3/022 , B32B15/017 , B32B15/018 , H05K2201/0361 , Y10T29/49126
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公开(公告)号：EP1204304A2
公开(公告)日：2002-05-08
申请号：EP01125895.1
申请日：2001-10-30
IPC分类号： H05K3/02
CPC分类号： B32B15/018 , B32B15/017 , C23C2/26 , C23C2/28 , C23C26/00 , H05K3/022 , H05K2201/0361
摘要： A tri-metallic material for use in the manufacture of printed circuit boards is described. and the process for its manufacture is described. The tri-metallic material is a sandwich wherein a copper layer is essential the "bread" of the sandwich and an aluminum layer is the filling between both slices of bread. A metallic bonding and/or barrier layer is spread on the aluminum and is selected for its highly non-corrosive properties as well as its bonding, and diffusion inhibiting capabilities.
摘要翻译： 描述了用于制造印刷电路板的三金属材料。 描述了其制造过程。 三金属材料是夹层，其中铜层是三明治的“面包”必不可少的，并且铝层是两片面包之间的填充物。 金属粘合和/或阻挡层散布在铝上，并且因其高度非腐蚀性以及其粘合和扩散抑制能力而被选择。
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