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235 条记录 (耗时 0.019 秒)

    WARM BOND METHOD FOR BUTT JOINING METAL PARTS
    5.
    发明公开
    WARM BOND METHOD FOR BUTT JOINING METAL PARTS 审中-公开
    用于对接连接金属部件的热粘合方法

    公开(公告)号：EP3180137A1

    公开(公告)日：2017-06-21

    申请号：EP15831476.5

    申请日：2015-08-06

    申请人： William Engineering LLC

    发明人： DION, Paul, A. ,  DION, Gregg, A.

    IPC分类号： B21B15/00 ,  B21F15/02 ,  B23K20/02

    CPC分类号： C22C38/18 ,  B23K20/023 ,  B23K20/028 ,  B23K35/004 ,  B23K35/005 ,  B23K35/007 ,  B32B15/01 ,  B32B15/011 ,  B32B15/015 ,  B32B15/018 ,  C22C18/00 ,  C22C38/00

    摘要： A method of solid phase bonding metal pieces by securing a first and second metal pieces in edge to edge contact; subjecting the first and second metal pieces to a first upset comprising heating the first and second edges to a temperature in the range of 0.35-0.95 of the melting temperature of the first and second metal pieces and applying a first axil force to the first and second metal pieces to urge the first and second edges together, to upset the metal at the edge to edge contact and form a bond; and subjecting the bonded metal piece to a second upset comprising heating the bonded metal piece between secured locations to a temperature in the range of 0.35-0.95 of the melting temperature of the metal and applying a second axil force to the bonded metal piece to upset the bonded metal piece and form a solid phase bond.

    摘要翻译： 一种通过以边缘与边缘接触固定第一金属片和第二金属片来固相接合金属片的方法; 使所述第一和第二金属片经受第一缩锻，所述第一缩锻包括将所述第一和第二边缘加热到所述第一和第二金属片的熔化温度的0.35-0.95的范围内的温度，并且将第一腋力施加到所述第一和第二 金属片以将第一和第二边缘推压在一起，以在边缘与边缘接触处使金属镦粗并形成结合; 并且使所述结合的金属片经受第二镦粗，包括将所述结合的金属片在固定位置之间加热至所述金属的熔化温度的0.35-0.95的范围内的温度，并且对所述结合的金属片施加第二腋力以镦粗 结合的金属片并形成固相结合。

    SPARK PLUG
    6.
    发明公开
    SPARK PLUG 审中-公开
    火花塞

    公开(公告)号：EP3073591A1

    公开(公告)日：2016-09-28

    申请号：EP14863887.7

    申请日：2014-09-10

    申请人： NGK Sparkplug Co., Ltd.

    发明人： SUMOYAMA, Daisuke ,  SHIBATA, Tsutomu

    IPC分类号： H01T13/39 ,  C22C5/04 ,  C22C19/03 ,  F02P13/00

    CPC分类号： H01T13/39 ,  B32B15/01 ,  B32B15/018 ,  C22C5/04 ,  C22C19/03 ,  C22C19/05 ,  C22C19/058

    摘要： This invention solves a problem by providing a spark plug featuring excellent durability. The spark plug includes a tip at least one of a center electrode and a ground electrode. The spark plug with excellent durability can be achieved by reducing abnormal erosion of the tip. The spark plug includes the center electrode and the ground electrode. The center electrode is disposed providing a gap with the center electrode. At least one of the center electrode and the ground electrode includes a tip forming the gap. The tip includes a main body portion and a front surface layer. A composition of the main body portion is Pt as a main constituent and Rh of 5 mass% or more and Ni of 0 mass% or more to less than 8 mass%. The front surface layer is disposed at least at a surface radially outside of an axial line extending in a direction from a center of the main body portion to the gap. The front surface layer contains Ni of 8 mass% or more and has a thickness of 2 µm or more.

    摘要翻译： 本发明通过提供具有优异耐久性的火花塞解决了问题。 火花塞包括中心电极和接地电极中的至少一个的尖端。 通过减少尖端的异常腐蚀可以实现具有优异耐久性的火花塞。 火花塞包括中心电极和接地电极。 中心电极设置为与中心电极之间提供间隙。 中心电极和接地电极中的至少一个包括形成间隙的尖端。 尖端包括主体部分和前表面层。 主体部分的组成以Pt为主成分，Rh为5质量％以上，Ni为0质量％以上且小于8质量％。 前表面层至少设置在沿着从主体部分的中心到间隙的方向延伸的轴线的径向外侧的表面处。 表面层含有8质量％以上的Ni，并且具有2μm以上的厚度。

    ELECTROSILVER PLATING FLUID
    7.
    发明公开
    ELECTROSILVER PLATING FLUID 审中-公开
    流体电偶镀银

    公开(公告)号：EP2881497A4

    公开(公告)日：2016-07-27

    申请号：EP13826113

    申请日：2013-05-30

    申请人： DAIWA FINE CHEMICALS CO LTD

    发明人： HOSOKAWA YOHEI ,  HATA TOMOMI ,  YONE NAOKO ,  KADOKAWA TOSHIFUMI ,  SHIGEKUNI YUJI ,  KITAMURA SHINGO ,  YOSHIMOTO MASAKAZU

    IPC分类号： C25D3/46 ,  B32B15/01 ,  C25D9/02

    CPC分类号： C25D3/46 ,  B32B15/018 ,  C25D9/02 ,  C25D11/38 ,  Y10T428/12896

    摘要： Provided is an electrosilver plating bath yielding a semiglossy to glossy appearance across a wide current density range without the use of a cyan compound, and a plating method using the electrosilver plating bath. An electrosilver plating fluid that is an aqueous solution containing (A) at least one soluble silver compound, (B) at least one benzoic acid derivative or a salt of the derivative, and (C) at least one acid and/or complexing agent, wherein the benzoic acid derivative is expressed by the following general formula (m is 1, 2, 3, 4 or 5; Ra is a carboxyl group; individual instances of Rb are selected independently from an aldehyde group, a carboxyl group, an amino group, a hydroxyl group, or a sulfonic acid group; individual instances of Rc are independently oxygen or any substituent; and one or more oxygen or CH 2 may be introduced into the bond between Ra or Rb and a benzene ring.

    ELECTROLESS GOLD PLATING METHOD AND GOLD-PLATE-COATED MATERIAL
    8.
    发明公开
    ELECTROLESS GOLD PLATING METHOD AND GOLD-PLATE-COATED MATERIAL 审中-公开
    VERFAHRENFÜRSTROLLOSE GOLDPLATTIERUNG UND GOLDPLATTIERTES MATERIAL

    公开(公告)号：EP2873752A4

    公开(公告)日：2016-03-23

    申请号：EP13816391

    申请日：2013-07-11

    申请人： TOYO KOHAN CO LTD

    发明人： MUKAI NOBUAKI

    IPC分类号： C23C18/44 ,  C23C18/16 ,  C23C18/36 ,  C23C18/50 ,  H01M8/0228

    CPC分类号： C23C18/1831 ,  B32B15/01 ,  B32B15/017 ,  B32B15/018 ,  C22C5/02 ,  C22C19/00 ,  C22C21/06 ,  C23C18/165 ,  C23C18/1651 ,  C23C18/36 ,  C23C18/42 ,  C23C18/44 ,  C23C18/50 ,  C23C28/021 ,  H01M8/0228 ,  Y10T428/12889

    摘要： There is provided a method of electroless gold plating, wherein the method includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by means of electroless reduction plating using a cyanide-free gold plating bath, wherein the method is characterized in that the underlying alloy layer is formed of an M1-M2-M3 alloy (where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru, and M3 is at least one element selected from P and B).

    摘要翻译： 提供了一种无电镀金的方法，其中该方法包括在基材上形成下面的合金层的步骤，以及通过使用氰化物的无电还原电镀直接在下面的合金层上形成金板层的步骤 其特征在于，下面的合金层由M1-M2-M3合金（其中M1是选自Ni，Fe，Co，Cu，Zn和Sn中的至少一种元素，M2，M2 是选自Pd，Re，Pt，Rh，Ag和Ru中的至少一种元素，M3是选自P和B中的至少一种元素）。