Cladded material construction for etched-tri-metal circuits
    4.
    发明公开
    Cladded material construction for etched-tri-metal circuits 有权
    蚀刻三金属电路的覆层材料结构

    公开(公告)号:EP1204303A2

    公开(公告)日:2002-05-08

    申请号:EP01125894.4

    申请日:2001-10-30

    IPC分类号: H05K3/02

    摘要: A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer on the outside surface of the tri-metal material. Alternatively bonding materials may be used on the intermediate surfaces; such bonding materials can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.

    摘要翻译: 涉及使用包壳磨的成套三金属材料的方法。 当形成多组三金属材料时,每组的外表面通过氧化制备以防止每组粘附在上面或下面的组。 氧化的替代方案是在三金属材料的外表面上提供可去除的层。 可选地,结合材料可以用在中间表面上; 这种粘合材料可以选自锡,镍,钛,铬,银和锌。