专利检索 ap:("Wolfspeed, Inc.") AND inv:"LEE, Kyoung-Keun" 第 1 页

1.

发明公开
SEMICONDUCTORS WITH IMPROVED THERMAL BUDGET AND PROCESS OF MAKING SEMICONDUCTORS WITH IMPROVED THERMAL BUDGET 审中-公开

公开(公告)号：EP4038659A1

公开(公告)日：2022-08-10

申请号：EP20890348.4

申请日：2020-11-17

申请人： Wolfspeed, Inc.

发明人： LEE, Kyoung-Keun

IPC分类号： H01L21/768 , H01L23/48 , H01L23/498

2.

发明公开
MULTILAYER ENCAPSULATION FOR HUMIDITY ROBUSTNESS AND HIGHLY ACCELERATED STRESS TESTS AND RELATED FABRICATION METHODS 审中-实审

公开(公告)号：EP4348707A1

公开(公告)日：2024-04-10

申请号：EP22735056.8

申请日：2022-05-24

申请人： Wolfspeed, Inc.

发明人： LEE, Kyoung-Keun , ETTER, Daniel , RADULESCU, Fabian , SHEPPARD, Scott , NAMISHIA, Daniel

IPC分类号： H01L23/31 , H01L23/29 , H01L23/053 , H01L23/482

3.

发明公开
FIELD EFFECT TRANSISTOR WITH MODIFIED ACCESS REGIONS 审中-实审

公开(公告)号：EP4352790A1

公开(公告)日：2024-04-17

申请号：EP22805538.0

申请日：2022-05-20

申请人： Wolfspeed, Inc.

发明人： LEE, Kyoung-Keun , RADULESCU, Fabian , SHEPPARD, Scott

IPC分类号： H01L29/778 , H01L29/772 , H01L29/812

CPC分类号： H01L29/66462 , H01L29/2003 , H01L29/7786 , H01L29/0657 , H01L29/0603 , H01L29/0692 , H01L24/48 , H01L2224/4824720130101 , H01L2224/3224520130101 , H01L2224/7326520130101 , H01L2924/18120130101 , H01L2924/17120130101 , H01L2924/16120130101 , H01L24/32 , H01L2924/142120130101 , H01L2224/4917520130101 , H01L24/49 , H01L2224/4509920130101