公开(公告)号：EP4437588A1

公开(公告)日：2024-10-02

申请号：EP22914071.0

申请日：2022-12-06

申请人： Yangtze Memory Technologies Co., Ltd.

发明人： ZENG, Xinru ,  CHEN, Peng ,  ZHOU, HouDe

IPC分类号： H01L25/065 ,  H01L25/18 ,  H01L23/485 ,  H01L21/56 ,  H01L21/60

CPC分类号： H01L2224/4814720130101 ,  H01L2224/9620130101 ,  H01L2224/1820130101 ,  H01L2224/4809120130101 ,  H01L2224/4822720130101 ,  H01L2924/18120130101 ,  H01L2224/3214520130101 ,  H01L2224/7326520130101 ,  H01L25/18 ,  H01L25/0657 ,  H01L25/0652 ,  H01L25/50 ,  H01L2225/0650620130101 ,  H01L2225/0654820130101 ,  H01L2225/0652420130101 ,  H01L2225/0656220130101 ,  H01L21/568 ,  H01L23/3135 ,  H01L24/13

公开(公告)号：EP3163613B1

公开(公告)日：2024-08-21

申请号：EP16188869.8

申请日：2016-09-15

IPC分类号： H01L23/485 ,  H01L21/60 ,  H01L25/065 ,  H01L23/31 ,  H01L23/433 ,  H01L23/552 ,  H01L21/98

CPC分类号： H01L2224/0556920130101 ,  H01L2224/1300520130101 ,  H01L2224/8101120130101 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3192 ,  H01L23/4334 ,  H01L21/561 ,  H01L23/552 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/0500820130101 ,  H01L2224/0554820130101 ,  H01L2224/0556720130101 ,  H01L2224/0561120130101 ,  H01L2224/0562420130101 ,  H01L2224/0563920130101 ,  H01L2224/0564420130101 ,  H01L2224/0564720130101 ,  H01L2224/0565520130101 ,  H01L2224/0566420130101 ,  H01L2224/113220130101 ,  H01L2224/114520130101 ,  H01L2224/1145220130101 ,  H01L2224/114620130101 ,  H01L2224/114720130101 ,  H01L2224/1301320130101 ,  H01L2224/1301420130101 ,  H01L2224/1302220130101 ,  H01L2224/1308220130101 ,  H01L2224/1311120130101 ,  H01L2224/1311320130101 ,  H01L2224/1311620130101 ,  H01L2224/1312420130101 ,  H01L2224/1313920130101 ,  H01L2224/1314420130101 ,  H01L2224/1314720130101 ,  H01L2224/1315520130101 ,  H01L2224/1318420130101 ,  H01L2224/1605720130101 ,  H01L2224/1623820130101 ,  H01L2224/3224520130101 ,  H01L2224/7325320130101 ,  H01L2224/8102420130101 ,  H01L2224/8119120130101 ,  H01L2224/8181520130101 ,  H01L2224/9420130101 ,  H01L2224/9720130101 ,  H01L2924/384120130101 ,  H01L2224/1316620130101 ,  H01L23/49827 ,  H01L2924/18120130101 ,  H01L25/0655

公开(公告)号：EP3605594B1

公开(公告)日：2024-05-29

申请号：EP18775856.0

申请日：2018-03-26

IPC分类号： H01L21/338 ,  H01L21/337 ,  H01L29/778 ,  H01L29/808 ,  H01L29/812 ,  H03K17/687 ,  H01L23/495 ,  H01L23/49 ,  H01L23/488 ,  H01L23/485

CPC分类号： H03K17/687 ,  H01L29/778 ,  H01L29/808 ,  H01L29/812 ,  H01L2224/4813720130101 ,  H01L2224/4824720130101 ,  H01L2224/0404220130101 ,  H01L2224/0605120130101 ,  H01L2224/060320130101 ,  H01L2224/4911120130101 ,  H01L2224/4825720130101 ,  H01L2224/4910920130101 ,  H01L24/49 ,  H01L23/49575 ,  H01L2224/2913920130101 ,  H01L2224/3224520130101 ,  H01L23/49562 ,  H01L23/49506 ,  H01L23/49531 ,  H01L2924/18120130101 ,  H01L2224/4512420130101 ,  H01L24/45 ,  H01L2224/4917520130101 ,  H01L2224/0555420130101 ,  H01L2224/0555320130101 ,  H01L2224/4911220130101 ,  H01L2924/0001420130101 ,  H01L24/32 ,  H01L24/06 ,  H01L24/05 ,  H01L2224/261220130101

公开(公告)号：EP4372804A2

公开(公告)日：2024-05-22

申请号：EP24168274.9

申请日：2013-09-13

申请人： Rohm Co., Ltd.

发明人： HANADA, Toshio

IPC分类号： H01L23/373

CPC分类号： H01L23/3735 ,  H01L23/49811 ,  H01L23/49844 ,  H01L2224/4822720130101 ,  H01L2224/4911320130101 ,  H01L2924/1027220130101 ,  H01L2924/1203220130101 ,  H01L2924/1309120130101 ,  H01L2924/1910720130101 ,  H01L2924/3010720130101 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/0404220130101 ,  H01L2224/3222520130101 ,  H01L2224/3224520130101 ,  H01L2224/3318120130101 ,  H01L2224/7321520130101 ,  H01L2224/7326520130101 ,  H01L2224/9224720130101 ,  H02M7/003 ,  H01L2924/1305520130101 ,  H01L2924/130520130101 ,  H01L2924/18120130101 ,  H01L2924/0001420130101 ,  H01L25/115 ,  H01L2924/1910520130101 ,  H01L2224/060320130101 ,  H01L2224/490320130101 ,  Y02B70/10

摘要： A power module semiconductor device (1) includes: an insulating substrate (10) having a first side, a second side adjacent to the first side, a third side opposite to the first side, and a fourth side opposite to the second side; a first pattern (D(K4)) disposed on a front surface of the insulating substrate (10); first semiconductor chips (Q4) disposed on the first pattern (D(K4)); a negative side power input terminal (N) electrically connected to the first semiconductor chips (Q4), the negative side power input terminal being disposed on the first side of the insulating substrate (10); a first signal terminal (S4,G4,T4) electrically connected to the first semiconductor chips (Q4); a second pattern (D(K1)) disposed on the front surface of the insulating substrate (10); second semiconductor chips (Q1) disposed on the second pattern (D(K1)); a positive side power input terminal (P) electrically connected to the second semiconductor chips (Q1), the positive side power input terminal being disposed on the first side of the insulating substrate (10); a second signal terminal (S1,G1,T1) electrically connected to the second semiconductor chips (Q1); an output terminal (O) electrically connected to the first semiconductor chips (Q4) and the second semiconductor chips (Q1), the output terminal being arranged on the third side of the insulating substrate (10); and a resin layer (12) having a main surface and a side surface and covering the first semiconductor chips (Q4), the second semiconductor chips (Q1), a part of the negative side power input terminal (N), a part of the positive side power input terminal (P), a part of the output terminal (O) and the insulating substrate (10). The negative side power input terminal (N) and the positive side power input terminal (P) are disposed so as to be extended along in a parallel direction with the main surface of the resin layer (12), and the output terminal (P) is disposed so as to be extended along in the parallel direction.

公开(公告)号：EP3780100B1

公开(公告)日：2024-05-22

申请号：EP20188729.6

申请日：2020-07-30

IPC分类号： H01L25/07 ,  H01L23/538 ,  H01L23/373 ,  H01L23/488 ,  H01L21/98 ,  H01L21/60 ,  H01L23/16 ,  H01L23/433 ,  H01L25/18 ,  H01L23/495 ,  H01L23/31

CPC分类号： H01L23/5385 ,  H01L23/3735 ,  H01L25/071 ,  H01L2924/1309120130101 ,  H01L2224/3222720130101 ,  H01L2224/4022720130101 ,  H01L2224/8481520130101 ,  H01L2224/7326320130101 ,  H01L2224/9224620130101 ,  H01L24/32 ,  H01L24/40 ,  H01L24/84 ,  H01L2224/8436520130101 ,  H01L2224/4099120130101 ,  H01L2224/4049920130101 ,  H01L24/33 ,  H01L2224/2614520130101 ,  H01L2224/2929420130101 ,  H01L2224/29320130101 ,  H01L2224/8381520130101 ,  H01L2224/8338520130101 ,  H01L2224/8438520130101 ,  H01L2224/8336520130101 ,  H01L24/83 ,  H01L24/48 ,  H01L2924/0001420130101 ,  H01L2224/4822720130101 ,  H01L2224/7326520130101 ,  H01L2224/7321520130101 ,  H01L2224/7322120130101 ,  H01L24/29 ,  H01L2224/3318120130101 ,  H01L24/73 ,  H01L24/92 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/3107 ,  H01L23/16 ,  H01L23/49575 ,  H01L23/4334 ,  H01L25/18 ,  H01L2224/060320130101 ,  H01L2924/18120130101

公开(公告)号：EP4352786A1

公开(公告)日：2024-04-17

申请号：EP22731411.9

申请日：2022-05-24

申请人： Wolfspeed, Inc.

发明人： RICE, David ,  FISHER, Jeremy

IPC分类号： H01L23/66 ,  H03F1/56

CPC分类号： H01L23/66 ,  H01L2223/661120130101 ,  H01L2223/664420130101 ,  H01L2223/662720130101 ,  H01L2223/665520130101 ,  H01L2223/667220130101 ,  H01L24/42 ,  H03F1/565 ,  H01L2924/1910720130101 ,  H01L2924/1904120130101 ,  H01L2924/1910520130101 ,  H01L2924/1519220130101 ,  H01L2924/1901120130101 ,  H01L2224/4819520130101 ,  H01L2924/1904220130101 ,  H01L2924/1904320130101 ,  H01L24/32 ,  H01L2224/3224520130101 ,  H01L2224/7326520130101 ,  H01L2224/4917520130101 ,  H01L24/49 ,  H01L2224/4809120130101 ,  H01L2924/18120130101 ,  H01L24/48 ,  H01L2924/0001420130101 ,  H01L24/73 ,  H01L2924/1619520130101 ,  H03F3/195 ,  H03F1/0288 ,  H03F3/245

公开(公告)号：EP4062447B1

公开(公告)日：2024-04-17

申请号：EP20861958.5

申请日：2020-11-12

IPC分类号： H01L23/495

CPC分类号： H01L23/49568 ,  H01L23/49537 ,  H01L23/49589 ,  H01L2224/7326520130101 ,  H01L2224/4847220130101 ,  H01L2224/4822720130101 ,  H01L2924/18120130101 ,  H01L2224/3222520130101

公开(公告)号：EP3424077B1

公开(公告)日：2024-04-17

申请号：EP17710145.8

申请日：2017-02-27

IPC分类号： H01L21/78 ,  H01L21/56

CPC分类号： H01L21/78 ,  H01L21/561 ,  H01L2924/18120130101 ,  H01L23/3114 ,  H01L23/3135 ,  H01L2224/1624520130101 ,  H01L2224/4809120130101 ,  H01L2224/4824720130101 ,  H01L2224/4846520130101 ,  H01L2224/7325720130101 ,  H01L2224/0618120130101 ,  H01L23/49562 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/9420130101 ,  H01L2224/9620130101 ,  H01L2224/0300220130101 ,  H01L2224/3224520130101 ,  H01L2224/7326520130101 ,  H01L2224/0402620130101 ,  H01L2224/0404220130101 ,  H01L24/06 ,  H01L24/48 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/0216620130101 ,  H01L2224/060320130101

公开(公告)号：EP4427906A2

公开(公告)日：2024-09-11

申请号：EP24184101.4

申请日：2009-08-27

申请人： Nichia Corporation

发明人： ICHIKAWA, Hirofumi ,  HAYASHI, Masaki ,  SASAOKA, Shimpei ,  MIKI, Tomohide

IPC分类号： B29C45/14

CPC分类号： B29C45/0055 ,  B29C45/14655 ,  B29C2793/00920130101 ,  H01L33/60 ,  H01L2224/4809120130101 ,  H01L2224/4824720130101 ,  H01L2933/003320130101 ,  H01L2933/006620130101 ,  H01L24/97 ,  H01L2924/302520130101 ,  H01L2924/1204120130101 ,  H01L2924/18120130101 ,  H01L2924/1203520130101 ,  H01L2924/1204220130101 ,  H01L2224/4825720130101 ,  H01L33/0095 ,  H01L33/641 ,  H01L33/486 ,  H01L33/62

摘要： Provided is a simple and low-cost method for manufacturing, in a short time, many light emitting devices wherein adhesiveness between a leadframe and a thermosetting resin composition is high. The method for manufacturing the light emitting device having a resin package (20) wherein the optical reflectivity at a wavelength of 350-800 nm after thermal curing is 70% or more and a resin section (25) and a lead (22) are formed on substantially a same surface on an outer surface (20b) has: a step of sandwiching a leadframe (21) provided with a notched section (21a) by an upper molding die (61) and a lower molding die (62); a step of transfer-molding a thermosetting resin (23) containing a light-reflecting substance (26), in a molding die (60) sandwiched by the upper molding die (61) and the lower molding die (62) and forming a resin-molded body (24) on the leadframe (21); and a step of cutting the resin-molded body (24) and the leadframe (21) along the notched section (21a).

公开(公告)号：EP3471137B1

公开(公告)日：2024-07-31

申请号：EP17813225.4

申请日：2017-06-09

IPC分类号： H01L23/31 ,  H01L23/373 ,  H01L23/42 ,  H01L23/433

CPC分类号： H01L2924/18120130101 ,  H01L2224/4020130101 ,  H01L2224/4809120130101 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/4334 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/29 ,  H01L2924/1309120130101 ,  H01L2924/1305520130101 ,  H01L2224/8480120130101 ,  H01L2224/848420130101 ,  H01L24/84 ,  H01L2224/7322120130101