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公开(公告)号:EP3660189B1
公开(公告)日:2023-11-15
申请号:EP20152479.0
申请日:2015-03-24
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公开(公告)号:EP3758049B8
公开(公告)日:2022-03-23
申请号:EP19182628.8
申请日:2019-06-26
发明人: Pretscher, Rüdiger
IPC分类号: H01L21/67 , H01L21/677 , H01L21/687
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3.
公开(公告)号:EP4407067A1
公开(公告)日:2024-07-31
申请号:EP23153169.0
申请日:2023-01-24
IPC分类号: C23C18/44
CPC分类号: C23C18/44
摘要: An aqueous precious metal plating bath, comprising (a) at least one source of precious metal ions; (b) at least one source of hexacyanoferrate (II) ions and/or hexacyanoferrate (III) ions; (c) optionally, at least one source of halogenide; (d) at least one complexing agent; (e) at least one reducing agent for precious metal ions; (f) optionally at least one wetting agent; and (g) optionally, at least one accelerator and a method of depositing of precious metal. The aqueous precious metal plating bath is suitable to provide soft precious metal layers useful for wire bonding and soldering applications which are required for electronic components.
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4.
公开(公告)号:EP4352277A1
公开(公告)日:2024-04-17
申请号:EP22733030.5
申请日:2022-06-09
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公开(公告)号:EP3227473B1
公开(公告)日:2024-04-03
申请号:EP15802167.5
申请日:2015-12-02
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6.
公开(公告)号:EP3607116B1
公开(公告)日:2022-12-21
申请号:EP18714275.7
申请日:2018-04-04
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7.
公开(公告)号:EP3607115B1
公开(公告)日:2022-06-08
申请号:EP18713988.6
申请日:2018-04-04
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8.
公开(公告)号:EP3761348B1
公开(公告)日:2024-03-27
申请号:EP19184721.9
申请日:2019-07-05
IPC分类号: H01L21/67 , H01L21/677
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公开(公告)号:EP3933073B1
公开(公告)日:2023-11-29
申请号:EP20182963.7
申请日:2020-06-29
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公开(公告)号:EP3932154B1
公开(公告)日:2023-07-26
申请号:EP20706318.1
申请日:2020-02-27
发明人: TANG, Felix , MICHALIK, Fabian , THOMAS, Thomas , BELOVA-MAGRI, Valentina , CHO, Wonjin , XIAO, Ting , MERSCHKY, Michael , KÖNIGSMANN, Tatjana
IPC分类号: H05K3/38
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