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    LIQUID COOLING LOOPS FOR SERVER APPLICATIONS
    5.
    发明公开
    LIQUID COOLING LOOPS FOR SERVER APPLICATIONS 有权
    用于服务器应用的液体冷却回路

    公开(公告)号：EP1987309A2

    公开(公告)日：2008-11-05

    申请号：EP07751027.9

    申请日：2007-02-16

    申请人： Cooligy, Inc.

    发明人： CHOW, Norman ,  TSAO, Paul ,  WERNER, Douglas, E. ,  MCMASTER, Mark ,  UPADHYA, Girish ,  LANDRY, Frederic ,  SPEARING, Ian ,  SCHRADER, Tim

    IPC分类号： F28F1/08

    CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

    摘要： A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.

    摘要翻译： 安装系统提供了一种机制和形式因素，用于将来自服务器机架的热交换器与来自电子服务器的热交换器热接触。 为确保良好的热接触，在两个热交换器，排除板和机箱冷板之间施加压力。 用于接合和脱离热交换器的安装机构被配置为隔离施加到两个热交换器的力。 安装机构包括联锁机构，该联锁机构防止所施加的力传递到电子服务器的其余部分。 在不隔离该力的情况下，该力被施加到电子服务器和/或机架底盘，可能断开电子服务器和机架之间的电连接，并且向电子服务器和机架底盘提供机械应力。 安装机构也耦合到电子服务器锁定机构，使得将电子服务器锁定到机架中的动作导致热交换器进行热接触。 这是一个故障安全程序，因为不需要单独的过程来启用电子服务器冷却回路。

    THERMAL BUS OR JUNCTION FOR THE REMOVAL OF HEAT FROM ELECTRONIC COMPONENTS
    7.
    发明公开
    THERMAL BUS OR JUNCTION FOR THE REMOVAL OF HEAT FROM ELECTRONIC COMPONENTS 审中-公开
    热总线或过渡FOR热量从元器件拆卸

    公开(公告)号：EP2269426A1

    公开(公告)日：2011-01-05

    申请号：EP09719534.1

    申请日：2009-03-10

    申请人： Cooligy, Inc.

    发明人： HOM, James ,  BREWER, Richard, Grant ,  CHOI, Hae-won

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20781 ,  E05D11/0081 ,  E05Y2800/10 ,  E05Y2900/132

    摘要： A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes one or more heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes swivel joints configured to provide a fluid path between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the fluid path through the swivel joint.

    LIQUID COOLING LOOPS FOR SERVER APPLICATIONS
    9.
    发明公开
    LIQUID COOLING LOOPS FOR SERVER APPLICATIONS 审中-公开
    液体冷却回路的服务器应用程序

    公开(公告)号：EP1989935A2

    公开(公告)日：2008-11-12

    申请号：EP07751026.1

    申请日：2007-02-16

    申请人： Cooligy, Inc.

    发明人： UPADHYA, Girish ,  MUNCH, Mark ,  CHOW, Norman ,  TSAO, Paul ,  WERNER, Douglas, E. ,  MCMASTER, Mark ,  LANDRY, Frederic ,  SPEARING, Ian ,  SCHRADER, Tim

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

    摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

    THERMAL BUS OR JUNCTION FOR THE REMOVAL OF HEAT FROM ELECTRONIC COMPONENTS
    10.
    发明公开
    THERMAL BUS OR JUNCTION FOR THE REMOVAL OF HEAT FROM ELECTRONIC COMPONENTS 审中-公开
    热总线或过渡FOR热量从元器件拆卸

    公开(公告)号：EP2269426A4

    公开(公告)日：2013-01-09

    申请号：EP09719534

    申请日：2009-03-10

    申请人： COOLIGY INC

    发明人： HOM JAMES ,  BREWER RICHARD GRANT ,  CHOI HAE-WON

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20781 ,  E05D11/0081 ,  E05Y2800/10 ,  E05Y2900/132

    摘要： A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes one or more heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes swivel joints configured to provide a fluid path between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the fluid path through the swivel joint.