公开(公告)号：EP4129890B1

公开(公告)日：2024-07-03

申请号：EP21796327.1

申请日：2021-04-28

IPC分类号： B81C1/00 ,  B82Y40/00 ,  G02B5/18

CPC分类号： B81C2201/013220130101 ,  B81B2203/038420130101 ,  B81C1/00626 ,  B81B2201/04720130101 ,  B82Y30/00 ,  G02B5/1895 ,  G02B5/1857

公开(公告)号：EP4364187A1

公开(公告)日：2024-05-08

申请号：EP22737799.1

申请日：2022-06-20

申请人： JENOPTIK Optical Systems GmbH

发明人： PANITZ, Meik ,  RAUPACH, Lutz ,  TILKE, Martin ,  ZYBELL, Sabine

IPC分类号： H01L21/3213 ,  H01L21/768

CPC分类号： B81C2201/013220130101 ,  B81C1/00579 ,  B81C1/00396 ,  H01L21/0332 ,  H01L21/0337 ,  H01L21/32139

公开(公告)号：EP3024777B1

公开(公告)日：2024-05-15

申请号：EP14829850.8

申请日：2014-07-23

IPC分类号： B82B3/00 ,  B82B1/00

CPC分类号： B81C1/00031 ,  B81C2201/013220130101 ,  C09J7/22 ,  H01J37/32082 ,  H01J37/32541 ,  C09J2301/30220200801 ,  F24S70/60

公开(公告)号：EP4026796B1

公开(公告)日：2024-09-11

申请号：EP20873838.5

申请日：2020-10-09

IPC分类号： B81B3/00 ,  H02N1/08 ,  B81C1/00

CPC分类号： H02N1/08 ,  B81B2203/013620130101 ,  B81B2203/03320130101 ,  B81B2203/05120130101 ,  B81C1/00571 ,  B81C2201/013220130101

公开(公告)号：EP4421022A1

公开(公告)日：2024-08-28

申请号：EP23158813.8

申请日：2023-02-27

申请人： Murata Manufacturing Co., Ltd.

发明人： TORKKELI, Altti ,  FUKUMITSU, Mazakasu ,  BLOMQVIST, Anssi ,  MATTI, Liukku ,  RYTKÖNEN, Ville-Pekka ,  OKAWA, Tadayuki ,  KILPINEN, Petteri

IPC分类号： B81B7/00

CPC分类号： B81B7/0048 ,  B81B2201/022820130101 ,  B81C2203/03620130101 ,  B81C2201/013220130101 ,  B81C2201/013320130101 ,  B81C2203/011820130101 ,  B81B2207/01220130101 ,  B81B2207/0720130101 ,  B81B2207/09220130101 ,  B81B2207/09520130101

摘要： The present invention relates to a MEMS device and a method of manufacturing a MEMS device. The MEMS device comprises a handle layer comprising at least one cavity and at least one suspension structure, a first device layer comprising at least one static electrode, a second device layer comprising at least one seismic element moveably suspended above the first device layer and a cap layer. The at least one seismic element acts as the at least one moveable electrode or the at least one seismic element is mechanically coupled to move with the at least one moveable electrode. The handle layer, the first device layer, the second device layer and the cap layer, a first electrically insulating layer between the handle layer and the first device layer, and a second electrically insulating layer between the first device layer and the second device layer are configured to form an enclosure comprising the at least one seismic element, at least one static electrode and the at least one moveable electrode.