摘要:
Die Erfindung betrifft ein Verfahren zur Herstellung eines Schall- und/oder Wärmedämmelements unter Verwendung schäumbarer und/oder vorgeschäumter Polymer-Partikel, die mit einem Bindemittel, vorzugsweise mit einem organischen Bindemittel, beschichtet und anschließend einem Formgebungsprozess unterzogen werden, bei dem die Polymer-Partikel miteinander verklebt und/oder versintert werden, wobei die Verklebung mittels des Bindemittels bewirkt wird. Erfindungsgemäß wird zum Beschichten der schäumbaren und/oder vorgeschäumten Polymer-Partikel ein nicht-hydrophiles Bindemittel verwendet. Ferner betrifft die Erfindung ein Schall- und/oder Wärmedämmelement.
摘要:
Polyolefin films having improved impermeability to gases and vapors, are coated on one or both sides with a layer of a copolymer containing hydroxyl, carboxyl and, optionally, ester groups, which has been obtained by hydrolysis of copolymers consisting of an unsaturated ester and of an unsaturated acid or a corresponding anhydride.
摘要:
The invention relates to a method for producing a sound- and/or heat-insulating element by using foamable and/or pre-foamed polymer particles, which are coated with a binder, preferably an organic binder, and then subjected to a shaping process, wherein the polymer particles are adhesively bonded to each other and/or sintered to each other, wherein the adhesive bonding is effected by means of the binder. According to the invention, a non-hydrophilic binder is used to coat the foamable and/or pre-foamed polymer particles. The invention further relates to a sound- and/or heat-insulating element.
摘要:
The present invention provides a heat-curable resin composition, which comprises (1) a heat-curable resin mixture comprising a heat-curable resin (a) and thickener particles (b) and exhibiting a viscosity (150°C) after having been held at a temperature of 150°C for 30 seconds that is a viscosity (S), and (2) a curing agent, and is characterized in that the heat-curable resin composition exhibits a lowest viscosity (R) at 80-120°C, the lowest viscosity (R) is 0.1-10 Pa·s, and the viscosity (S) and lowest viscosity (R) satisfy the relationship of formula (1): 5
摘要:
The present invention relates to coated, molded polyoxymethylene objects, which contain at least one polyoxymethylene homopolymer or copolymer A), as well as optionally further additives B) and are coated at the surface with at least one binder C) and a formaldehyde scavenger D), characterized in that, as binder C), a polyalkylene oxide C1 or a polyvinyl ester or a grafted copolymer C3 of C1 and C2 or the mixtures thereof is used as binder C) and at least one lysine compound is used as formaldehyde scavenger D).
摘要:
Polyolefin films having improved impermeability to gases and vapors, are coated on one or both sides with a layer of a copolymer containing hydroxyl, carboxyl and, optionally, ester groups, which has been obtained by hydrolysis of copolymers consisting of an unsaturated ester and of an unsaturated acid or a corresponding anhydride.
摘要:
High-density polyethylene mixed resin particles used as seed particles during seed polymerization, wherein said seed particles contain a mixed resin of 100 parts by weight of high-density polyethylene and 20 to 100 parts by weight of an ethylene copolymer; said high-density polyethylene has a density of 935 to 960 kg/m 3 and a softening temperature of 115 to 130°C; said ethylene copolymer is a copolymer of an ester-based monomer selected from an acrylic acid alkyl ester and an aliphatic saturated monocarboxylic acid vinyl, and etylene, contains 1 to 20% by weight of an ester-based monomer-derived component, and has a softening temperature of 75 to 110°C; said acrylic acid alkyl ester is selected from methyl acrylate and ethyl acrylate; and said aliphatic saturated monocarboxylic acid vinyl is selected from vinyl acetate and vinyl propionate.
摘要:
The present invention provides a heat-curable resin composition, which comprises (1) a heat-curable resin mixture comprising a heat-curable resin (a) and thickener particles (b) and exhibiting a viscosity (150°C) after having been held at a temperature of 150°C for 30 seconds that is a viscosity (S), and (2) a curing agent, and is characterized in that the heat-curable resin composition exhibits a lowest viscosity (R) at 80-120°C, the lowest viscosity (R) is 0.1-10 Pa·s, and the viscosity (S) and lowest viscosity (R) satisfy the relationship of formula (1): 5