公开(公告)号：EP4369967A1

公开(公告)日：2024-05-22

申请号：EP22743492.5

申请日：2022-07-15

Applicant: Nicoventures Trading Limited

Inventor： BURGESS, Jonathan Neil ,  MCGRATH, Conor

IPC: A24F40/465 ,  H05B6/10 ,  H05K9/00 ,  C08K3/01

CPC classification number: A24F40/465 ,  A24F40/20 ,  H05B6/108 ,  C08K2201/00120130101 ,  C08K3/04 ,  C08K3/14 ,  C08K3/28 ,  C08K3/22

公开(公告)号：EP4365153A1

公开(公告)日：2024-05-08

申请号：EP23150329.3

申请日：2023-01-04

Applicant: II-VI Delaware, Inc.

Inventor： Salamone, Sam ,  McAnany, Sean ,  Evans, Glenn

IPC: C04B37/00 ,  C04B37/02 ,  C08K3/04 ,  C08K3/14 ,  C08K3/34 ,  C09J163/00

CPC classification number: C04B2237/36520130101 ,  C09J163/00 ,  C08K3/04 ,  C08K3/14 ,  C08K3/34 ,  C04B2235/543620130101 ,  C04B37/003 ,  C04B37/005 ,  C04B2237/08320130101 ,  C04B2237/6020130101 ,  C04B2237/6120130101 ,  C04B2235/42720130101 ,  C04B2235/4820130101 ,  C04B2235/72820130101 ,  C04B37/008

Abstract: An epoxy-based glue includes an epoxy material, and a solids component including diamond powder and silicon-carbide particles. The adhesive material may be used to form reaction-bonded silicon-carbide bonding reaction-bonded silicon-carbide parts together. The present disclosure also relates to a method of assembling a product from preforms (42, 44), including locating an adhesive layer (46), containing diamond powder (54) and silicon carbide particles (56), between opposed preform surfaces, carbonizing the layer, and infiltrating molten silicon into the preforms and the carbonized layer to convert the preforms into corresponding reaction-bonded silicon-carbide parts, and to convert the carbonized layer into a reaction-bonded silicon-carbide bonding region with a reduced amount of residual silicon. An assembled product, including at least two reaction-bonded silicon-carbide parts bonded together by processing a diamond-containing adhesive, is also disclosed.

公开(公告)号：EP4352145A1

公开(公告)日：2024-04-17

申请号：EP22820794.0

申请日：2022-06-02

Applicant: Henkel AG & Co. KGaA

Inventor： WU, Chunyong ,  TIMMERMAN, John ,  CHESTERFIELD, Reid John ,  QIAN, Yuqiang

IPC: C08K3/04 ,  C08K3/013 ,  C08K9/04 ,  C08L101/10 ,  H01M10/613

CPC classification number: C08L101/10 ,  C08K9/04 ,  C08K3/04 ,  C08K2201/00120130101 ,  C08K2201/00520130101 ,  C08K3/38 ,  C08K3/28 ,  C08K3/22 ,  C08K3/14 ,  C08K2003/38520130101 ,  C08K2003/28220130101 ,  C08K2003/222720130101 ,  C08K3/34 ,  C08K3/36 ,  C08K2003/22220130101 ,  C08K2003/222420130101 ,  C08K2003/229620130101 ,  C08K9/06 ,  H01M10/653

公开(公告)号：EP2527414B1

公开(公告)日：2018-07-04

申请号：EP10844032.2

申请日：2010-05-14

Applicant: Korea Electrotechnology Research Institute

Inventor： PARK, Hoy-yul ,  AHN, Myeong-sang ,  KANG, Dong-jun ,  JUNG, Dae-young

IPC: C09D183/00 ,  C09D201/00 ,  C09D5/00 ,  H05K7/20

CPC classification number: H01L23/36 ,  C08K3/04 ,  C08K3/14 ,  C08K3/22 ,  C08K3/24 ,  C08K3/34 ,  C09D1/00 ,  C09D7/61 ,  H01L23/3737 ,  H01L2924/0002 ,  Y10T428/31511 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31525 ,  Y10T428/31529 ,  Y10T428/31663 ,  Y10T428/31667 ,  H01L2924/00

Abstract: The present invention relates to a heat dissipation coating agent and to a heat-dissipating plate including same, which efficiently dissipate heat from the surface of a heat-dissipating plate of an electric/electronic component. Particularly, the heat dissipation coating agent, which is applied to the surface of a heat-dissipating plate of an electric/electronic component, includes infrared radiation powder and a binder, and the heat-dissipating plate is coated with a heat dissipation layer consisting of the heat dissipation coating agent. Since the heat dissipation coating agent applied to the heat-dissipating plate is highly conductive, heat is emitted from the heat-dissipating plate by conduction as well as convection. In particular, the heat dissipation coating agent, which conducts heat with high conductivity, can be applied to a heat-dissipating plate of a high-power LED light source.

公开(公告)号：EP2766427B1

公开(公告)日：2017-05-31

申请号：EP12770514.3

申请日：2012-10-15

Applicant: Total Research & Technology Feluy

Inventor： BOUVY, Claire ,  LHOST, Olivier ,  DUPIRE, Marc ,  NAVEZ, Pascal ,  DELHALLE, Joseph ,  MEKHALIF, Zineb ,  DETRICHE, Simon

IPC: C08L23/06 ,  C08J3/20 ,  C08J3/22 ,  C08J5/00 ,  B82Y30/00 ,  C08L23/12 ,  C08K7/24 ,  C08L23/02 ,  C08K3/04

CPC classification number: C08L23/12 ,  B82Y30/00 ,  C08J3/226 ,  C08J2323/02 ,  C08J2423/02 ,  C08K3/04 ,  C08K3/041 ,  C08K3/042 ,  C08K3/046 ,  C08K3/14 ,  C08K3/34 ,  C08K3/36 ,  C08K7/24 ,  C08K2201/011 ,  C08L23/06 ,  Y10S977/742 ,  C08L23/00

Abstract: A nanocomposite can include a polyolefin composition having at least one polyolefin. The polyolefin composition can have a multimodal molecular weight distribution, such as a bimodal molecular weight distribution. The nanocomposite can also include at least 5% by weight of nanoparticles, relative to a total weight of the nanocomposite. The nanoparticles can be carbon nanoparticles, silicon nanoparticles, or SiC nanoparticles. A nanocomposite masterbatch can be prepared by melt blending the polyolefin composition with the nanoparticles. A polyolefin resin can be prepared by blending the nanocomposite with a polyolefin. Formed articles can include the polyolefin resin.

Abstract translation: 纳米复合材料可以包括具有至少一种聚烯烃的聚烯烃组合物。 聚烯烃组合物可以具有多峰分子量分布，例如双峰分子量分布。 相对于纳米复合材料的总重量，纳米复合材料还可以包含至少5重量％的纳米粒子。 纳米粒子可以是碳纳米粒子，硅纳米粒子或SiC纳米粒子。 纳米复合母料可通过将聚烯烃组合物与纳米颗粒熔融共混来制备。 聚烯烃树脂可以通过将纳米复合材料与聚烯烃混合来制备。 成型制品可以包括聚烯烃树脂。

公开(公告)号：EP1345999B1

公开(公告)日：2016-04-13

申请号：EP01273637.7

申请日：2001-12-06

Applicant: PPG Industries Ohio, Inc.

Inventor： SCHNEIDER, John R. ,  RAGAN, Deirdre D. ,  RECHENBERG, Karen S. ,  CHASSER, Anthony M. ,  BARKAC, Karen A.

IPC: C09D7/12 ,  C09D5/03 ,  C09D133/04 ,  C09D175/04 ,  C09D167/00 ,  C08K3/00 ,  C08K3/04 ,  C08K3/14 ,  C08K3/22

CPC classification number: C09D175/04 ,  C08K3/013 ,  C08K3/04 ,  C08K3/14 ,  C08K3/22 ,  C08L2205/18 ,  C09D7/61 ,  C09D7/68 ,  C09D7/69 ,  C09D133/04 ,  C09D167/00 ,  C08L2666/54 ,  C08L2666/02

Abstract: Coating compositions having improved mar and scratch resistance are disclosed. The coatings generally comprise particles having a hardness sufficient to provide the desired level of scratch and/or mar resistance. The improved resistance is achieved without affecting the appearance or mechanical performance of the coatings. Methods for using the coatings, and the substrates coated therewith, are also disclosed.

公开(公告)号：EP2986655A1

公开(公告)日：2016-02-24

申请号：EP14716855.3

申请日：2014-04-14

Applicant: BASF SE

Inventor： VON BERNSTORFF, Bernd-Steffen ,  HERMANT, Marie-Claire

IPC: C08G2/00 ,  C08G2/10 ,  C08G2/24 ,  C08K5/25 ,  C08L59/00 ,  C08L59/02

CPC classification number: C08G4/00 ,  C08G2/00 ,  C08G2/10 ,  C08G2/24 ,  C08K3/10 ,  C08K3/14 ,  C08K3/18 ,  C08K3/28 ,  C08L59/00 ,  C08L59/02 ,  C08L2205/025

Abstract: The invention relates to polyoxymethylene copolymers with medium molecular weight, processes for producing these, and their use. The invention furthermore relates to thermoplastic compositions which comprise mixtures of polyoxymethylene homo- or copolymers, production of these, use of these for producing metallic or ceramic moldings, and the resultant moldings.

公开(公告)号：EP2398926A4

公开(公告)日：2014-11-26

申请号：EP10744020

申请日：2010-02-16

Applicant: SECO TOOLS AB

Inventor： JONSSON PER ,  PUIDE MATTIAS

IPC: C22C1/05 ,  B22F1/00 ,  C08K3/00 ,  C22C29/04 ,  C22C29/08 ,  C22C33/02

CPC classification number: C22C29/08 ,  B22F2999/00 ,  C08K3/14 ,  C22C1/051 ,  C22C29/04 ,  B22F3/225 ,  B22F3/20 ,  C08L23/14

公开(公告)号：EP2766427A1

公开(公告)日：2014-08-20

申请号：EP12770514.3

申请日：2012-10-15

Applicant: Total Research & Technology Feluy

Inventor： BOUVY, Claire ,  LHOST, Olivier ,  DUPIRE, Marc ,  NAVEZ, Pascal ,  DELHALLE, Joseph ,  MEKHALIF, Zineb ,  DETRICHE, Simon

IPC: C08L23/06 ,  C08J3/20 ,  C08J3/22 ,  C08J5/00 ,  B82Y30/00 ,  C08L23/12 ,  C08K7/24 ,  C08L23/02

CPC classification number: C08L23/12 ,  B82Y30/00 ,  C08J3/226 ,  C08J2323/02 ,  C08J2423/02 ,  C08K3/04 ,  C08K3/041 ,  C08K3/042 ,  C08K3/046 ,  C08K3/14 ,  C08K3/34 ,  C08K3/36 ,  C08K7/24 ,  C08K2201/011 ,  C08L23/06 ,  Y10S977/742 ,  C08L23/00

Abstract: A nanocomposite can include a polyolefin composition having at least one polyolefin. The polyolefin composition can have a multimodal molecular weight distribution, such as a bimodal molecular weight distribution. The nanocomposite can also include at least 5% by weight of nanoparticles, relative to a total weight of the nanocomposite. The nanoparticles can be carbon nanoparticles, silicon nanoparticles, or SiC nanoparticles. A nanocomposite masterbatch can be prepared by melt blending the polyolefin composition with the nanoparticles. A polyolefin resin can be prepared by blending the nanocomposite with a polyolefin. Formed articles can include the polyolefin resin.

公开(公告)号：EP2716692A1

公开(公告)日：2014-04-09

申请号：EP12187674.2

申请日：2012-10-08

Applicant: WKP Products SA

Inventor： Maikisch, Martin

IPC: C08J5/04 ,  C08K3/10 ,  C08K3/14 ,  C08K3/36 ,  C08K3/40

CPC classification number: C08L77/00 ,  C08K3/08 ,  C08K3/14 ,  C08K3/22 ,  C08K3/34 ,  C08K3/346 ,  C08K5/5435 ,  C08K5/544 ,  C08K7/10 ,  C08K7/14 ,  C08L51/06 ,  C08L77/02 ,  C08L2207/04

Abstract: Ein Verbundwerkstoff mit polymerer Matrixkomponente und teilchenförmiger Füllkomponente umfasst 20-50 Vol.% eines thermoplastischen Polymers; 15-60 Vol.% einer ersten teilchenförmige Füllkomponente, wobei die genannte erste Füllkomponente ausgewählt ist aus der Gruppe bestehend aus pulverförmigen Metallen, Metalloxiden, kovalenten Carbiden, metallartigen Carbiden, oder Gemischen solcher Pulver; 5-30 Vol.% einer zweiten teilchenförmigen Füllkomponente, wobei die genannte zweite Füllkomponente ein anorganisches und/oder mineralisches Material in Pulverform ist; und 1-1 5 Vol.% eines Haftvermittlers.

Abstract translation: 复合材料包括聚合物基质组分和颗粒填料组分。 复合材料包含20-50vol％的热塑性聚合物，15-60体积％的第一颗粒填料组分，5-30体积％的第二颗粒填料组分和1-15体积％的偶联剂。 第一填料组分包括粉末状金属，金属合金，金属氧化物，共价碳化物和/或金属型碳化物。 第二填料组分包括粉末形式的无机和/或矿物材料。 还包括用于生产复合材料的试剂盒的独立权利要求，其包括分离形式的复合材料的单独组分和/或混合和未加工的形式。