FLEXIBLE COLOR ADJUSTMENT FOR DARK CR(III)-PLATINGS
    4.
    发明公开
    FLEXIBLE COLOR ADJUSTMENT FOR DARK CR(III)-PLATINGS 审中-公开
    灵活的FARBEINSTELLUNGFÜRDUNKLE CR(III)-PLATTIERUNGEN

    公开(公告)号:EP3147388A1

    公开(公告)日:2017-03-29

    申请号:EP15186811.4

    申请日:2015-09-25

    摘要: The invention relates to a process for the adjustment of the lightness L* of electrolytically deposited chromium-finishes on workpieces obtained by an electroplating bath at least comprising chromium(III)-ions and sulfur containing organic compounds, wherein the concentration of the sulfur containing organic compounds in the bath is adjusted by passing at least a part of the bath composition through an activated carbon filter.

    摘要翻译: 本发明涉及一种通过至少包含铬(III)和含硫有机化合物的电镀浴获得的工件上的电解沉积铬涂层的亮度L *的调节方法,其中含硫有机物 通过使至少一部分浴组合物通过活性炭过滤器来调节浴中的化合物。

    SURFACE-TREATED COPPER FOIL FOR PCB HAVING FINE-CIRCUIT PATTERN AND METHOD OF MANUFACTURING THE SAME
    9.
    发明公开
    SURFACE-TREATED COPPER FOIL FOR PCB HAVING FINE-CIRCUIT PATTERN AND METHOD OF MANUFACTURING THE SAME 审中-公开
    表面处理铜箔PCB电路及其制造精细图案和方法

    公开(公告)号:EP3154319A1

    公开(公告)日:2017-04-12

    申请号:EP16191675.4

    申请日:2016-09-30

    摘要: The present invention relates to a surface-treated copper foil for a PCB having a fine-circuit pattern and a method of manufacturing the same. The method of manufacturing the surface-treated copper foil for the PCB having the fine-circuit pattern according to the present invention includes a first step of disposing a copper foil as an anode in a plating solution including one or more metallic ions of Co, Ni, Mo, W, Cu, and Fe and forming a metal alloy layer by electrolysis, a second step of forming a roughened layer with a protrusion by roughening the formed metal alloy layer, a third step of forming a Zn coating layer on the roughened layer, a fourth step of forming an electrolytic chromate layer on the coating layer, and a fifth step of forming a silane coupling agent-treated layer on the electrolytic chromate layer.
    According to the present invention, the copper foil is surface-treated by forming the metal alloy layer to improve peel strength of the copper foil.

    摘要翻译: 本发明涉及一种表面处理铜箔用于具有微细电路图案及其制造的方法的PCB。 制造表面处理铜箔具有雅丁微细电路图案对本发明的印刷电路板的方法包括:设置一铜箔作为在电镀液中的阳极包含CO,Ni中的一种或多种金属离子的第一步骤 ,,铜,钼,W,Fe和形成通过电解的金属合金层,通过粗糙化所形成的金属合金层,粗糙化层上形成Zn系镀层的第三步骤形成具有突起的粗糙层的第二步骤 ,在涂布层上电解铬酸盐层的形成的第四步骤,和在形成电解铬酸盐层上形成硅烷偶联剂处理层的第五步骤。 。根据本发明,将铜箔进行表面处理,通过形成金属合金层,以改善铜箔的剥离强度。