摘要:
The present invention provides a covering panel, such as a floor covering panel, a wall covering panel or a ceiling covering panel, comprising: (i) a top layer, (ii) a substrate, and (iii) a lighting system comprising a plurality of light units wherein the lighting system is situated between said top layer and said substrate.
摘要:
Embodiments are generally directed to modular wall systems. Such modular wall systems include a modular frame, one or more tiles attached to the modular frame, a decorative panel positioned between at least one of the tiles and an inter-connected conductive plate, and conductive plates that are configured to hold an electrical potential and detect an electrical capacitance through the decorative panel at an identified position on the conductive plate when touched. In another embodiment, a modular wall system includes a modular frame, tiles attached to the modular frame, conductive plates that have pockets formed therein, and an inductive plate disposed in the pocket of the conductive plate. As such, the inductive plate provides a hidden switching location that, when activated, triggers transmission of a signal to a specified destination
摘要:
The present invention provides a honeycomb structure that is light in weight, that has high strength and rigidity, and that is also excellent in water resistance and moldability. The honeycomb structure of the present invention comprises a thermoplastic resin composition containing a polyamide (A) and a modified polyolefin (B), wherein: the polyamide (A) comprises a diamine unit that contains a xylylenediamine unit for 70 mol% or more and a dicarboxylic acid unit that contains an ±,É-linear aliphatic dicarboxylic acid unit with a carbon number of 4-20 for 50 mol% or more; the modified polyolefin (B) is a polyolefin having a reactive functional group that is selected from an epoxy group and the like; and the blending ratio of polyamide (A)/modified polyolefin (B) is in a range of 100/15-70 on a mass basis.
摘要:
Die Erfindung betrifft ein Verlegeverfahren zum Erstellen eines Decken- und/oder Wandbelages aus Paneelen (2) mit den Schritten Anordnen einer Vielzahl von Paneelen an einer vorhandenen Wand oder Decke, wobei die Paneele in Reihen angeordnet und mittels korrespondierender Verriegelungsprofile im Bereich der Längsseiten und Querseiten untereinander verbunden werden. Um einen Decken- und/oder Wandbelag und ein besonders einfaches Verlegeverfahren zum Erstellen eines Decken- und/oder Wandbelages aus Paneelen bereitzustellen, mit dem eine erhöhte Sicherheit gegen das Lösen des Decken- und/oder Wandbelages gewährleistet wird, ist vorgesehen, dass vor einem längsseitigen Verbinden der Paneele einer zweiten Paneelreihe mit den Paneelen einer ersten Paneelreihe ein Klebemittel (14) im Bereich der längsseitigen Verriegelungsprofile angeordnet wird, wobei mit dem längsseitigen Verbinden der Paneele zusätzlich zu der Verriegelungsverbindung eine Klebeverbindung (14a) im Bereich der längsseitigen Verriegelungsprofile erzeugt wird.
摘要:
A tiled structure comprises a layer of adhesive mortar, a bracket having a substantially flat base mounting portion with a plurality of perforations embedded in an adhesive mortar with the mortar flowed through the perforations and substantially covering opposite sides of the base mounting portion, and a tile veneer bonded to the adhesive mortar over at least one side of the base mounting portion.
摘要:
The present invention provides a honeycomb structure that is light in weight, that has high strength and rigidity, and that is also excellent in water resistance and moldability. The honeycomb structure of the present invention comprises a thermoplastic resin composition containing a polyamide (A) and a modified polyolefin (B), wherein: the polyamide (A) comprises a diamine unit that contains a xylylenediamine unit for 70 mol% or more and a dicarboxylic acid unit that contains an α,ω-linear aliphatic dicarboxylic acid unit with a carbon number of 4-20 for 50 mol% or more; the modified polyolefin (B) is a polyolefin having a reactive functional group that is selected from an epoxy group and the like; and the blending ratio of polyamide (A)/modified polyolefin (B) is in a range of 100/15-70 on a mass basis.