公开(公告)号：EP1341214A1

公开(公告)日：2003-09-03

申请号：EP01963464.1

申请日：2001-09-06

申请人： Hitachi, Ltd. ,  Hitachi ULSI Systems Co.,Ltd.

发明人： MURANAKA, Masaya, Hitachi Ulsi Systems Co., Ltd.

IPC分类号： H01L21/02 ,  H01L21/66 ,  H01L27/04 ,  G01R31/28

CPC分类号： H01L22/00 ,  G05B19/128 ,  G05B2219/31307 ,  G05B2219/45031 ,  H01L23/544 ,  H01L24/48 ,  H01L24/49 ,  H01L27/0207 ,  H01L2223/54433 ,  H01L2223/5444 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/451 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  Y02P90/10 ,  Y02P90/86 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： In the manufacturing process of a semiconductor integrated circuit device, a plurality of identification elements having the same arrangement are formed and the relation of magnitude in a physical amount corresponding to variations in the process of the plurality of identification elements is employed as identification information unique to the semiconductor integrated circuit device.

摘要翻译： 在半导体集成电路装置的制造过程中，具有相同排列形成和大小在物理量对应于变化识别元件的多个过程中的关系识别元件的多元性被用作唯一的识别信息 的半导体集成电路器件。

公开(公告)号：EP1062618A1

公开(公告)日：2000-12-27

申请号：EP99904416.7

申请日：1999-01-29

申请人： Micron Technology, Inc.

发明人： WILSON, Kevin ,  HJORTH, Ron

IPC分类号： G06K1/00

CPC分类号： H01L21/67294 ,  G05B19/4183 ,  G05B2219/31307 ,  G05B2219/36371 ,  G05B2219/45031 ,  H01L21/67276 ,  H01L23/544 ,  H01L2223/5444 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2924/0002 ,  Y02P90/04 ,  Y02P90/10 ,  H01L2924/00

摘要： An inventive method tracks IC devices through the assembly steps in a manufacturing process (62). Prior to die attach, a laser scribe marks the lead frame of each of the devices (66) with a coded hole matrix that gives each device a unique ID code. During die attach, an optical hole reader retrieves the ID code of each of the IC devices (66), and a computer system stores the retrieved ID codes in association with the lot numbers of the IC's attached to the lead frames (68). The ID codes of the devices are then read at each step in assembly so the devices can be tracked through assembly individually, rather than by lots. As a result, the devices can proceed through assembly in a more efficient, continuous manner (i.e., without breaks between lots).

公开(公告)号：EP1062618A4

公开(公告)日：2006-01-25

申请号：EP99904416

申请日：1999-01-29

申请人： MICRON TECHNOLOGY INC

发明人： WILSON KEVIN ,  HJORTH RON

IPC分类号： G06Q50/00 ,  G06K7/00 ,  H01L21/00 ,  H01L21/02 ,  H01L23/00 ,  H01L23/544

CPC分类号： H01L21/67294 ,  G05B19/4183 ,  G05B2219/31307 ,  G05B2219/36371 ,  G05B2219/45031 ,  H01L21/67276 ,  H01L23/544 ,  H01L2223/5444 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2924/0002 ,  Y02P90/04 ,  Y02P90/10 ,  H01L2924/00

摘要： An inventive method tracks IC devices through the assembly steps in a manufacturing process (62). Prior to die attach, a laser scribe marks the lead frame of each of the devices (66) with a coded hole matrix that gives each device a unique ID code. During die attach, an optical hole reader retrieves the ID code of each of the IC devices (66), and a computer system stores the retrieved ID codes in association with the lot numbers of the IC's attached to the lead frames (68). The ID codes of the devices are then read at each step in assembly so the devices can be tracked through assembly individually, rather than by lots. As a result, the devices can proceed through assembly in a more efficient, continuous manner (i.e., without breaks between lots).

公开(公告)号：EP0875365A3

公开(公告)日：2000-11-29

申请号：EP98107823.1

申请日：1998-04-29

申请人： Bridgestone Corporation

发明人： Kimijima, Takao

IPC分类号： B29D30/00

CPC分类号： B29D30/0061 ,  G05B19/4183 ,  G05B2219/31307 ,  G05B2219/31319 ,  G05B2219/49302 ,  G06Q10/06 ,  Y02P90/10 ,  Y02P90/12

摘要： By linking together a first set of identification information and a second set of identification information, and by creating a database linking together manufacturing information, sales information, and distribution information with the first identification information as a keyword, the burden on the user of controlling manufacturing can be lightened by, for example, the manufacturing information side informing the sales information side that the product renewal date is approaching. Further, a response can rapidly be made to demands from the user, and steps rapidly taken (i.e. transmitted to the manufacturing process and put into practice) to meet those demands.

摘要翻译： 通过将第一组识别信息和第二组识别信息连接在一起，并且通过创建将制造信息，销售信息和分发信息与第一识别信息相关联的数据库作为关键字，控制制造的用户的负担 可以通过例如向销售信息方通知产品更新日期即将到达的制造信息侧来减轻。 此外，可以迅速地响应来自用户的需求，并迅速采取步骤（即传送到制造过程并付诸实施）以满足这些需求。

公开(公告)号：EP1341214A4

公开(公告)日：2008-10-01

申请号：EP01963464

申请日：2001-09-06

申请人： HITACHI LTD ,  HITACHI ULSI SYS CO LTD

发明人： MURANAKA MASAYA

IPC分类号： G06K19/06 ,  H01L21/66 ,  H01L23/544 ,  H01L21/02 ,  G01R31/28 ,  H01L27/04

CPC分类号： H01L22/00 ,  G05B19/128 ,  G05B2219/31307 ,  G05B2219/45031 ,  H01L23/544 ,  H01L24/48 ,  H01L24/49 ,  H01L27/0207 ,  H01L2223/54433 ,  H01L2223/5444 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/451 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  Y02P90/10 ,  Y02P90/86 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： In the manufacturing process of a semiconductor integrated circuit device, a plurality of identification elements having the same arrangement are formed and the relation of magnitude in a physical quantity corresponding to variation in the process of the plurality of identification elements is employed as identification information specific to the semiconductor integrated circuit device.

公开(公告)号：EP0875365B1

公开(公告)日：2003-03-26

申请号：EP98107823.1

申请日：1998-04-29

申请人： Bridgestone Corporation

发明人： Kimijima, Takao

IPC分类号： B29D30/00

CPC分类号： B29D30/0061 ,  G05B19/4183 ,  G05B2219/31307 ,  G05B2219/31319 ,  G05B2219/49302 ,  G06Q10/06 ,  Y02P90/10 ,  Y02P90/12

公开(公告)号：EP0875365A2

公开(公告)日：1998-11-04

申请号：EP98107823.1

申请日：1998-04-29

申请人： Bridgestone Corporation

发明人： Kimijima, Takao

IPC分类号： B29D30/00

CPC分类号： B29D30/0061 ,  G05B19/4183 ,  G05B2219/31307 ,  G05B2219/31319 ,  G05B2219/49302 ,  G06Q10/06 ,  Y02P90/10 ,  Y02P90/12

摘要： By linking together a first set of identification information and a second set of identification information, and by creating a database linking together manufacturing information, sales information, and distribution information with the first identification information as a keyword, the burden on the user of controlling manufacturing can be lightened by, for example, the manufacturing information side informing the sales information side that the product renewal date is approaching. Further, a response can rapidly be made to demands from the user, and steps rapidly taken (i.e. transmitted to the manufacturing process and put into practice) to meet those demands.