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公开(公告)号：EP3213912A4
公开(公告)日：2018-07-11
申请号：EP15848051
申请日：2015-09-28
发明人： SUN REN-DE , NOZATO SHOJI , NAKASUGA AKIRA , NAKAMURA MASANORI
IPC分类号： B32B9/00 , B32B15/04 , C01B21/072 , C01F5/02 , C08G14/073 , C09K5/14 , F28F13/18 , H01L23/29
CPC分类号： H01L23/29 , B32B9/00 , B32B15/04 , C01B21/072 , C01B21/0728 , C09K5/14 , F28F13/18 , H01L23/295 , H01L2223/58
摘要： The present invention provides a carbon-coated thermal conductive material which can improve water resistance, oxidation resistance, and dispersibility at the time of being kneaded with a resin while maintaining excellent thermal conductive performance. The present invention is a carbon-coated thermal conductive material having a coating layer composed of amorphous carbon on the surface of a thermal conductive material, in which the thermal conductive material is composed of a metal oxide, a metal nitride, a metal material, or a carbon-based material having a thermal conductivity of 10 W/mK or greater; the amorphous carbon is derived from carbon contained in an oxazine resin; in a case where the amorphous carbon is analyzed by Raman spectroscopy, a ratio of a peak intensity of a G band to a peak intensity of a D band is 1.0 or greater; an average film thickness of the coating layer is 500 nm or less; and a coefficient of variation (CV value) of a film thickness of the coating layer is 15% or less.
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公开(公告)号：EP3213912A1
公开(公告)日：2017-09-06
申请号：EP15848051.7
申请日：2015-09-28
IPC分类号： B32B9/00 , B32B15/04 , C01B21/072 , C01F5/02 , C08G14/073 , C09K5/14
CPC分类号： H01L23/29 , B32B9/00 , B32B15/04 , C01B21/072 , C01B21/0728 , C09K5/14 , F28F13/18 , H01L23/295 , H01L2223/58
摘要： The present invention provides a carbon-coated thermal conductive material which can improve water resistance, oxidation resistance, and dispersibility at the time of being kneaded with a resin while maintaining excellent thermal conductive performance. The present invention is a carbon-coated thermal conductive material having a coating layer composed of amorphous carbon on the surface of a thermal conductive material, in which the thermal conductive material is composed of a metal oxide, a metal nitride, a metal material, or a carbon-based material having a thermal conductivity of 10 W/mK or greater; the amorphous carbon is derived from carbon contained in an oxazine resin; in a case where the amorphous carbon is analyzed by Raman spectroscopy, a ratio of a peak intensity of a G band to a peak intensity of a D band is 1.0 or greater; an average film thickness of the coating layer is 500 nm or less; and a coefficient of variation (CV value) of a film thickness of the coating layer is 15% or less.
摘要翻译： 本发明提供一种碳涂覆的导热材料，其能够在保持优异的导热性能的同时提高在与树脂捏合时的耐水性，耐氧化性和分散性。 本发明是在导热性材料的表面具有由无定形碳构成的被覆层的碳被覆导热性材料，其中，导热性材料由金属氧化物，金属氮化物，金属材料或 导热率为10W / mK或更大的碳基材料; 无定形碳来源于恶嗪树脂中所含的碳; 在通过拉曼光谱分析无定形碳的情况下，G带的峰值强度与D带的峰值强度之比为1.0或更大; 涂层的平均膜厚度为500nm或更小; 并且涂层的膜厚度的变化系数（CV值）为15％以下。
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公开(公告)号：EP3336890A1
公开(公告)日：2018-06-20
申请号：EP17206860.3
申请日：2017-12-13
发明人： Bayerer, Reinhold
CPC分类号： H01L23/293 , C09K21/06 , H01L23/18 , H01L23/28 , H01L23/3107 , H01L23/3135 , H01L23/3142 , H01L23/3157 , H01L23/3192 , H01L2223/58
摘要： A semiconductor package is described which meets a plurality of predetermined electrical, mechanical, chemical and/or environmental requirements. The semiconductor package includes a semiconductor die embedded in or covered by a molded plastic body, the molded plastic body satisfying only a subset of the plurality of predetermined electrical, mechanical, chemical and/or environmental requirements. The semiconductor package further includes a plurality of terminals protruding from the molded plastic body and electrically connected to the semiconductor die, and a coating applied to at least part of the molded plastic body and/or part of the plurality of terminals. The coating satisfies each predetermined electrical, mechanical, chemical and/or environmental requirement not satisfied by the molded plastic body.
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