PASSIVE RADIATIVE DRY COOLING MODULE/SYSTEM USING METAMATERIALS
    5.
    发明授权
    PASSIVE RADIATIVE DRY COOLING MODULE/SYSTEM USING METAMATERIALS 有权
    无源辐射干冷却模块/系统使用元件

    公开(公告)号:EP3106815B1

    公开(公告)日:2018-01-31

    申请号:EP16173385.2

    申请日:2016-06-07

    Abstract: A passive radiative cooling system comprising: a plurality of modules, each said module including: an ultra-black emitter including a metal sheet and a plurality of metamaterial nanostructures arranged in an ultra-black metamaterial-based pattern on a first surface of the metal sheet, said plurality of metamaterial nanostructures being configured to emit radiant energy having wavelengths in the range of 8µm to 13µm; a reflective layer mounted on the first surface of the emitter layer and configured to reflect incident solar radiation; and a conduit structure disposed under the metal sheet emitter layer and configured to conduct a coolant between an inlet port and an outlet port such that thermal energy is conducted from the coolant through the metal sheet to said plurality of metamaterial nanostructures; and a flow control system configured to pass said coolant through said plurality of modules.

    ALUMINUM-DIAMOND COMPOSITE, AND HEAT DISSIPATING COMPONENT USING SAME
    9.
    发明公开
    ALUMINUM-DIAMOND COMPOSITE, AND HEAT DISSIPATING COMPONENT USING SAME 审中-公开
    铝合金雕刻机

    公开(公告)号:EP3135783A1

    公开(公告)日:2017-03-01

    申请号:EP15782584.5

    申请日:2015-04-23

    Abstract: The purpose of the present invention is to provide an aluminum-diamond composite that exhibits both high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, and that can suppress the occurrence of swelling, etc., of a surface metal layer portion even in actual use under a high load. Provided is an aluminum-diamond composite comprising 65-80 vol% of a diamond powder having a roundness of at least 0.94, for which a first peak in a volumetric distribution of grain size lies at 5-25 µm, and a second peak lies at 55-195 µm, and a ratio between the area of the volumetric distribution of grain sizes of 1-35 µm and the area of the volumetric distribution of grain sizes of 45-205 µm is from 1 : 9 to 4 : 6; the balance being composed of a metal containing aluminum.

    Abstract translation: 本发明的目的是提供一种铝 - 金刚石复合材料,其表现出与半导体器件接近的高热导率和热膨胀系数,并且可以抑制表面金属层的膨胀等的发生 甚至在高负载下实际使用。 提供了一种铝 - 金刚石复合材料,其包含65-80vol%的具有至少0.94的圆度的金刚石粉末,其中晶粒尺寸的体积分布中的第一个峰位于5-25μm,第二个峰位于 55-195μm,晶粒尺寸为1-35μm的体积分布面积与45-205μm晶粒尺寸的体积分布面积之比为1:9至4:6; 余量由含铝的金属组成。

Patent Agency Ranking