专利检索 cpc:"H01L2224/0237720130101" 第 1 页

1.

发明授权
CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME 有权

公开(公告)号：EP3624173B1

公开(公告)日：2024-09-04

申请号：EP19184181.6

申请日：2019-07-03

IPC分类号： H01L21/60 , H01L21/56

CPC分类号： H01L21/568 , H01L24/19 , H01L24/96 , H01L2224/0237720130101 , H01L2224/040120130101 , H01L2224/0410520130101 , H01L2224/0512420130101 , H01L2224/0514720130101 , H01L2224/0556920130101 , H01L2224/0557220130101 , H01L2224/1210520130101 , H01L2224/13120130101 , H01L2224/1314720130101 , H01L2224/1622720130101 , H01L2224/7326720130101 , H01L2224/9420130101 , H01L2924/143120130101 , H01L2924/143220130101 , H01L2924/143620130101 , H01L2924/1816220130101 , H01L2924/35120130101