专利检索 cpc:"H01L2924/143620130101" 第 1 页

1.

发明授权
CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME 有权

公开(公告)号：EP3624173B1

公开(公告)日：2024-09-04

申请号：EP19184181.6

申请日：2019-07-03

IPC分类号： H01L21/60 , H01L21/56

CPC分类号： H01L21/568 , H01L24/19 , H01L24/96 , H01L2224/0237720130101 , H01L2224/040120130101 , H01L2224/0410520130101 , H01L2224/0512420130101 , H01L2224/0514720130101 , H01L2224/0556920130101 , H01L2224/0557220130101 , H01L2224/1210520130101 , H01L2224/13120130101 , H01L2224/1314720130101 , H01L2224/1622720130101 , H01L2224/7326720130101 , H01L2224/9420130101 , H01L2924/143120130101 , H01L2924/143220130101 , H01L2924/143620130101 , H01L2924/1816220130101 , H01L2924/35120130101

2.

发明授权
SEMICONDUCTOR PACKAGE WITH REDUCED NOISE 有权

公开(公告)号：EP3614427B1

公开(公告)日：2024-06-19

申请号：EP19192261.6

申请日：2019-08-19

IPC分类号： H01L23/66 , H01L23/552 , H01L23/538 , H01L25/18 , H01L25/10

CPC分类号： H01L23/66 , H01L25/18 , H01L23/5385 , H01L23/5389 , H01L23/49816 , H01L23/552 , H01L23/5384 , H01L25/105 , H01L2225/105820130101 , H01L2225/102320130101 , H01L2225/10720130101 , H01L2224/0410520130101 , H01L2225/103520130101 , H01L2924/18120130101 , H01L2924/1531120130101 , H01L24/19 , H01L24/20 , H01L2924/143620130101 , H01L2924/1533120130101 , H01L2924/142120130101 , H01L2224/1622720130101 , H01L2924/302520130101 , H01L2224/1210520130101 , H01L2225/104120130101

3.

发明授权
PACKAGE SYSTEM AND PACKAGE 有权

公开(公告)号：EP4020711B1

公开(公告)日：2024-10-09

申请号：EP21195238.7

申请日：2021-09-07

IPC分类号： H01Q15/00 , H01Q1/22 , H01Q15/14 , H01L23/552 , H01L23/66 , G06F13/14 , G06F13/40 , H01L23/00 , H01L25/03 , H01L25/065 , H01L25/10

CPC分类号： H01L2224/1623520130101 , H01L2924/1519220130101 , H01L2924/153120130101 , H01L2224/1614620130101 , H01L2224/1614520130101 , H01L2224/1622720130101 , H01L2224/1718120130101 , H01L2225/0651320130101 , H01L2225/0651720130101 , H01L2225/0654120130101 , H01L2225/0656520130101 , H01L25/0652 , H01L2225/0653120130101 , H01L2223/667720130101 , H01L25/10 , H01L25/03 , H01L2924/1531120130101 , H01L23/66 , H01Q1/2283 , H01L24/16 , H01L24/17 , H01L2225/104720130101 , H01L2924/143420130101 , H01L2924/143620130101 , H01L2924/143220130101 , H01L25/0655 , H01L23/552 , H01L2924/302520130101 , H01Q15/002 , H01Q15/148 , G06F13/14 , G06F13/4068

4.

发明授权
STACKED SEMICONDUCTOR DIE ASSEMBLY WITH A THERMALLY CONDUCTIVE CASING AND A METHOD OF MANUFACTURING SUCH AN ASSEMBLY 有权

公开(公告)号：EP3127151B1

公开(公告)日：2024-05-01

申请号：EP15773393.2

申请日：2015-03-30

IPC分类号： H01L23/34 , H01L23/48 , H01L25/00 , H01L25/18 , H01L25/065 , H01L23/00 , H01L23/552 , H01L23/498 , H01L23/367 , H01L23/522

CPC分类号： H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/92 , H01L25/0657 , H01L2224/1302520130101 , H01L2224/13120130101 , H01L2224/1311120130101 , H01L2224/1312420130101 , H01L2224/1314720130101 , H01L2224/1315520130101 , H01L2224/13320130101 , H01L2224/1614620130101 , H01L2224/1622720130101 , H01L2224/1718120130101 , H01L2224/3214520130101 , H01L2224/3222520130101 , H01L2224/7320420130101 , H01L2224/7325320130101 , H01L2224/9212520130101 , H01L2225/0651720130101 , H01L2225/0658920130101 , H01L2924/1025320130101 , H01L2924/103320130101 , H01L2924/1420130101 , H01L2924/143620130101 , H01L2924/143720130101 , H01L2924/143820130101 , H01L2924/1515620130101 , H01L2924/1519220130101 , H01L2924/1531120130101 , H01L2924/1532120130101 , H01L2924/1615220130101 , H01L2924/1625120130101 , H01L2924/1904120130101 , H01L2924/1904220130101 , H01L2924/1904320130101 , H01L2924/1910520130101 , H01L2224/132920130101 , H01L2225/0651320130101 , H01L2225/0654120130101 , H01L2225/0656520130101 , H01L2225/0656820130101 , H01L23/3675 , H01L23/3677 , H01L23/49811 , H01L23/49833 , H01L25/18 , H01L24/17 , H01L25/50 , H01L2924/143120130101 , H01L2924/143420130101 , H01L2924/1533120130101