公开(公告)号：EP4125119B1

公开(公告)日：2024-04-17

申请号：EP22187481.1

申请日：2022-07-28

IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L21/56 ,  H01L21/48 ,  H01L21/60 ,  C23C14/04 ,  C23C14/28 ,  H01L21/02 ,  H01L21/285 ,  H01L23/495 ,  H01L23/31 ,  H01L23/29 ,  H01L25/00 ,  H01L25/16 ,  H01L25/07

CPC分类号： H01L2224/2424620130101 ,  H01L2224/2424520130101 ,  H01L2224/2413720130101 ,  H01L2224/2410120130101 ,  H01L2224/2410520130101 ,  H01L2224/240220130101 ,  H01L2224/24520130101 ,  H01L2224/2510520130101 ,  H01L2224/2517120130101 ,  H01L2224/8203920130101 ,  H01L2224/8210520130101 ,  H01L2224/8221420130101 ,  H01L2224/3224520130101 ,  H01L2224/7326720130101 ,  H01L2224/9224420130101 ,  H01L24/82 ,  H01L24/24 ,  H01L24/25 ,  H01L2924/0001420130101 ,  H01L24/83 ,  H01L24/32 ,  H01L25/50 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/16 ,  H01L21/56 ,  H01L21/4825 ,  H01L23/49575 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/49517 ,  C23C14/28 ,  C23C14/048

公开(公告)号：EP4385066A1

公开(公告)日：2024-06-19

申请号：EP21755982.2

申请日：2021-08-09

申请人： X-Celeprint Limited ,  LEONHARD KURZ Stiftung & Co. KG

发明人： COK, Ronald S. ,  TRINDADE, António José ,  SCHARFENBERG, Michael ,  SCHULZ, Christian ,  ROITHMEIER, Gabriele

IPC分类号： H01L21/683 ,  H01L21/67 ,  H01L23/00 ,  H01L33/00 ,  H01L27/15

CPC分类号： H01L33/0095 ,  H01L27/153 ,  H01L21/67144 ,  H01L21/6835 ,  H01L2221/6835420130101 ,  H01L2221/6836820130101 ,  H01L2221/6838120130101 ,  H01L2221/683520130101 ,  H01L2221/6831820130101 ,  H01L24/83 ,  H01L24/95 ,  H01L2224/3222520130101 ,  H01L2224/2422620130101 ,  H01L2224/3214520130101 ,  H01L2224/2414620130101 ,  H01L2224/9520130101 ,  H01L2224/95120130101 ,  H01L2224/9513320130101 ,  H01L2224/8319220130101 ,  H01L2224/2731220130101 ,  H01L2224/2762220130101 ,  H01L2224/8386220130101 ,  H01L2224/8387420130101 ,  H01L2224/7525120130101 ,  H01L23/544 ,  H01L2224/8312120130101 ,  H01L2224/8314320130101 ,  H01L2224/8320820130101 ,  H01L2224/8398620130101 ,  H01L24/33 ,  H01L2224/3318120130101 ,  H01L2224/7326720130101 ,  H01L2224/7321720130101 ,  H01L2224/922220130101 ,  H01L24/92 ,  H01L24/32 ,  H01L24/27 ,  H01L24/24 ,  H01L2224/7420130101 ,  H01L24/74 ,  H01L24/75 ,  H01L2224/756520130101 ,  H01L25/50 ,  H01L25/0655 ,  H01L25/16

公开(公告)号：EP4362079A1

公开(公告)日：2024-05-01

申请号：EP22866399.3

申请日：2022-08-23

申请人： Huawei Technologies Co., Ltd.

发明人： ZHENG, Yonggang ,  JIANG, Ran ,  TANG, Zikai ,  LI, Yanghua ,  HUANG, Shujun

IPC分类号： H01L23/31

CPC分类号： H01L2224/7326720130101 ,  H01L2224/3224520130101 ,  H01L2224/2424620130101 ,  H01L2224/0410520130101 ,  H01L2224/9224420130101 ,  H01L2224/4813720130101 ,  H01L2224/4824720130101 ,  H01L2224/7326520130101 ,  H01L2924/1515320130101 ,  H01L2224/3222520130101 ,  H01L2224/21420130101 ,  H01L2224/2424720130101

摘要： This application discloses a chip package structure, a production method for a chip package structure, and an electronic device. The chip package structure includes: a first connection layer having an upper surface and a lower surface that are opposite to each other, a die disposed on the upper surface of the first connection layer, a first conduction structure disposed on an upper surface of the die, a first plastic package layer covering the die and the first conduction structure, and a rewiring layer disposed on the first plastic package layer. At least a part of the first conduction structure is exposed from an upper surface of the first plastic package layer. The rewiring layer is coupled to the first conduction structure. A signal of the die is directly led out through the first conduction structure and the rewiring layer. This saves space, reduces a wiring length and interconnection inductance, and implements a low loss and an efficient interconnection of signals between dies. A signal interconnection between the dies is implemented through the rewiring layer, and based on an impedance value of the die, circuit wiring matching the impedance value may be disposed at the rewiring layer. This does not need components used for coupling impedance, such as a capacitor, saves space, and reduces design complexity.

公开(公告)号：EP4434080A2

公开(公告)日：2024-09-25

申请号：EP22817263.1

申请日：2022-11-14

申请人： International Business Machines Corporation

发明人： FAROOQ, Mukta ,  KELLY, James

IPC分类号： H01L21/60 ,  H01L25/065 ,  H01L25/18 ,  H01L23/498 ,  H01L23/48 ,  H01L23/00 ,  H01L25/00

CPC分类号： H01L2224/3222520130101 ,  H01L2224/8300520130101 ,  H01L24/96 ,  H01L2924/1816220130101 ,  H01L2924/181620130101 ,  H01L2224/1210520130101 ,  H01L2224/7320120130101 ,  H01L2224/921220130101 ,  H01L2224/1622720130101 ,  H01L25/0655 ,  H01L25/0652 ,  H01L25/50 ,  H01L2225/0651720130101 ,  H01L2225/0657220130101 ,  H01L2225/0658620130101 ,  H01L25/18 ,  H01L23/49827 ,  H01L2224/9520130101 ,  H01L2224/0410520130101 ,  H01L24/73 ,  H01L2924/1531120130101 ,  H01L2924/1519220130101 ,  H01L2224/2413720130101 ,  H01L24/92 ,  H01L2924/1515320130101 ,  H01L2224/7326720130101 ,  H01L2224/9224420130101 ,  H01L2224/920220130101 ,  H01L24/82 ,  H01L2224/7321720130101 ,  H01L2224/8389620130101 ,  H01L2224/9214420130101 ,  H01L24/24 ,  H01L23/481 ,  H01L2224/21420130101

公开(公告)号：EP4340012A3

公开(公告)日：2024-05-22

申请号：EP24155178.7

申请日：2017-04-28

申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： HUNZIKER, Urs

IPC分类号： H01Q21/00 ,  H01Q21/06 ,  H01L23/00

CPC分类号： H01L24/19 ,  H01L24/20 ,  H01Q21/0093 ,  H01Q21/064 ,  H01L2223/667720130101 ,  H01L2224/0410520130101 ,  H01L2224/3222520130101 ,  H01L2224/7326720130101

摘要： It is described a component carrier (100) with a base structure (120); an antenna arrangement (140) having a at least a first antenna element (142) and a second antenna element (146), wherein both antennas elements (142, 146) are embedded within the base structure (120); and an electronic component (130), which is embedded within the base structure (120) and which is operatively connected both with the first antenna element (142) and the second antenna element (146). The electronic component (130) is an active electronic component which is capable of (i) providing a first transmit signal to the first antenna element (142) and a second transmit signal to the second antenna element (146) and/or (ii) processing a first receive signal received from the first antenna element (142) and a second receive signal received from the second antenna element (146). Further, an electronic apparatus (1070) comprising such a component carrier (100) and a manufacturing method for such a component carrier (100) are described.

公开(公告)号：EP3783759B1

公开(公告)日：2024-05-01

申请号：EP19787571.9

申请日：2019-03-11

IPC分类号： H01S5/02345 ,  H01S5/02325 ,  G01S7/484 ,  G01S17/894 ,  H05K3/46 ,  H01L23/00 ,  H01S5/024 ,  H01S5/062 ,  H01S5/0683 ,  H01S5/02257 ,  H01S5/0239

CPC分类号： H05K3/46 ,  G01S7/484 ,  H01S5/02476 ,  H01S5/02469 ,  H01S5/0683 ,  H01S5/06226 ,  H01L2224/0410520130101 ,  H01L2224/9224420130101 ,  H01L2224/3222520130101 ,  H01L2224/7326720130101 ,  H01L2224/4822720130101 ,  H01L2224/7326520130101 ,  H01L2924/1910520130101 ,  H01L2924/1619520130101 ,  H01L2924/3010720130101 ,  H01L2224/1210520130101 ,  H01L2224/9720130101 ,  H01L2924/1515320130101 ,  H01L24/19 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01S5/02325 ,  H01S5/02345 ,  H01S5/02257 ,  G01S17/894 ,  H01S5/0239

公开(公告)号：EP4430664A1

公开(公告)日：2024-09-18

申请号：EP22830641.1

申请日：2022-11-10

申请人： Invensas LLC

发明人： VARIOT, Patrick ,  SHEN, Hong

IPC分类号： H01L23/552 ,  H01L23/66 ,  H01L21/60 ,  H01L25/10

CPC分类号： H01L2224/0410520130101 ,  H01L2224/1210520130101 ,  H01L2924/302520130101 ,  H01L2224/7326720130101 ,  H01L2224/060320130101 ,  H01L2224/251820130101 ,  H01L24/20 ,  H01L23/552 ,  H01L2223/667720130101 ,  H01L2224/9620130101 ,  H01L2924/1531120130101 ,  H01L2224/1622720130101 ,  H01L2225/103520130101 ,  H01L2225/104120130101 ,  H01L2225/105820130101 ,  H01L2225/109420130101 ,  H01L23/66 ,  H01L25/105 ,  H01L2924/351120130101 ,  H01L2224/3224520130101

公开(公告)号：EP3624173B1

公开(公告)日：2024-09-04

申请号：EP19184181.6

申请日：2019-07-03

IPC分类号： H01L21/60 ,  H01L21/56

CPC分类号： H01L21/568 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/0237720130101 ,  H01L2224/040120130101 ,  H01L2224/0410520130101 ,  H01L2224/0512420130101 ,  H01L2224/0514720130101 ,  H01L2224/0556920130101 ,  H01L2224/0557220130101 ,  H01L2224/1210520130101 ,  H01L2224/13120130101 ,  H01L2224/1314720130101 ,  H01L2224/1622720130101 ,  H01L2224/7326720130101 ,  H01L2224/9420130101 ,  H01L2924/143120130101 ,  H01L2924/143220130101 ,  H01L2924/143620130101 ,  H01L2924/1816220130101 ,  H01L2924/35120130101

公开(公告)号：EP4325565A3

公开(公告)日：2024-07-03

申请号：EP23220744.9

申请日：2021-09-13

申请人： INTEL Corporation

发明人： WAIDHAS, Bernd ,  WOLTER, Andreas ,  SEIDEMANN, Georg ,  WAGNER, Thomas

IPC分类号： H01L23/538 ,  H01L21/98 ,  H01L25/065 ,  H01L21/60

CPC分类号： H01L24/96 ,  H01L2224/040120130101 ,  H01L2224/0410520130101 ,  H01L2224/1210520130101 ,  H01L2924/1816220130101 ,  H01L2924/1816120130101 ,  H01L2224/060320130101 ,  H01L2224/7320920130101 ,  H01L2224/1622720130101 ,  H01L2924/1531120130101 ,  H01L24/20 ,  H01L2224/21420130101 ,  H01L2224/8100520130101 ,  H01L2224/13120130101 ,  H01L2224/0822520130101 ,  H01L2224/0814520130101 ,  H01L2224/1614520130101 ,  H01L2224/8000620130101 ,  H01L2924/1910420130101 ,  H01L2224/1626520130101 ,  H01L2224/9212420130101 ,  H01L2224/921220130101 ,  H01L2224/7320120130101 ,  H01L2224/0826520130101 ,  H01L2224/0564720130101 ,  H01L2224/055720130101 ,  H01L2924/1519220130101 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2225/0652420130101 ,  H01L2225/0651320130101 ,  H01L2225/0654120130101 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/8203920130101 ,  H01L24/19 ,  H01L2924/351120130101 ,  H01L23/5385 ,  H01L23/49816 ,  H01L2224/0824520130101 ,  H01L2224/3224520130101 ,  H01L2224/3222520130101 ,  H01L2224/7326720130101 ,  H01L2224/9224420130101 ,  H01L2224/170320130101 ,  H01L2224/1100220130101 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L25/18 ,  H01L25/105 ,  H01L2225/102920130101 ,  H01L2225/102320130101 ,  H01L2924/38120130101 ,  H01L2224/140320130101 ,  H01L2224/8119320130101 ,  H01L2224/9520130101 ,  H01L2224/1302220130101 ,  H01L2224/1308220130101 ,  H01L2224/9620130101 ,  H01L2224/0555320130101 ,  H01L2224/061220130101 ,  H01L2224/0237520130101 ,  H01L24/14 ,  H01L2224/8139920130101 ,  H01L2224/023920130101 ,  H01L2224/21520130101 ,  H01L2224/1314720130101

摘要： Embodiments disclosed herein include electronic package and methods of forming such packages. In an embodiment, an electronic package comprises a mold layer and a first die embedded in the mold layer. In an embodiment, the first die comprises first pads at a first pitch and second pads at a second pitch. In an embodiment, the electronic package further comprises a second die embedded in the mold layer, where the second die comprises third pads at the first pitch and fourth pads at the second pitch. In an embodiment, a bridge die is embedded in the mold layer, and the bridge die electrically couples the second pads to the fourth pads.

公开(公告)号：EP4216259B1

公开(公告)日：2024-05-15

申请号：EP22152939.9

申请日：2022-01-24

IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L25/11

CPC分类号： H01L2224/0410520130101 ,  H01L2224/7326720130101 ,  H01L2224/9224420130101 ,  H01L2224/21420130101 ,  H01L2924/1309120130101 ,  H01L2224/3224520130101 ,  H01L2924/1305520130101 ,  H01L24/20 ,  H01L25/115 ,  H01L2224/1210520130101 ,  H01L2224/838420130101 ,  H01L24/19 ,  H01L2224/0605120130101 ,  H01L2224/0555120130101 ,  H01L2224/0555420130101 ,  H01L2224/0555320130101 ,  H01L2224/29120130101 ,  H01L24/06 ,  H01L23/49562 ,  H01L2224/060320130101 ,  H01L2224/0618120130101 ,  H01L2924/3010720130101 ,  H01L23/36