公开(公告)号：EP4325553A3

公开(公告)日：2024-05-22

申请号：EP23220595.5

申请日：2020-03-10

申请人： INTEL Corporation

发明人： MALLIK, Debendra ,  MAHAJAN, Ravindranath ,  SANKMAN, Robert ,  LIFF, Shawna ,  PIETAMBARAM, Srinivas ,  PENMECHA, Bharat

IPC分类号： H01L21/683

CPC分类号： H01L2224/1820130101 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/13 ,  H01L21/6835 ,  H01L23/49816 ,  H01L2221/6834520130101 ,  H01L23/3128 ,  H01L2924/1816120130101 ,  H01L2224/1626520130101 ,  H01L2224/1626720130101 ,  H01L2224/9620130101 ,  H01L2224/9720130101 ,  H01L2224/140320130101 ,  H01L2224/8119120130101 ,  H01L2224/8100520130101 ,  H01L2224/1718120130101 ,  H01L2224/0564720130101 ,  H01L2224/0556820130101 ,  H01L24/17 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/0410520130101 ,  H01L2224/0333420130101 ,  H01L2224/03120130101 ,  H01L2224/0300320130101 ,  H01L2224/0618120130101 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/14 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/055720130101 ,  H01L2224/040120130101 ,  H01L2224/1302520130101 ,  H01L2224/1622720130101 ,  H01L2224/1614520130101 ,  H01L2224/13120130101

摘要： Embodiments disclosed herein include electronic packages and methods of fabricating electronic packages. In an embodiment, an electronic package comprises an interposer, where a cavity passes through the interposer, and a nested component in the cavity. In an embodiment, the electronic package further comprises a die coupled to the interposer by a first interconnect and coupled to the nested component by a second interconnect. In an embodiment, the first and second interconnects comprise a first bump, a bump pad over the first bump, and a second bump over the bump pad.