公开(公告)号：EP4340023A3

公开(公告)日：2024-06-12

申请号：EP23220590.6

申请日：2020-02-03

申请人： INTEL Corporation

发明人： MAHAJAN, Ravindranath Vithal ,  MALLIK, Debendra ,  SHARAN, Sujit ,  RAORANE, Digvijay

IPC分类号： H01L23/38 ,  H01L23/538

CPC分类号： H01L23/5389 ,  H01L23/38 ,  H01L23/49827 ,  H01L23/49816 ,  H01L23/49811 ,  H01L25/0652 ,  H01L2225/0651720130101 ,  H01L2225/0654820130101 ,  H01L2225/0657220130101 ,  H01L2225/0652720130101 ,  H01L2225/0655520130101 ,  H01L2225/0654120130101 ,  H01L2225/0651320130101 ,  H01L25/18 ,  H01L2224/8120320130101 ,  H01L2224/8181520130101 ,  H01L2224/7320420130101 ,  H01L2224/1626520130101 ,  H01L2224/1718120130101 ,  H01L2924/1015820130101 ,  H01L2224/1623820130101 ,  H01L2924/1515320130101 ,  H01L2924/1816120130101 ,  H01L24/16 ,  H01L2224/1614520130101 ,  H01L2224/13120130101 ,  H01L2224/1302520130101 ,  H01L23/147 ,  H01L21/486 ,  H01L23/5385

摘要： Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, the electronic package comprises a base substrate. The base substrate may have a plurality of through substrate vias. In an embodiment, a first die is over the base substrate. In an embodiment a first cavity is disposed into the base substrate. In an embodiment, the first cavity is at least partially within a footprint of the first die. In an embodiment, a first component is in the first cavity.

公开(公告)号：EP4325552A3

公开(公告)日：2024-07-10

申请号：EP23219820.0

申请日：2019-05-03

申请人： Intel Corporation

发明人： SANKMAN, Robert ,  AGRGHARAM, Sairam ,  WANG, Guotao ,  OU, Shengquan ,  DE BONIS, Thomas ,  SPENCER, Todd ,  SUN, Yang

IPC分类号： H01L21/60 ,  H01L25/065 ,  H01L21/98 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538

CPC分类号： H01L23/3128 ,  H01L23/3135 ,  H01L21/56 ,  H01L21/568 ,  H01L23/5385 ,  H01L23/49816 ,  H01L23/5389 ,  H01L25/0655 ,  H01L2224/132920130101 ,  H01L2224/13320130101 ,  H01L2224/0822520130101 ,  H01L2224/0410520130101 ,  H01L2224/920220130101 ,  H01L2224/1210520130101 ,  H01L2224/9720130101 ,  H01L2224/1622720130101 ,  H01L2224/8198620130101 ,  H01L24/95 ,  H01L24/81 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/8119220130101 ,  H01L2224/8119120130101 ,  H01L2224/170320130101 ,  H01L2224/8100520130101 ,  H01L2224/9500120130101 ,  H01L2224/3224520130101 ,  H01L2224/7325320130101 ,  H01L2224/7320920130101 ,  H01L2924/1816220130101 ,  H01L2924/1816120130101 ,  H01L24/96 ,  H01L2224/7320420130101 ,  H01L2224/3222520130101 ,  H01L25/0652 ,  H01L2224/0618120130101 ,  H01L2224/055720130101 ,  H01L2225/0651320130101 ,  H01L2225/0651720130101 ,  H01L2225/0654120130101 ,  H01L2225/0656220130101 ,  H01L2225/0658620130101 ,  H01L2224/0814520130101 ,  H01L2224/1614520130101 ,  H01L2924/1625120130101 ,  H01L2224/8203920130101 ,  H01L2223/5442620130101 ,  H01L2224/9222420130101 ,  H01L24/19 ,  H01L2924/1519220130101 ,  H01L25/50 ,  H01L2224/13120130101 ,  H01L2224/7325120130101 ,  H01L2224/040120130101 ,  H01L2224/1718120130101 ,  H01L24/73 ,  H01L24/08

摘要： An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.

公开(公告)号：EP4406025A1

公开(公告)日：2024-07-31

申请号：EP22769480.9

申请日：2022-08-23

申请人： QUALCOMM INCORPORATED

发明人： FENG, Chien-Te ,  YIN, Wen ,  SALMON, Jay Scott

IPC分类号： H01L25/16 ,  H01L23/36 ,  H01L23/552 ,  H01L23/00

CPC分类号： H01L25/16 ,  H01L23/552 ,  H01L2224/7325320130101 ,  H01L2924/1532120130101 ,  H01L2924/1816120130101 ,  H01L2224/040120130101 ,  H01L2224/0402620130101 ,  H01L2924/302520130101 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/3677 ,  H01L2224/1622720130101 ,  H01L2224/3224520130101 ,  H01L2224/0556820130101 ,  H01L2224/8381520130101 ,  H01L2224/8181520130101 ,  H01L2224/9222520130101 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/73 ,  H01L24/29 ,  H01L24/13 ,  H01L24/05 ,  H01L23/5383 ,  H01L23/5384

公开(公告)号：EP3751603B1

公开(公告)日：2024-10-09

申请号：EP20179156.3

申请日：2020-06-10

IPC分类号： H01L23/367 ,  H01L23/31 ,  H01L23/36 ,  H01L23/373 ,  H01L23/42

CPC分类号： H01L2924/351120130101 ,  H01L2924/35120130101 ,  H01L2924/181620130101 ,  H01L2924/1816120130101 ,  H01L2224/1622720130101 ,  H01L2224/3222720130101 ,  H01L2224/2929420130101 ,  H01L2224/29320130101 ,  H01L2224/2919120130101 ,  H01L2224/3318120130101 ,  H01L2224/7325320130101 ,  H01L2224/0345220130101 ,  H01L2224/034520130101 ,  H01L2224/034620130101 ,  H01L2224/0564420130101 ,  H01L2224/056620130101 ,  H01L2224/0402620130101 ,  H01L2224/29120130101 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/29 ,  H01L24/16 ,  H01L24/32 ,  H01L2224/3224520130101 ,  H01L24/33 ,  H01L23/367 ,  H01L23/42 ,  H01L23/36 ,  H01L23/3121

公开(公告)号：EP4325565A3

公开(公告)日：2024-07-03

申请号：EP23220744.9

申请日：2021-09-13

申请人： INTEL Corporation

发明人： WAIDHAS, Bernd ,  WOLTER, Andreas ,  SEIDEMANN, Georg ,  WAGNER, Thomas

IPC分类号： H01L23/538 ,  H01L21/98 ,  H01L25/065 ,  H01L21/60

CPC分类号： H01L24/96 ,  H01L2224/040120130101 ,  H01L2224/0410520130101 ,  H01L2224/1210520130101 ,  H01L2924/1816220130101 ,  H01L2924/1816120130101 ,  H01L2224/060320130101 ,  H01L2224/7320920130101 ,  H01L2224/1622720130101 ,  H01L2924/1531120130101 ,  H01L24/20 ,  H01L2224/21420130101 ,  H01L2224/8100520130101 ,  H01L2224/13120130101 ,  H01L2224/0822520130101 ,  H01L2224/0814520130101 ,  H01L2224/1614520130101 ,  H01L2224/8000620130101 ,  H01L2924/1910420130101 ,  H01L2224/1626520130101 ,  H01L2224/9212420130101 ,  H01L2224/921220130101 ,  H01L2224/7320120130101 ,  H01L2224/0826520130101 ,  H01L2224/0564720130101 ,  H01L2224/055720130101 ,  H01L2924/1519220130101 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2225/0652420130101 ,  H01L2225/0651320130101 ,  H01L2225/0654120130101 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/8203920130101 ,  H01L24/19 ,  H01L2924/351120130101 ,  H01L23/5385 ,  H01L23/49816 ,  H01L2224/0824520130101 ,  H01L2224/3224520130101 ,  H01L2224/3222520130101 ,  H01L2224/7326720130101 ,  H01L2224/9224420130101 ,  H01L2224/170320130101 ,  H01L2224/1100220130101 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L25/18 ,  H01L25/105 ,  H01L2225/102920130101 ,  H01L2225/102320130101 ,  H01L2924/38120130101 ,  H01L2224/140320130101 ,  H01L2224/8119320130101 ,  H01L2224/9520130101 ,  H01L2224/1302220130101 ,  H01L2224/1308220130101 ,  H01L2224/9620130101 ,  H01L2224/0555320130101 ,  H01L2224/061220130101 ,  H01L2224/0237520130101 ,  H01L24/14 ,  H01L2224/8139920130101 ,  H01L2224/023920130101 ,  H01L2224/21520130101 ,  H01L2224/1314720130101

摘要： Embodiments disclosed herein include electronic package and methods of forming such packages. In an embodiment, an electronic package comprises a mold layer and a first die embedded in the mold layer. In an embodiment, the first die comprises first pads at a first pitch and second pads at a second pitch. In an embodiment, the electronic package further comprises a second die embedded in the mold layer, where the second die comprises third pads at the first pitch and fourth pads at the second pitch. In an embodiment, a bridge die is embedded in the mold layer, and the bridge die electrically couples the second pads to the fourth pads.

公开(公告)号：EP4428913A2

公开(公告)日：2024-09-11

申请号：EP24191249.2

申请日：2020-01-15

申请人： MediaTek Inc.

发明人： HSU, Chia-Hao ,  CHEN, Tai-Yu ,  TSAI, Shiann-Tsong ,  LIU, Hsing-Chih ,  HSU, Yao-Pang ,  CHEN, Chi-Yuan ,  LEE, Chung-Fa

IPC分类号： H01L23/00

CPC分类号： H01L2224/7320420130101 ,  H01L2223/667720130101 ,  H01L23/3677 ,  H01L23/66 ,  H01L24/33 ,  H01L23/49816 ,  H01L23/4334 ,  H01L23/3128 ,  H01L23/49822 ,  H01L2224/8381520130101 ,  H01L2224/8319220130101 ,  H01L2224/9222520130101 ,  H01L2224/3223520130101 ,  H01L2224/3318120130101 ,  H01L2224/4822720130101 ,  H01L2224/7321520130101 ,  H01L2224/3201420130101 ,  H01L2924/1816120130101 ,  H01L24/16 ,  H01L24/32 ,  H01L24/29 ,  H01L24/73 ,  H01L2224/1314720130101 ,  H01L2224/1623820130101 ,  H01L2224/291920130101 ,  H01L2224/3214520130101 ,  H01L2224/7326520130101 ,  H01L2224/7325320130101

摘要： A semiconductor package (1) includes a base (10) having an upper surface (10a) and a lower surface (10b) opposite to the upper surface (10a). An antenna array structure (11) is embedded at the upper surface (10a) of the base (10). An IC die (20) is mounted on the lower surface (10b) of the base (10) in a flip-chip manner so that a backside of the IC die (20) is available for heat dissipation. Solder ball pads (118, 120) are disposed on the lower surface (10b) of the base (10) and arranged around the IC die (20). The semiconductor package (1) further includes a metal thermal interface layer (30) having a backside metal layer (310) that is in direct contact with the backside of the IC die (20), and a solder paste (320) conformally printed on the backside metal layer (310).

公开(公告)号：EP4423815A1

公开(公告)日：2024-09-04

申请号：EP22813379.9

申请日：2022-10-26

申请人： Advanced Micro Devices, Inc.

发明人： AGARWAL, Rahul ,  SWAMINATHAN, Raja

IPC分类号： H01L25/16 ,  H01L25/065

CPC分类号： H01L25/16 ,  H01L25/0652 ,  H01L2924/1904120130101 ,  H01L2924/1910420130101 ,  H01L2924/1904320130101 ,  H01L2924/1904220130101 ,  H01L2224/040120130101 ,  H01L2224/055720130101 ,  H01L2224/1626520130101 ,  H01L2224/1622720130101 ,  H01L2224/1302520130101 ,  H01L2224/1718120130101 ,  H01L2224/8100520130101 ,  H01L2224/8181520130101 ,  H01L2224/0826520130101 ,  H01L2224/8000620130101 ,  H01L2224/13120130101 ,  H01L2225/0651320130101 ,  H01L2225/0651720130101 ,  H01L2225/0654120130101 ,  H01L2224/0814620130101 ,  H01L2224/1614620130101 ,  H01L2924/1816120130101 ,  H01L2224/7325920130101 ,  H01L2224/9222420130101 ,  H01L2924/1910520130101 ,  H01L2924/1531120130101 ,  H01L24/20 ,  H01L24/73 ,  H01L24/92 ,  H01L24/08 ,  H01L24/80 ,  H01L2224/0822520130101 ,  H01L24/81 ,  H01L24/16 ,  H01L24/13 ,  H01L25/0657 ,  H01L23/481 ,  H01L23/562 ,  H01L23/3128 ,  H01L23/16 ,  H01L21/6835 ,  H01L2221/6832720130101 ,  H01L2221/6834520130101

公开(公告)号：EP4402721A1

公开(公告)日：2024-07-24

申请号：EP22870489.6

申请日：2022-08-22

申请人： INTEL Corporation

发明人： GANESAN, Sanka ,  LAMBERT, William J. ,  PENMECHA, Bharat Prasad ,  BRUN, Xavier Francois

IPC分类号： H01L25/10 ,  H01L23/538 ,  H01L23/00 ,  H01L25/18

CPC分类号： H01L23/5389 ,  H01L23/49816 ,  H01L23/5385 ,  H01L2924/0001420130101 ,  H01L2224/4809120130101 ,  H01L2224/1622520130101 ,  H01L2924/1816120130101 ,  H01L2924/18120130101 ,  H01L24/48 ,  H01L25/105 ,  H01L25/0657 ,  H01L2225/065120130101 ,  H01L25/0652 ,  H01L2225/0657220130101 ,  H01L2225/0651320130101 ,  H01L2225/0651720130101 ,  H01L2225/0652420130101 ,  H01L2225/0654120130101 ,  H01L2225/0654820130101 ,  H01L25/50 ,  H01L21/568 ,  H01L21/6835 ,  H01L2221/6835920130101 ,  H01L2221/6834520130101 ,  H01L2221/6837220130101 ,  H01L24/18 ,  H01L2224/1622120130101 ,  H01L2224/1718120130101 ,  H01L24/17

公开(公告)号：EP3624181B1

公开(公告)日：2024-07-03

申请号：EP19196606.8

申请日：2019-09-11

IPC分类号： H01L23/10 ,  H01L23/16 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065

CPC分类号： H01L25/0655 ,  H01L23/3185 ,  H01L23/10 ,  H01L23/16 ,  H01L2224/1210520130101 ,  H01L23/49827 ,  H01L23/49822 ,  H01L23/49816 ,  H01L2924/1515120130101 ,  H01L2924/17120130101 ,  H01L2924/1517420130101 ,  H01L2924/18120130101 ,  H01L2224/1622520130101 ,  H01L2924/1531120130101 ,  H01L2924/1816120130101 ,  H01L2224/7320420130101 ,  H01L2224/3222520130101 ,  H01L24/96 ,  H01L24/81 ,  H01L2224/9212520130101 ,  H01L24/92 ,  H01L2224/291920130101 ,  H01L24/29 ,  H01L24/32 ,  H01L24/16 ,  H01L2924/0001420130101

公开(公告)号：EP4325553A3

公开(公告)日：2024-05-22

申请号：EP23220595.5

申请日：2020-03-10

申请人： INTEL Corporation

发明人： MALLIK, Debendra ,  MAHAJAN, Ravindranath ,  SANKMAN, Robert ,  LIFF, Shawna ,  PIETAMBARAM, Srinivas ,  PENMECHA, Bharat

IPC分类号： H01L21/683

CPC分类号： H01L2224/1820130101 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/13 ,  H01L21/6835 ,  H01L23/49816 ,  H01L2221/6834520130101 ,  H01L23/3128 ,  H01L2924/1816120130101 ,  H01L2224/1626520130101 ,  H01L2224/1626720130101 ,  H01L2224/9620130101 ,  H01L2224/9720130101 ,  H01L2224/140320130101 ,  H01L2224/8119120130101 ,  H01L2224/8100520130101 ,  H01L2224/1718120130101 ,  H01L2224/0564720130101 ,  H01L2224/0556820130101 ,  H01L24/17 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/0410520130101 ,  H01L2224/0333420130101 ,  H01L2224/03120130101 ,  H01L2224/0300320130101 ,  H01L2224/0618120130101 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/14 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/055720130101 ,  H01L2224/040120130101 ,  H01L2224/1302520130101 ,  H01L2224/1622720130101 ,  H01L2224/1614520130101 ,  H01L2224/13120130101

摘要： Embodiments disclosed herein include electronic packages and methods of fabricating electronic packages. In an embodiment, an electronic package comprises an interposer, where a cavity passes through the interposer, and a nested component in the cavity. In an embodiment, the electronic package further comprises a die coupled to the interposer by a first interconnect and coupled to the nested component by a second interconnect. In an embodiment, the first and second interconnects comprise a first bump, a bump pad over the first bump, and a second bump over the bump pad.