公开(公告)号：EP1109214A1

公开(公告)日：2001-06-20

申请号：EP99125114.1

申请日：1999-12-16

申请人： Infineon Technologies AG

发明人： Lehner, Rudolf

IPC分类号： H01L21/60 ,  H01L21/607

CPC分类号： H01L24/744 ,  B23K2201/40 ,  H01L24/37 ,  H01L24/40 ,  H01L24/77 ,  H01L24/84 ,  H01L2224/37124 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19042

摘要： Die vorliegende Erfindung betrifft eine Anordnung und ein Verfahren zum Kontaktieren von Schaltkreisen mit einem Schaltkreis (1), einem Träger (2), der neben dem Schaltkreis (1) angeordnet ist, einem Setzelement (5), an der eine elektrische Verbindung (3) aus einem leitenden Material (6) angeordnet ist, so daß die elektrische Verbindung (3) in einem Bond-Prozeß den Schaltkreis (1) mit dem Träger (2) verbindet.

摘要翻译： 本发明涉及一种接触开关电​​路的系统和方法。 本发明的系统由开关电路（1），与所述开关电路（1）相邻布置的支撑件（2）和设置元件（5）组成，电连接（3）由 设置导电材料（6）。 使设置元件紧密地连接到开关电路和支撑件，使得在接合过程中，电连接（3）将开关电路（1）连接到支撑件（2）。

公开(公告)号：EP1250713B1

公开(公告)日：2008-10-08

申请号：EP00993459.7

申请日：2000-12-15

申请人： Infineon Technologies AG

发明人： LEHNER, Rudolf

IPC分类号： H01L21/60 ,  H01L21/603 ,  H01L23/495

CPC分类号： H01L24/744 ,  B23K2201/40 ,  H01L24/37 ,  H01L24/40 ,  H01L24/77 ,  H01L24/84 ,  H01L2224/37124 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19042

摘要： The invention relates to a system and method for contacting switching circuits. The inventive system consists of a switching circuit (1), of a support (2), which is arranged next to said switching circuit (1), and of a setting element (5), on which an electric connection (3) made of a conductive material (6) is arranged. The setting element is brought closely to the switching circuit and to the support so that, in a bonding process, the electrical connection (3) connects the switching circuit (1) to the support (2).

公开(公告)号：EP1250713A1

公开(公告)日：2002-10-23

申请号：EP00993459.7

申请日：2000-12-15

申请人： Infineon Technologies AG

发明人： LEHNER, Rudolf

IPC分类号： H01L21/60 ,  H01L21/603 ,  H01L23/495

CPC分类号： H01L24/744 ,  B23K2201/40 ,  H01L24/37 ,  H01L24/40 ,  H01L24/77 ,  H01L24/84 ,  H01L2224/37124 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19042

摘要： The invention relates to a system and method for contacting switching circuits. The inventive system consists of a switching circuit (1), of a support (2), which is arranged next to said switching circuit (1), and of a setting element (5), on which an electric connection (3) made of a conductive material (6) is arranged. The setting element is brought closely to the switching circuit and to the support so that, in a bonding process, the electrical connection (3) connects the switching circuit (1) to the support (2).