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公开(公告)号：EP3794641B1
公开(公告)日：2024-07-10
申请号：EP19724406.4
申请日：2019-05-10
IPC分类号： H01L25/07 , H01L23/373
CPC分类号： H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/75 , H01L24/77 , H01L24/83 , H01L24/84 , H01L24/92 , H01L2224/2617520130101 , H01L2224/273220130101 , H01L2224/29120130101 , H01L2224/2929420130101 , H01L2224/29320130101 , H01L2224/3201320130101 , H01L2224/3224520130101 , H01L2224/3318120130101 , H01L2224/3701120130101 , H01L2224/3701320130101 , H01L2224/4049920130101 , H01L2224/4099620130101 , H01L2224/7570320130101 , H01L2224/7570420130101 , H01L2224/7570520130101 , H01L2224/7575420130101 , H01L2224/7575520130101 , H01L2224/7575620130101 , H01L2224/7770320130101 , H01L2224/8314320130101 , H01L2224/8319120130101 , H01L2224/8319220130101 , H01L2224/8319320130101 , H01L2224/8381520130101 , H01L2224/8481520130101 , H01L2224/922120130101
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2.发明公开
公开(公告)号：EP3281218A1
公开(公告)日：2018-02-14
申请号：EP16726297.1
申请日：2016-05-23
IPC分类号： H01L21/60 , H01L23/492 , H01L23/495 , H01L23/367
CPC分类号： H01L23/49 , C25D3/38 , C25D5/18 , C25D21/14 , H01L23/3733 , H01L23/3735 , H01L23/4922 , H01L23/49513 , H01L23/49537 , H01L23/49562 , H01L23/49568 , H01L23/49811 , H01L23/50 , H01L24/05 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/75 , H01L24/77 , H01L24/82 , H01L24/83 , H01L24/84 , H01L24/92 , H01L24/97 , H01L2224/04026 , H01L2224/04034 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/24105 , H01L2224/24227 , H01L2224/24245 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/3207 , H01L2224/32227 , H01L2224/32245 , H01L2224/33181 , H01L2224/37005 , H01L2224/37111 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37155 , H01L2224/37166 , H01L2224/3719 , H01L2224/37211 , H01L2224/37224 , H01L2224/37239 , H01L2224/37244 , H01L2224/37247 , H01L2224/37255 , H01L2224/37266 , H01L2224/3729 , H01L2224/373 , H01L2224/37395 , H01L2224/376 , H01L2224/4007 , H01L2224/40227 , H01L2224/40499 , H01L2224/756 , H01L2224/75703 , H01L2224/776 , H01L2224/77703 , H01L2224/821 , H01L2224/82101 , H01L2224/83007 , H01L2224/831 , H01L2224/834 , H01L2224/83411 , H01L2224/83424 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/83466 , H01L2224/8349 , H01L2224/83511 , H01L2224/83524 , H01L2224/83539 , H01L2224/83544 , H01L2224/83547 , H01L2224/83555 , H01L2224/83566 , H01L2224/8359 , H01L2224/836 , H01L2224/83695 , H01L2224/8385 , H01L2224/83907 , H01L2224/84007 , H01L2224/841 , H01L2224/8485 , H01L2224/8492 , H01L2224/84951 , H01L2224/9201 , H01L2224/9205 , H01L2224/9221 , H01L2224/97 , H01L2924/13055 , H01L2924/181 , H05K3/424 , H01L2924/00012 , H05K3/4661 , H01L2924/00014 , H01L2924/01029 , H01L2924/01028 , H01L2924/01047 , H01L2924/01079 , H01L2924/0105 , H01L2224/83 , H01L2224/84 , H01L2224/82 , H01L2924/01014
摘要： The invention relates to a method for electrically contacting a component (10) (for example a power component and/or a (semiconductor) component having at least one transistor, preferably an IGBT (insulated-gate bipolar transistor)) having at least one contact (40, 50), at least one open-pored contact piece (60, 70) is galvanically (electrochemically or free of external current) connected to at least one contact (40, 50). In this way, a component module is achieved. The contact (40, 50) is preferably a flat part or has a contact surface, the largest planar extent thereof being greater than an extension of the contact (40, 50) perpendicular to said contact surface. The temperature of the galvanic connection is at most 100 °C, preferably at most 60 °C, advantageously at most 20 °C and ideally at most 5 °C and/or deviates from the operating temperature of the component by at most 50 °C, preferably by at most 20 °C, in particular by at most 10 °C and ideally by at most 5 °C, preferably by at most 2 °C. The component (10) can be contacted by means of the contact piece (60, 70) with a further component, a current conductor and/or a substrate (90). Preferably, a component (10) having two contacts (40, 50) on opposite sides of the component (10) is used, wherein at least one open-pored contact piece (60, 70) is galvanically connected to each contact (40, 50).
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公开(公告)号：EP3271938A2
公开(公告)日：2018-01-24
申请号：EP16706510.1
申请日：2016-02-15
IPC分类号： H01L21/60 , H01L23/488 , B23K26/20
CPC分类号： H01L24/48 , B23K26/20 , H01L24/03 , H01L24/05 , H01L24/16 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/73 , H01L24/77 , H01L24/81 , H01L24/84 , H01L24/85 , H01L2224/04034 , H01L2224/04042 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/16225 , H01L2224/37026 , H01L2224/37147 , H01L2224/40091 , H01L2224/40225 , H01L2224/40491 , H01L2224/40992 , H01L2224/40997 , H01L2224/4112 , H01L2224/45005 , H01L2224/45147 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/48247 , H01L2224/48839 , H01L2224/48847 , H01L2224/73255 , H01L2224/77263 , H01L2224/77281 , H01L2224/77601 , H01L2224/77611 , H01L2224/77704 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81464 , H01L2224/84214 , H01L2224/84424 , H01L2224/84439 , H01L2224/84444 , H01L2224/84447 , H01L2224/84455 , H01L2224/84464 , H01L2224/8484 , H01L2224/8485 , H01L2224/84986 , H01L2224/85051 , H01L2224/85203 , H01L2224/85214 , H01L2224/85379 , H01L2224/8584 , H01L2924/00014 , H01L2924/10253 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/1579 , H01L2224/13099
摘要： The invention relates to a chip arrangement (10) and a method for forming a contact connection (11) between a chip (18), in particular a power transistor or the like, and a conductor material strip (14), said conductor material strip being formed on a non-conductive substrate (12) and the chip being arranged on the substrate or on a conductor material strip (15). A silver paste (29) or copper paste is applied to a chip contact surface (25) of the chip and of the conductor material strip (28), a contact conductor (30) is dipped into the silver paste or the copper paste on the chip contact surface and into the silver paste or the copper paste on the conductor material strip, and a solvent contained in the silver paste or the copper paste is at least partially evaporated by heating. The silver paste or the copper paste is then sintered by means of laser energy, thereby forming the contact connection.
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公开(公告)号：EP1109214A1
公开(公告)日：2001-06-20
申请号：EP99125114.1
申请日：1999-12-16
发明人： Lehner, Rudolf
IPC分类号： H01L21/60 , H01L21/607
CPC分类号： H01L24/744 , B23K2201/40 , H01L24/37 , H01L24/40 , H01L24/77 , H01L24/84 , H01L2224/37124 , H01L2224/37144 , H01L2224/37147 , H01L2224/40095 , H01L2224/40245 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19042
摘要： Die vorliegende Erfindung betrifft eine Anordnung und ein Verfahren zum Kontaktieren von Schaltkreisen mit einem Schaltkreis (1), einem Träger (2), der neben dem Schaltkreis (1) angeordnet ist, einem Setzelement (5), an der eine elektrische Verbindung (3) aus einem leitenden Material (6) angeordnet ist, so daß die elektrische Verbindung (3) in einem Bond-Prozeß den Schaltkreis (1) mit dem Träger (2) verbindet.
摘要翻译： 本发明涉及一种接触开关电路的系统和方法。 本发明的系统由开关电路（1），与所述开关电路（1）相邻布置的支撑件（2）和设置元件（5）组成，电连接（3）由 设置导电材料（6）。 使设置元件紧密地连接到开关电路和支撑件，使得在接合过程中，电连接（3）将开关电路（1）连接到支撑件（2）。
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公开(公告)号：EP1734569B1
公开(公告)日：2012-05-09
申请号：EP04716348.0
申请日：2004-03-02
发明人： FUJIMOTO, Kozo , WATANABE, H., Fuji Elect. Adv. Techn. Co.,Ltd. , IKEMI, Kazutaka, Fuji Electric Holdings Co., Ltd. , SHIMODA, M., Fuji Electric Adv. Techn. Co.,Ltd. , TANIGUTHI, K., Fuji Electric Adv. Techn. Co., Ltd. , GOTO, Tomoaki, Fuji Electric Adv. Techn. Co., Ltd. , MATSUMURA, Keiichi, Fuji Elect.Creat.Supp.Serv.Co,
IPC分类号： H05K3/32 , H01L23/492 , H01L21/60
CPC分类号： H05K3/328 , H01L23/492 , H01L23/49838 , H01L24/29 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/77 , H01L24/83 , H01L24/84 , H01L2224/04026 , H01L2224/29109 , H01L2224/29111 , H01L2224/32225 , H01L2224/371 , H01L2224/37147 , H01L2224/40091 , H01L2224/40095 , H01L2224/40225 , H01L2224/45032 , H01L2224/45124 , H01L2224/48091 , H01L2224/73265 , H01L2224/83191 , H01L2224/83801 , H01L2224/83825 , H01L2224/84801 , H01L2224/84825 , H01L2224/85895 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/15747 , H01L2924/15787 , H01L2924/30105 , H01L2924/351 , H05K2203/0278 , H01L2924/01049 , H01L2924/01028 , H01L2924/01083 , H01L2224/29099 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： A process for producing a semiconductor module in which bonding can be carried out at a low temperature in a short time without using a solder bonding medium and a highly reliable joint can be attained. The process for producing a semiconductor module comprises a first bonding step for bonding a first circuit electrode on a circuit board and an element electrode on the rear surface side of a semiconductor element, a second bonding step for bonding an element electrode on the surface side of the semiconductor element and one end of a lead frame, and a third bonding step for bonding the other end of the lead frame and a second circuit electrode formed on the circuit board. A low-melting-point metal layer is formed at one of a pair of conductive parts to be connected and then hot pressed so that solid-liquid diffusion of the low-melting-point metal layer into the pair of conductive parts takes place, thus bonding the conductive parts.
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公开(公告)号：EP1832147B1
公开(公告)日：2010-08-04
申请号：EP04804388.9
申请日：2004-12-29
申请人： PGT Photonics S.p.A.
发明人： DELROSSO, Giovanni
CPC分类号： H01L24/80 , H01C17/28 , H01G13/006 , H01L21/67138 , H01L24/45 , H01L24/77 , H01L24/78 , H01L2224/45015 , H01L2224/45118 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4516 , H01L2224/78 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/19042 , H01L2924/19043 , H01L2924/00014 , H01L2924/20754 , H01L2924/20756 , H01L2924/20755 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/013 , H01L2924/01028
摘要： To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components the following steps are carried out: a.providing a frame including at least one tensioned wire, b. providing a holding jig including at least one seat in which a respective one of said components can be removably and temporarily retained, c. applying said components to said seats with the respective electrodes aligned along a respective longitudinal direction; in this way a row of aligned components is obtained, each component having a corresponding electrode aligned to the subsequent one in the row, d. applying said holding jig to said frame and orienting the same so that said longitudinal direction corresponds to the direction of said tensioned wire, said tensioned wire being thereby brought substantially in contact with (all) the electrode(s) aligned to each other on a corresponding row of components, e. electrically and mechanically bonding said tensioned wire to the corresponding electrodes; in this way all components are simultaneously bonded to the wire, f. cut said wire to separate said components from each other thereby forming a respective lead terminal for each electrode.
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公开(公告)号：EP1832147A1
公开(公告)日：2007-09-12
申请号：EP04804388.9
申请日：2004-12-29
申请人： Pirelli & C. S.p.A.
发明人： DELROSSO, Giovanni
CPC分类号： H01L24/80 , H01C17/28 , H01G13/006 , H01L21/67138 , H01L24/45 , H01L24/77 , H01L24/78 , H01L2224/45015 , H01L2224/45118 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4516 , H01L2224/78 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/19042 , H01L2924/19043 , H01L2924/00014 , H01L2924/20754 , H01L2924/20756 , H01L2924/20755 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/013 , H01L2924/01028
摘要： To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components the following steps are carried out: a.providing a frame including at least one tensioned wire, b. providing a holding jig including at least one seat in which a respective one of said components can be removably and temporarily retained, c. applying said components to said seats with the respective electrodes aligned along a respective longitudinal direction; in this way a row of aligned components is obtained, each component having a corresponding electrode aligned to the subsequent one in the row, d. applying said holding jig to said frame and orienting the same so that said longitudinal direction corresponds to the direction of said tensioned wire, said tensioned wire being thereby brought substantially in contact with (all) the electrode(s) aligned to each other on a corresponding row of components, e. electrically and mechanically bonding said tensioned wire to the corresponding electrodes; in this way all components are simultaneously bonded to the wire, f. cut said wire to separate said components from each other thereby forming a respective lead terminal for each electrode.
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公开(公告)号：EP3018712A1
公开(公告)日：2016-05-11
申请号：EP13888740.1
申请日：2013-07-05
发明人： YATO, Yuichi , OKA, Hiroi , OKUNISHI, Noriko , TAKADA, Keita
IPC分类号： H01L23/50
CPC分类号： H01L23/49513 , H01L21/565 , H01L23/13 , H01L23/16 , H01L23/24 , H01L23/3121 , H01L23/3142 , H01L23/4952 , H01L23/49524 , H01L23/49541 , H01L23/49548 , H01L23/49562 , H01L23/49582 , H01L23/49805 , H01L23/49844 , H01L23/562 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/77 , H01L2224/05624 , H01L2224/05644 , H01L2224/0603 , H01L2224/2929 , H01L2224/29339 , H01L2224/32245 , H01L2224/37147 , H01L2224/40091 , H01L2224/40095 , H01L2224/40245 , H01L2224/40247 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/48247 , H01L2224/48624 , H01L2224/48644 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/743 , H01L2224/83192 , H01L2224/83439 , H01L2224/8385 , H01L2224/83862 , H01L2224/84205 , H01L2224/84439 , H01L2224/8501 , H01L2224/85181 , H01L2224/85205 , H01L2224/85439 , H01L2224/92157 , H01L2224/92247 , H01L2924/00014 , H01L2924/1301 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/18301 , H01L2924/351 , H01L2924/00 , H01L2924/0665 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device according to an embodiment is a semiconductor device in which a semiconductor chip mounted on a chip mounting part is sealed by resin and a first member is fixed to a chip mounting surface side between a peripheral portion of the semiconductor chip and a peripheral portion of the chip mounting part. Also, the first member is sealed by the resin. Also, a length of the first part of the chip mounting part in the first direction is larger than a length of the semiconductor chip in the first direction, in a plan view.
摘要翻译： 根据实施例的半导体器件是半导体器件，其中安装在芯片安装部分上的半导体芯片被树脂密封，并且第一部件被固定到半导体芯片的外围部分与外围部分之间的芯片安装表面侧 的芯片安装部分。 而且，第一部件由树脂密封。 而且，在平面图中，芯片安装部分的第一部分在第一方向上的长度大于半导体芯片在第一方向上的长度。
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公开(公告)号：EP1250713B1
公开(公告)日：2008-10-08
申请号：EP00993459.7
申请日：2000-12-15
发明人： LEHNER, Rudolf
IPC分类号： H01L21/60 , H01L21/603 , H01L23/495
CPC分类号： H01L24/744 , B23K2201/40 , H01L24/37 , H01L24/40 , H01L24/77 , H01L24/84 , H01L2224/37124 , H01L2224/37144 , H01L2224/37147 , H01L2224/40095 , H01L2224/40245 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19042
摘要： The invention relates to a system and method for contacting switching circuits. The inventive system consists of a switching circuit (1), of a support (2), which is arranged next to said switching circuit (1), and of a setting element (5), on which an electric connection (3) made of a conductive material (6) is arranged. The setting element is brought closely to the switching circuit and to the support so that, in a bonding process, the electrical connection (3) connects the switching circuit (1) to the support (2).
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公开(公告)号：EP1250713A1
公开(公告)日：2002-10-23
申请号：EP00993459.7
申请日：2000-12-15
发明人： LEHNER, Rudolf
IPC分类号： H01L21/60 , H01L21/603 , H01L23/495
CPC分类号： H01L24/744 , B23K2201/40 , H01L24/37 , H01L24/40 , H01L24/77 , H01L24/84 , H01L2224/37124 , H01L2224/37144 , H01L2224/37147 , H01L2224/40095 , H01L2224/40245 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19042
摘要： The invention relates to a system and method for contacting switching circuits. The inventive system consists of a switching circuit (1), of a support (2), which is arranged next to said switching circuit (1), and of a setting element (5), on which an electric connection (3) made of a conductive material (6) is arranged. The setting element is brought closely to the switching circuit and to the support so that, in a bonding process, the electrical connection (3) connects the switching circuit (1) to the support (2).
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