公开(公告)号：EP3165549A4

公开(公告)日：2017-12-20

申请号：EP15815767

申请日：2015-07-01

申请人： DAINIPPON INK & CHEMICALS

发明人： YOSHIMOTO YASUYO ,  KINOSHITA HIROSHI

IPC分类号： C08G59/32 ,  C08K3/00 ,  C08K7/02 ,  C08L63/00 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00

CPC分类号： C08G59/3218 ,  C08G59/32 ,  C08G59/5073 ,  C08K3/00 ,  C08K3/22 ,  C08K3/36 ,  C08K7/02 ,  C08K9/08 ,  C08K2003/2227 ,  C08K2201/001 ,  C08L63/00 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00 ,  H01L23/295 ,  H01L23/3737 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2924/01006 ,  H01L2924/04541 ,  H01L2924/0463 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2924/05032 ,  H01L2924/05042 ,  H01L2924/0532 ,  H01L2924/0542 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2924/186 ,  H05K1/0203 ,  H05K1/0373 ,  H05K2201/0104

摘要： An epoxy resin composition for electronic material, containing a polyfunctional biphenyl type epoxy resin that is a triglycidyloxybiphenyl or a tetraglycidyloxybiphenyl and at least one of a curing agent and a curing accelerator is provided. Furthermore, the epoxy resin composition for electronic material, further containing a filler, in particular, a thermal conductive filler, is provided. Furthermore, a cured product obtained by curing the epoxy resin composition for electronic material, and an electronic component containing the cured product are provided.

公开(公告)号：EP3165549A1

公开(公告)日：2017-05-10

申请号：EP15815767.7

申请日：2015-07-01

申请人： DIC Corporation

发明人： YOSHIMOTO Yasuyo ,  KINOSHITA Hiroshi

IPC分类号： C08G59/32 ,  C08K3/00 ,  C08K7/02 ,  C08L63/00 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00

CPC分类号： C08G59/3218 ,  C08G59/32 ,  C08G59/5073 ,  C08K3/00 ,  C08K3/22 ,  C08K3/36 ,  C08K7/02 ,  C08K9/08 ,  C08K2003/2227 ,  C08K2201/001 ,  C08L63/00 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00 ,  H01L23/295 ,  H01L23/3737 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2924/01006 ,  H01L2924/04541 ,  H01L2924/0463 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2924/05032 ,  H01L2924/05042 ,  H01L2924/0532 ,  H01L2924/0542 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2924/186 ,  H05K1/0203 ,  H05K1/0373 ,  H05K2201/0104

摘要： An epoxy resin composition for electronic material, containing a polyfunctional biphenyl type epoxy resin that is a triglycidyloxybiphenyl or a tetraglycidyloxybiphenyl and at least one of a curing agent and a curing accelerator is provided. Furthermore, the epoxy resin composition for electronic material, further containing a filler, in particular, a thermal conductive filler, is provided. Furthermore, a cured product obtained by curing the epoxy resin composition for electronic material, and an electronic component containing the cured product are provided.

摘要翻译： 提供一种电子材料用环氧树脂组合物，其含有作为三缩水甘油氧基联苯或四缩水甘油氧基联苯的多官能联苯型环氧树脂和固化剂和固化促进剂中的至少一种。 此外，提供了还含有填料，特别是导热填料的电子材料用环氧树脂组合物。 进而提供使电子材料用环氧树脂组合物固化而得到的固化物和含有该固化物的电子部件。