摘要:
A semiconductor laser device is disclosed which emits laser light from an end facet. The semiconductor laser device comprises a multi-layered structure (12) formed on a semiconductor substrate (11), the multi-layered structure (12) having an active layer (16) for laser oscillation, and a pair of cleavage planes (101) on the side of the multi-layered structure (12), wherein a graded-band-gap layer (18) is formed on at least one of the cleavage planes (101), the graded-band-gap layer (18) having a forbidden band gap which increases gradually with an increase in the distance from the cleavage plane (101) and the surface of the graded-band-gap layer (18) constituting the end facet.
摘要:
Semiconductor laser diodes, particularly high power ridge waveguide laser diodes, are often used in opto-electronics as so-called pump laser diodes for fiber amplifiers in optical communication lines. To provide the desired high power output and stability of such a laser diode and avoid degradation during use, the present invention concerns an improved design of such a device, the improvement in particular consisting of novel design of the ridge waveguide of the laser. Essentially the novel design consists in a segmented ridge wave- guide having at least two straight segments, i.e. segments with constant, but different cross sections or widths, and at least one flared segment connecting the two different straight segments. A further improvement can be achieved . by combining this approach with a laser diode design termed "unpumped end sections" and described in copending US patent application 09/852 994, entitled "High Power Semiconductor Laser Diode". Preferable for an advantageous manufacturing process is a segmented ridge waveguide design with three straight segments, at least two of them differing in cross section or width, and two flared segments connecting the differing straight segments. This latter design results in a wafer pattern of identical and identically oriented laser diode structures, thus allowing the use of standard manufacturing processes.
摘要:
Semiconductor laser diodes, particularly high power ridge waveguide laser diodes, are often used in opto-electronics as so-called pump laser diodes for fiber amplifiers in optical communication lines. To provide the desired high power output and stability of such a laser diode and avoid degradation during use, the present invention concerns an improved design of such a device, the improvement in particular consisting of novel design of the ridge waveguide of the laser. Essentially the novel design consists in a segmented ridge wave- guide having at least two straight segments, i.e. segments with constant, but different cross sections or widths, and at least one flared segment connecting the two different straight segments. A further improvement can be achieved . by combining this approach with a laser diode design termed 'unpumped end sections' and described in copending US patent application 09/852 994, entitled 'High Power Semiconductor Laser Diode'. Preferable for an advantageous manufacturing process is a segmented ridge waveguide design with three straight segments, at least two of them differing in cross section or width, and two flared segments connecting the differing straight segments. This latter design results in a wafer pattern of identical and identically oriented laser diode structures, thus allowing the use of standard manufacturing processes.
摘要:
A semiconductor laser device is disclosed which emits laser light from an end facet. The semiconductor laser device comprises a multi-layered structure (12) formed on a semiconductor substrate (11), the multi-layered structure (12) having an active layer (16) for laser oscillation, and a pair of cleavage planes (101) on the side of the multi-layered structure (12), wherein a graded-band-gap layer (18) is formed on at least one of the cleavage planes (101), the graded-band-gap layer (18) having a forbidden band gap which increases gradually with an increase in the distance from the cleavage plane (101) and the surface of the graded-band-gap layer (18) constituting the end facet.
摘要:
The invention relates to a semiconductor laser (1) comprising a semiconductor layer sequence (2) with an n-type n-region (21), a p-type p-region (23) and an active zone (22) lying between the two for the purpose of generating laser radiation. A p-contact layer (3) that is permeable to the laser radiation and consists of a transparent conductive oxide is located directly on the p-region (23) for the purpose of current input. An electrically-conductive metallic p-contact structure (4) is applied directly to the p-contact layer (3). The p-contact layer (3) is one part of a cover layer, and therefore the laser radiation penetrates as intended into the p-contact layer (3) during operation of the semi-conductor laser (1). Two facets (25) of the semiconductor layer sequence (2) form resonator end surfaces for the laser radiation. Current input into the p-region (23) is inhibited in at least one current protection region (5) directly on at least one of the facets (25). Said current protection region has, in the direction running perpendicularly to the associated facets (25), an extension of at least 0.5 µm and at most 100 µm, and additionally of at least 20% of a resonator length for the laser radiation.
摘要:
[Object] The present invention was conceived in light of the above problems, and it is an object thereof to provide a reliable and long-lasting semiconductor laser element with which heat generation near the cavity end face can be kept to a minimum even with high-output semiconductor laser elements, the COD level can be improved, and a good FFP shape can be obtained. [Means for Solving Problem] A semiconductor laser element, comprises: a laminate composed of a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer; and a second embedded layer that is in contact with the second conductivity type semiconductor layer, has a stripe-like groove parallel to the cavity direction, and is composed of an insulator, the groove is embedded with a first embedded layer composed of a dielectric on the cavity end face side, and with a conductive layer on the inside.