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    FLIP CHIP TYPE SAW BAND REJECT FILTER DESIGN
    1.
    发明公开
    FLIP CHIP TYPE SAW BAND REJECT FILTER DESIGN 审中-公开
    倒装芯片型锯带拒绝滤波器设计

    公开(公告)号：EP3285396A1

    公开(公告)日：2018-02-21

    申请号：EP17001436.9

    申请日：2014-01-16

    申请人： Telefonaktiebolaget LM Ericsson (PUBL)

    发明人： Jian, Chunyun

    IPC分类号： H03H9/02 ,  H03H9/64

    CPC分类号： H03H9/02992 ,  H03H3/02 ,  H03H9/25 ,  H03H9/64 ,  H03H9/6409

    摘要： A surface acoustic wave band reject filter (34) implemented as a flip chip assembly is presented. The surface acoustic wave band reject filter (34) comprises a substrate (24) including electrode bars (20) and bonding pads (36) formed on the substrate (24), and at least one die (26) having a side facing the substrate (24), a plurality of surface acoustic wave resonators (10) being formed on the at least one die (26), the at least one die (26) being mounted on the substrate (24), solder balls (22) in contact with the side of the at least one die (26) facing the substrate (24), the solder balls (22) being positioned to be in electrical contact with the electrode bars (20) and bonding pads (36) on the substrate (24), the plurality of surface acoustic wave resonators (10) being connected by the electrode bars (20) and bonding pads (36) via the solder balls (22) and collectively exhibiting a band reject filter response.
    According to a first arrangement, a first three of the plurality of the surface acoustic wave resonators (10) are arranged so that two of the plurality of surface acoustic wave resonators (10) are electrically in series, and a third surface acoustic wave resonator (10) is electrically in parallel to and between the two of the plurality of surface acoustic wave resonators (10).
    According to a second arrangement, a first three of the plurality of surface acoustic wave resonators (10) are arranged such that a first two surface acoustic wave resonators (10) are electrically in parallel, and a third surface acoustic wave resonator (10) is electrically intervening between the first two surface acoustic wave resonators (10).

    摘要翻译： 呈现了实现为倒装芯片组件的表面声波带阻滤波器（34）。 表面声波带阻滤波器（34）包括：包括形成在基板（24）上的电极条（20）和接合焊盘（36）的基板（24）;以及至少一个管芯（26） （24），在所述至少一个管芯（26）上形成有多个表面声波谐振器（10），所述至少一个管芯（26）安装在所述衬底（24）上，焊球（22） 其中至少一个管芯（26）的一侧面向衬底（24），焊球（22）被定位成与衬底（24）上的电极棒（20）和接合焊盘（36）电接触 ），多个声表面波谐振器（10）通过焊球（22）通过电极条（20）和键合焊盘（36）连接并共同表现出带阻滤波器响应。 根据第一种结构，多个弹性表面波谐振器（10）中的前三个弹性表面波谐振器（10）被布置成使得多个弹性表面波谐振器（10）中的两个电串联，并且第三弹性表面波谐振器 10）与所述多个弹性表面波谐振器（10）中的两个电气并联连接。 根据第二种布置，多个声表面波谐振器（10）中的前三个被布置为使得第一两个声表面波谐振器（10）电并联，并且第三声表面波谐振器（10）是 在前两个声表面波谐振器（10）之间插入电介质。

    BAND ELIMINATION FILTER
    2.
    发明公开
    BAND ELIMINATION FILTER 审中-公开
    BANDSPERRFILTER

    公开(公告)号：EP2299595A1

    公开(公告)日：2011-03-23

    申请号：EP09773100.4

    申请日：2009-05-21

    申请人： Murata Manufacturing Co. Ltd.

    发明人： NAKAHASHI, Norihiko ,  TANIGUCHI, Yasumasa

    IPC分类号： H03H9/64 ,  H01L41/09 ,  H01L41/18 ,  H03H9/25

    CPC分类号： H03H9/14594 ,  H03H9/6409 ,  H03H9/6483 ,  H03H9/6486 ,  H03H2007/013

    摘要： An inexpensive compact band rejection filter which realizes a high sharpness of a filter characteristic at ends of passbands and which has a large attenuation is provided. In the band rejection filter (1), at least one of elastic wave resonators which contributes to formation of a transition band has a propagation angle larger than those of the other elastic wave resonators. Accordingly, the at least one of the elastic wave resonators which contributes to the formation of the transition band has an electromechanical coupling coefficient smaller than electromechanical coupling coefficients of the other elastic wave resonator.

    摘要翻译： 提供了一种廉价的紧凑带阻滤波器，其实现了通带端部的滤波器特性的高锐度，并且具有大的衰减。 在带阻滤波器（1）中，有助于形成过渡频带的弹性波谐振器中的至少一个具有比其它弹性波谐振器大的传播角度。 因此，有助于形成过渡带的弹性波谐振器中的至少一个具有小于另一个弹性波谐振器的机电耦合系数的机电耦合系数。

    SAW FILTER
    4.
    发明公开
    SAW FILTER 有权
    AOW-FILTER

    公开(公告)号：EP1986320A1

    公开(公告)日：2008-10-29

    申请号：EP07706367.5

    申请日：2007-01-05

    申请人： Murata Manufacturing Co. Ltd.

    发明人： TANIGUCHI, Yasumawa

    IPC分类号： H03H9/64 ,  H03H9/145 ,  H03H9/25

    CPC分类号： H03H9/02559 ,  H03H9/02818 ,  H03H9/6409 ,  H03H9/6483 ,  H03H9/6493

    摘要： A SAW filter device includes a SAW filter chip in which one-port surface acoustic wave resonators each including an IDT made of Al or an Al alloy, are provided on a θ-rotated Y-cut X-propagation LiNbO 3 substrate. The cutting angle θ of the θ-rotated Y-cut X-propagation LiNbO 3 substrate is in the range between 50° and 55°. The normalized film thickness of the IDT 100h/λ (%) (h denotes the thickness of the IDT and λ denotes the wavelength of a surface acoustic wave) is in the range between 2% and 4%. The duty ratio of the IDT is equal to or less than 0.4.

    摘要翻译： SAW滤波器装置包括SAW滤波器芯片，其中在旋转Y切X传播LiNbO 3衬底上设置有包括由Al或Al合金制成的IDT的单端口声表面波谐振器。 ¸旋转Y切X传播LiNbO 3基板的切割角度¸在50°和55°之间的范围内。 IDT的标准化膜厚度100h /（％）（h表示IDT的厚度，表示声表面波的波长）表示在2％〜4％的范围内。 IDT的占空比等于或小于0.4。

    MINIATURE TUNABLE FILTERS
    7.
    发明公开
    MINIATURE TUNABLE FILTERS 审中-公开

    公开(公告)号：EP3403327A1

    公开(公告)日：2018-11-21

    申请号：EP16702001.5

    申请日：2016-01-15

    申请人： Telefonaktiebolaget LM Ericsson (publ.)

    发明人： JIAN, Chunyun

    IPC分类号： H03H9/56 ,  H03H9/60 ,  H03H9/64

    CPC分类号： H03H9/542 ,  H03H9/0004 ,  H03H9/52 ,  H03H9/568 ,  H03H9/605 ,  H03H9/6409 ,  H03H9/6483 ,  H03H2210/012 ,  H03H2210/025 ,  H03H2210/033

    摘要： A tunable filter using acoustic resonators is disclosed. A tunable filter includes a plurality of tunable resonator units (20). Each tunable resonator unit (20) has acoustic wave resonators (12). Each acoustic wave resonator is associated with a different tunable frequency. Each tunable resonator unit also has a first switch (22) configured to select one of the plurality of acoustic wave resonators of the tunable resonator unit at a time. The first switches of the plurality of tunable resonator units are coupled to cooperatively select one acoustic wave resonator in each one of the plurality of tunable resonator units, where a selected acoustic wave resonator in a tunable resonator unit of the plurality of tunable acoustic resonator units is associated with a same tunable frequency response as the other selected acoustic resonators of the others of the plurality of tunable acoustic resonator units. The selection results in an overall tunable frequency response.

    FLIP CHIP TYPE SAW BAND REJECT FILTER DESIGN
    9.
    发明公开
    FLIP CHIP TYPE SAW BAND REJECT FILTER DESIGN 有权
    设计精美的平板电脑

    公开(公告)号：EP2954614A1

    公开(公告)日：2015-12-16

    申请号：EP14716407.3

    申请日：2014-01-16

    申请人： Telefonaktiebolaget L M Ericsson (publ)

    发明人： JIAN, Chunyun

    IPC分类号： H03H9/02 ,  H03H9/64

    CPC分类号： H03H9/02992 ,  H03H3/02 ,  H03H9/25 ,  H03H9/64 ,  H03H9/6409

    摘要： A method and system for providing a surface acoustic wave band reject filter are disclosed. According to one aspect, a surface acoustic wave band reject filter (34) includes a substrate (24) having electrode bars and bonding pads (36) formed on the substrate (24). The filter (34) further includes at least one die (26) having a side facing the substrate (24). A plurality of surface acoustic wave resonators (10) are formed on the at least one die (26) formed on the substrate (24). Solder balls (22) formed on a side of the at least one die (26) facing the substrate (24) are positioned to engage bonding pads on the substrate. The plurality of surface acoustic wave resonators (10) collectively exhibit a band reject filter response.

    摘要翻译： 公开了一种用于提供表面声波阻带滤波器的方法和系统。 根据一个方面，一种声表面波阻带滤波器包括具有形成在基板上的电极棒和接合焊盘的基板。 该过滤器还包括至少一个具有面向衬底的一个模具。 在形成在基板上的至少一个模具上形成多个声表面波谐振器。 形成在面向衬底的至少一个裸片的一侧的焊球被定位成接合衬底上的接合焊盘。 多个表面声波谐振器共同呈现带阻滤波器响应。