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公开(公告)号:EP4359056A1
公开(公告)日:2024-05-01
申请号:EP22735572.4
申请日:2022-06-27
Applicant: CIPHERX TECHNOLOGIES LTD
Inventor: KOHLE, Ferdinand
CPC classification number: A61M2037/005320130101 , G03F7/0002 , A61M2037/004620130101 , A61M2037/006120130101 , A61M2037/002320130101 , B29C2033/009420130101 , B29C39/24 , B29C31/044 , B29C31/045 , B29C39/26 , B29L2031/754420130101 , B29L2031/75620130101 , A61M37/0015 , A61M37/0076
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公开(公告)号:EP3877132B1
公开(公告)日:2023-07-26
申请号:EP19797727.5
申请日:2019-11-05
Inventor: RODRIGUES, Jean, Paul , GUO, Ruijing , GAO, Sean , JEANTIN, Philippe , MALEIKA, Robert
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公开(公告)号:EP3438147B1
公开(公告)日:2023-06-21
申请号:EP17775214.4
申请日:2017-03-29
Inventor: ITO, Shinsuke , SUESUGI, Koji , FURUYA, Masayuki , NISHIMURA, Takeshi , TANAKA, Mamoru
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公开(公告)号:EP3703610B1
公开(公告)日:2022-08-10
申请号:EP18874477.5
申请日:2018-10-31
Inventor: BHAGAT, Sharad D. , SINGH, Vikramjit , PEROZ, Christophe , CHANG, Chieh
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公开(公告)号:EP4032676A1
公开(公告)日:2022-07-27
申请号:EP20866779.0
申请日:2020-09-16
Applicant: Mitsui Chemicals, Inc.
Inventor: ITO, Shinsuke , RIBEIRO, Nigel
Abstract: A method of manufacturing an optical member by curing a thermally polymerizable composition by heating includes, in the following order: a first step of filling an inside of a mold with the thermally polymerizable composition in which the mold is configured by disposing a frame-shaped member, with a Young's modulus of 1.0 GPa or more at a polymerization initiation temperature of the thermally polymerizable composition, between two mold members facing each other; and a second step of heating the mold to the polymerization initiation temperature or more.
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公开(公告)号:EP3930977A1
公开(公告)日:2022-01-05
申请号:EP19916654.7
申请日:2019-07-23
Applicant: SUNRISE SPC TECHNOLOGY, LLC
Inventor: TROENDLE, John B. , QIFENG, Mo
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公开(公告)号:EP3917744A1
公开(公告)日:2021-12-08
申请号:EP20701455.6
申请日:2020-01-21
Applicant: ATLAS ELEKTRONIK GmbH , thyssenkrupp AG
Inventor: MÜHRING, Kai , MIESBAUER, Matthias , SCHROER, Matthias , STUBBEN, Malte
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公开(公告)号:EP3877132A1
公开(公告)日:2021-09-15
申请号:EP19797727.5
申请日:2019-11-05
Applicant: Covestro Intellectual Property GmbH & Co. KG
Inventor: RODRIGUES, Jean, Paul , GUO, Ruijing , GAO, Sean , JEANTIN, Philippe , MALEIKA, Robert
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