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    METHOD FOR ADDITIVE MANUFACTURING ELECTRONICS AND A PRINTING SUPPORT FOR THE MANUFACTURING
    3.
    发明公开
    METHOD FOR ADDITIVE MANUFACTURING ELECTRONICS AND A PRINTING SUPPORT FOR THE MANUFACTURING 审中-实审

    公开(公告)号：EP4344855A1

    公开(公告)日：2024-04-03

    申请号：EP22198536.9

    申请日：2022-09-28

    申请人： HENSOLDT Sensors GmbH

    发明人： Sander, Jörg

    IPC分类号： B29C64/112 ,  B29C64/194 ,  B29C64/245 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02 ,  B33Y80/00 ,  H05K3/00

    摘要： A system for additive manufacturing of an electronic device (100) includes providing a printing support (200) with an electric circuitry (210) embedded in a dielectric encapsulation (220) and at least one supply terminal (230a, 230b) connected to the electric circuitry (210). The method further includes an additive printing the electronic device (100) on the printing support (200) by forming a conductive structure (110) embedded in a dielectric base material (120) and at least one device terminal (130a, 130b) exposed on a surface (105) of the electronic device (100), wherein the at least one supply terminal (230a. 230b) of the printing support (200) is arranged to electrically contact the at least one device terminal (130a, 130b). The method further includes applying electric signals from the at least one supply terminal (230a, 230b) to the at least on device terminal (130a, 130b) to measure an electric characteristic of the conductive structure (110) during the process of additive printing of the electronic device (100).

    EXTRUSION BASED ADDITIVE MANUFACTURING
    8.
    发明公开
    EXTRUSION BASED ADDITIVE MANUFACTURING 审中-公开

    公开(公告)号：EP4227070A1

    公开(公告)日：2023-08-16

    申请号：EP22156793.6

    申请日：2022-02-15

    申请人： Bond High Performance 3D Technology B.V.

    发明人： Kuiper-Hartman, Marloes Alexandra ,  Koopmans, Nienke ,  de Vries, Johannes Franciscus ,  Comelli, Cleiton André ,  Ghita, Oana Roxana ,  Davies, Richard Paul

    IPC分类号： B29C64/118 ,  B29C64/194 ,  B33Y10/00 ,  B33Y30/00

    摘要： An additive manufacturing method for wherein tracks of modelling material are deposited in slices by means of a printhead (2) inside a heatable build room. A semi-crystalline modelling material is deposited through a nozzle of the printhead on a build base (5) or on the tracks of a previously deposited slice, whereby a body is formed by depositing the modelling material slice by slice. The crystallinity (%) of the modelling material of said previously deposited slice is above a remaining crystallinity threshold. The crystallinity, at least at a region where a new track is deposited by the printhead on said previously deposited slice, and within a time range of 0-5 sec. after the new track is deposited, is controlled such that said crystallinity by default is going below said remaining crystallinity threshold and such that it selectively is maintained above said remaining crystallinity threshold. Alternatively, the crystallinity, at least at a region where a new track is deposited by the printhead on said previously deposited slice, and within a time range of 0-5 sec. after the new track is deposited, is controlled such that said crystallinity is by default remains above said remaining crystallinity threshold and such that it selectively goes below said remaining crystallinity threshold. The crystallinity being controlled by at least one of the following: controlling the build room temperature; controlling the temperature of the nozzle of the printhead; selectively and locally cooling or heating the object at said region where the next track is deposited.