ADHESIVE RESIN COMPOSITION
    3.
    发明公开

    公开(公告)号:EP4406867A1

    公开(公告)日:2024-07-31

    申请号:EP22872726.9

    申请日:2022-09-08

    摘要: An adhesive resin composition according to the present invention is characterized by containing a polyester resin (A) and satisfying: (i) The adhesive resin composition contains substantially no curing agent; and (ii) The adhesive resin composition exhibits an amount of tetrahydrofuran-insoluble matter of 10 mass% or more when having undergone a heating treatment at 200°C for 1 hour. The adhesive resin composition according to the present invention, even with use of substantially no curing agent, has good pot life property, and has excellent solder heat resistance and adhesiveness to various base materials. The present invention also provides a laminate or an adhesive sheet including an adhesive layer made from the adhesive resin composition, a printed-wiring board or a packing material comprising the laminate as a constituent element, and a laminated film for decorating three-dimensional molded article or a film for laminating metal can comprising the adhesive sheet as a constituent element.