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1.发明授权
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2.发明授权
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公开(公告)号：EP4350054A3
公开(公告)日：2024-06-19
申请号：EP23194890.2
申请日：2023-09-01
摘要： An electroplating shield device, methods of fabricating the same, and methods of electroplating with the electroplating shield device are disclosed herein. The method of electroplating includes positioning an object in an electroplating shield device. The electroplating shield device may include a conduit configured to receive the object and a plurality of openings selectively extended between inner and outer surfaces of the conduit. The openings may be positioned between first and second ends of the conduit. The method may also include forming a layer on the object by transferring fluid through the plurality of openings to at least one of a first continuous section of the object comprising a minor of the object and a second continuous section of the object comprising a major of the object. A ratio of a thickness of the major to the minor after forming the layer may range from approximately 1: 1 to approximately 1:18.
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公开(公告)号：EP4043618B1
公开(公告)日：2024-06-19
申请号：EP22167592.9
申请日：2020-01-21
CPC分类号： C25D17/06 , C25D17/001 , C25D17/004 , C25D17/005
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公开(公告)号：EP4361321A1
公开(公告)日：2024-05-01
申请号：EP22827369.4
申请日：2022-06-06
发明人： WANG, Hui , WANG, Jian , JIA, Zhaowei , WANG, Jun , HU, Yulu
IPC分类号： C25D17/00
摘要： The present invention disclosed an electroplating apparatus for non-circular substrate, comprising a central electrode area, a peripheral electrode area, a power supply unit and a control device. The size of the central electrode area is the inscribed circle of the non-circular substrate, and the central electrode is arranged in the central electrode area. The peripheral electrode area surrounds the central electrode area. The peripheral size of the peripheral electrode area is the circumscribed circle of the non-circular substrate. The peripheral electrode area is provided with closely arranged point electrodes, and the point electrodes fill the peripheral electrode area. The power supply unit supply power to the central electrode and the point electrodes. The control device is connected between the power supply unit, the central electrode and the point electrodes and controls the on-off of the central electrode and the point electrodes. The control device tracks the rotating position of the substrate, so that the electrodes in the central electrode area and the peripheral electrode area covered by the substrate will be turned on and the electrodes not covered by the substrate will be turned off. The present invention also disclosed an electroplating method for the non-circular substrate.
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公开(公告)号：EP4361315A1
公开(公告)日：2024-05-01
申请号：EP23156461.8
申请日：2023-02-14
发明人： KIM, Sang Wook , KIM, Sang Soo , PARK, Mi Jung , KIM, Ju A , LEE, Ji Hyun
IPC分类号： C23G1/18 , C23G1/20 , C23G1/26 , C25C1/18 , C25C5/02 , C25C7/08 , C25D1/04 , C25C1/12 , C25C7/02 , C25C7/06 , C25D17/10 , C25B11/00 , C23G1/36 , C11D11/00 , C22B3/00 , C23G1/24
CPC分类号： C25C7/08 , C25C5/02 , C25D1/04 , C23G1/18 , C23G1/20 , C23G1/26 , C25C1/12 , C25C7/02 , C25C7/06 , C25B11/00 , C23G1/36 , C22B13/045 , C25C1/18 , C23G1/24 , C11D7/265 , C11D7/3245 , C11D2111/2020240101
摘要： Disclosed is a method of removing lead materials from an anode for manufacturing copper foil to regenerate the anode. The method includes cleaning solution preparation, anode cleaning and anode washing. The cleaning solution preparation includes preparing a cleaning solution containing an aqueous solution of EDTA and citric acid. The cleaning solution used to perform the anode cleaning has a pH of 7 to 9 and a temperature of 20 to 50°C. The anode cleaning includes cleaning the anode by immersing the anode including the lead materials attached to the surface thereof in the cleaning solution to perform EDTA-Pb chelation. As a result, the transfer of the lead materials from the anode to the cleaning solution means substantial removal of the lead materials from the anode. The anode, from which the lead materials have been removed, is washed using a high-pressure washer.
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公开(公告)号：EP4350054A2
公开(公告)日：2024-04-10
申请号：EP23194890.2
申请日：2023-09-01
摘要： An electroplating shield device, methods of fabricating the same, and methods of electroplating with the electroplating shield device are disclosed herein. The method of electroplating includes positioning an object in an electroplating shield device. The electroplating shield device may include a conduit configured to receive the object and a plurality of openings selectively extended between inner and outer surfaces of the conduit. The openings may be positioned between first and second ends of the conduit. The method may also include forming a layer on the object by transferring fluid through the plurality of openings to at least one of a first continuous section of the object comprising a minor of the object and a second continuous section of the object comprising a major of the object. A ratio of a thickness of the major to the minor after forming the layer may range from approximately 1: 1 to approximately 1:18.
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9.发明公开
公开(公告)号：EP4341464A1
公开(公告)日：2024-03-27
申请号：EP22730434.2
申请日：2022-05-23
发明人： DRESCHER, Johannes , SCHMITZ, Sarah
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10.发明公开
公开(公告)号：EP4332277A1
公开(公告)日：2024-03-06
申请号：EP22192691.8
申请日：2022-08-29
发明人： Schirmer, Christian , Schafsteller, Britta , Weinhold, Ray , Kiehl, Markus , Jang, Don , Lorenz, Olaf , Gaul, Florian
IPC分类号： C25D17/06 , C23G3/02 , H01L21/687 , B08B3/04 , B05C5/00
摘要： A device for holding a planar substrate (1) in an apparatus for non-immersive wet-chemical treatment of the substrate (1) comprises a support structure (34). The support structure (34) comprises at least one part (36a,b) for engaging a support such as to suspend the support structure (34) in the apparatus. The device comprises at least one clamping device, supported by the support structure (34), for holding the substrate (1) in a plane; and at least a first upper flow guidance part (37), arranged on one side of the plane and having an inward-facing surface (44) facing inwards and an outward-facing surface facing outwards with respect to the plane. The outward-facing surface comprises an upper outward-facing surface section (46), wettable by a stream of liquid directed onto the upper outward-facing surface section (46), and a lower outward-facing surface section (47), extending from a transition between at least a central part of the upper outward-facing surface section (46) and the lower outward-facing surface section (47) to a lower edge (49). A strip (45) of the inward-facing surface extends longitudinally along the lower edge (49) and transversely up to the lower edge (49). At least a central longitudinal section of the strip (45) is movable into engagement with a major surface of the substrate (1) over an entire length of that section.
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