SUBMODULE FOR SINGLE PACKAGING TYPE SEMICONDUCTOR TRANSFORMER WITH REDUCED PARTIAL DISCHARGE AND EXCELLENT INSULATION PERFORMANCE

    公开(公告)号:EP4510437A1

    公开(公告)日:2025-02-19

    申请号:EP22937576.1

    申请日:2022-11-22

    Abstract: The present invention relates to a submodule for a semiconductor transformer in single packaging with reduced partial discharge quantity and excellent insulation performance that is capable of applying an equipotential structure for each stage of the submodule for the semiconductor transformer to further improve insulation performance by reducing partial discharge quantity in the semiconductor transformer while improving insulation performance by securing separation distance between a high voltage unit and a low voltage unit in the semiconductor transformer.
    The submodule for semiconductor transformer in single packaging with reduced partial discharge quantity and excellent insulation performance in the present invention comprises: a high voltage unit for converting high-voltage low-frequency AC power into high-frequency AC power; a transforming unit for converting the high-voltage AC power into low-voltage AC power; and a low voltage unit for converting the low-voltage AC power into low-voltage DC power.

    CONVERTER AND METHOD OF TRANSFERRING POWER FROM A MEDIUM VOLTAGE SIDE TO A LOW VOLTAGE SIDE IN A CONVERTER

    公开(公告)号:EP4489285A1

    公开(公告)日:2025-01-08

    申请号:EP23183646.1

    申请日:2023-07-05

    Abstract: A converter including at least one DC/AC stage configured for generating a medium frequency AC power and having first and second AC outputs for the medium frequency AC power, at least one AC/DC stage configured for generating a DC power from the medium frequency AC power and having first and second AC inputs for the medium frequency AC power, and a resonant circuit provided between the DC/AC stage and the AC/DC stage and configured for transferring the medium frequency AC power. The resonant circuit includes at least two capacitors including a first capacitor and a second capacitor. The first capacitor is connected between the first AC output and the first AC input, and the second capacitor is connected between the second AC output and the second AC input. The resonant circuit further includes at least two inductors including a first inductor and a second inductor connected in series and defining a connection point between the two inductors. In a first alternative, the first inductor is connected in series between the first capacitor and the first AC input, and the second inductor is connected in series between the first AC input and the second AC input. In a second alternative, the first inductor is connected in series between the first capacitor and the first AC output, and the second inductor is connected in series between the first AC output and the second AC output. The at least two capacitors provide galvanic insulation between the DC/AC stage and the AC/DC stage.

    POWER SUPPLY APPARATUS
    4.
    发明公开

    公开(公告)号:EP4482009A1

    公开(公告)日:2024-12-25

    申请号:EP24175446.4

    申请日:2024-05-13

    Abstract: A power supply apparatus (1) includes a power factor correction circuit (2), an LLC converter (3), an auxiliary conversion circuit (4), a secondary side controller (5) and a voltage tracking circuit (6). The power factor correction circuit (2) is used for converting a DC link voltage into a first voltage. The LLC converter (3) includes a primary side circuit (30) and a secondary side circuit (31), which are coupled with each other. The primary side circuit (30) receives the first voltage. The first voltage is converted into an auxiliary voltage by the auxiliary conversion circuit (4). The voltage tracking circuit (6) detects the auxiliary voltage and issues a detection signal to the secondary side controller (5). The secondary side controller (5) tracks a ripple change of the DC link voltage and instantly generates a reverse waveform opposite to a waveform of the DC link voltage. The secondary side controller (5) controls the operations of the LLC converter (3) according to the reverse waveform.

    TRANSFORMER AND POWER SUPPLY USING SAME
    5.
    发明公开

    公开(公告)号:EP4478386A1

    公开(公告)日:2024-12-18

    申请号:EP22926230.8

    申请日:2022-12-27

    Abstract: A power supply according to an embodiment comprises: a substrate; a switching unit disposed on the substrate and alternately switching input direct current power so as to convert same into alternating current power; a transformer disposed on the substrate and converting the level of the alternating current power; a rectifying unit disposed on a substrate and rectifying the alternating current power having the level converted by the transformer; and an output inductor disposed adjacent to the transformer and having one end connected to the transformer, wherein a plurality of terminals included in the transformer include first and third terminals, a second terminal located between the first terminal and the third terminal, and an additional terminal extending from the second terminal to the outside of the first or third terminal, and the one end of the output inductor is connected to the additional terminal of the transformer.

    CHARGING APPARATUS AND CHARGING DEVICE
    6.
    发明公开

    公开(公告)号:EP4477457A1

    公开(公告)日:2024-12-18

    申请号:EP24178766.2

    申请日:2024-05-29

    Abstract: This application provides a charging apparatus and a charging device. The charging apparatus includes a plurality of alternating current to direct current conversion AC-DC modules, a plurality of direct current to direct current conversion DC-DC modules, and a power allocation board. The AC-DC module is configured to convert an alternating current into a direct current. The DC-DC module is configured to perform voltage conversion on the direct current output by the AC-DC module. The DC-DC module includes first output ports. The power allocation board includes input terminals, a plurality of switches, and a plurality of second output ports. The plurality of switches are configured to allocate an output power of at least one DC-DC module to at least one of the second output ports. The first output port of the DC-DC module is configured to be in a plug-in connection to the input terminal of the power allocation board. The first output ports are in the plug-in connection to the input terminals, so that an output power of the DC-DC module can be transmitted to the power allocation board. This can avoid wiring between the power allocation board and a conversion unit, and safety is high.

    SEMICONDUCTOR TRANSFORMER AND MODULAR HIGH-VOLTAGE POWER DEVICE

    公开(公告)号:EP4472051A1

    公开(公告)日:2024-12-04

    申请号:EP23747324.4

    申请日:2023-01-26

    Abstract: A semiconductor transformer according to one embodiment of the present invention comprises a plurality of semiconductor transformer modules for transforming power, wherein each of the semiconductor transformer modules comprises: a high-voltage unit for transforming low-frequency AC power into high-frequency AC power; a transformation unit for transforming the transformed high-frequency AC power to high-frequency low-voltage AC power; and a low-voltage unit for transforming the transformed high-frequency low-voltage AC power to low-voltage DC power, the high-voltage unit is provided inside a housing made of a conductive material, and the housing has a ground line connected to one from among circuit lines of the high-voltage unit.

    PFC-NETZSCHALTUNG
    9.
    发明公开
    PFC-NETZSCHALTUNG 审中-公开

    公开(公告)号:EP4462660A1

    公开(公告)日:2024-11-13

    申请号:EP24174922.5

    申请日:2024-05-08

    Inventor: Fesseler, Aaron

    Abstract: PFC-Netzschaltung mit Halbbrücke und ein Verfahren zur Wandlung einer Netzwechselspannung in sowohl eine niedrigere als auch eine höhere Ausgangsgleichspannung unter Einhaltung von PFC-Normen, wobei die PFC-Netzschaltung drei Phasen, einen Gleichrichter umfassend drei Eingänge, einen ersten und einen zweiten Transistor, welcher von einer Steuereinheit angesteuert wird, einen Mittelpunkt, welcher eingerichtet ist zwischen dem ersten und dem zweiten Transistor, einen Sternpunkt, umfassend drei Sternkondensatoren und einen Kondensator, verbunden mit dem Mittelpunkt und einem Bezugspotential, welches entweder das Nullpotential der Netzschaltung oder der Sternpunk der Sternkondensatoren sein kann, umfasst. Die Netzschaltung umfasst ferner einen Ausgangskondensator, eine Ausgangsspule, eine Diode und einen Strangkondensator, wobei der Ausgangskondensator die Ausgangsspule, die Diode und der Strangkondensator an einem Ausgangsbereich der Netzschaltung bereitgestellt sind. Der Kondensator ist ausgestaltet, um durch ein gezieltes Laden und Entladen über das Ansteuern des ersten und zweiten Transistors als einstellbare Spannungsquelle zu dienen und eine Spannungsdifferenz an den drei Speicherdrosseln einzustellen, um PFC-Normen zu erfüllen. Die Steuereinheit ist eingerichtet, um den ersten Transistor und den zweiten Transistor so anzusteuern, dass eine Netzwechselspannung in eine hochgesetzte oder tiefgesetzte Ausgangsgleichspannung in Abhängigkeit einer Polarität von Strangspannungen gewandelt wird. Das Ansteuern des ersten und zweiten Transistors erfolgt durch die Steuereinheit mittels positiver und negativer Ansteuerung.

    INTEGRATING INPUT AND OUTPUT CAPACITANCE WITH HIGH FREQUENCY SHUNT CAPACITANCE ON A SINGLE ADDITIVELY MANUFACTURED SUBSTRATE

    公开(公告)号:EP4447108A1

    公开(公告)日:2024-10-16

    申请号:EP24168992.6

    申请日:2024-04-08

    Abstract: A package is described. The package includes a die (104) covered by a lid (106). The lid maintains a hermetic seal for the die. The package includes high frequency shunt capacitance in parallel with surface-mount capacitors. The high frequency shunt capacitance is formed by interdigital capacitors (118) below the surface-mount capacitors (122). The interdigital capacitors, the surface-mount capacitors, and the die form a circuit which produces a stable output voltage. The output voltage may remain stable even when subject to noise due to energized particles in space. The package includes solder resist with openings for attaching the surface-mount capacitors to the interdigital capacitors. Advantageously, the interdigital capacitors may achieve high frequency shunt capacitance on the order of nano-farads as part of the frame geometry with minimal increase in package height.

Patent Agency Ranking