METHACRYLIC RESIN COMPOSITION AND MOLDED BODY

    公开(公告)号:EP4198085A1

    公开(公告)日:2023-06-21

    申请号:EP21855965.6

    申请日:2021-08-10

    发明人: TSUJIMOTO Katsura

    摘要: The present disclosure is directed to providing a methacrylic resin composition and a molded article having excellent performances to allow light to be favorably transmitted and sufficiently diffused, and having good heat deformation resistance and long-term use property. A methacrylic resin composition includes 0.5 to 6 parts by mass of a light diffusing filler having an average particle diameter of 0.2 to 10 µm and 0.005 to 0.3 parts by mass of an ultraviolet absorber with respect to 100 parts by mass of a methacrylic resin, and has an intermediate point glass transition temperature of 105 °C or higher.